Abstract: Provided are a semiconductor device and a method of forming the semiconductor device. The semiconductor substrate includes a cell region, a peripheral region, and a boundary region between the cell region and the peripheral region; a plurality of device isolation patterns defining the cell region, the peripheral region, and the boundary region; a plurality of floating gate patterns on the cell region; a gate pattern on the peripheral region; and a residual conductive pattern on the device isolation patterns defining the boundary region, wherein the residual conductive pattern is separated from an outermost one of the floating gate patterns by a distance from about 0.5 times to about 2 times a distance at which the floating gate patterns repeat.