Abstract: The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

Abstract: The present invention relates to a substrate for an optical device, to an optical device package comprising the same and to a production method for the same. According to the present invention, the substrate for an optical device, the optical device package comprising the same and the production method for the same may comprise: a metal substrate; a first anodized layer which is formed on the top surface of the metal substrate and insulates the metal substrate; and a first and a second electrode formed insulated from each other on the top of the first anodized layer.