Abstract: A protective sheet for a solar cell module prepared by forming an acrylic urethane resin layer on one surface or both surfaces of a base sheet. The acrylic urethane resin layer is preferably formed on the opposite surface of the base sheet to the surface that contacts an encapsulant.

Abstract: The protective sheet for solar cell module of the present invention includes a substrate film and a heat bondable layer laminated on one side of the substrate film, wherein the heat bondable layer is formed from a resin material containing an olefin-based polymer that includes a (meth)acrylate unit having a glycidyl group, and serves as an adhesive layer to be used for bonding with a encapsulant that constitutes the solar cell module.

Abstract: To produce a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated through through-holes, and yet the through-holes are not readily visible at a substrate surface, a pressure-sensitive adhesive surface of a pressure-sensitive adhesive layer 12 in a laminate comprising a substrate 11 and the pressure-sensitive adhesive layer 12 is irradiated with a CO2 laser having a pulse width of from 1 to 140 ?sec, a pulse energy at each processing point of from 0.01 to 3.0 mJ, and a beam spot diameter at each processing point of from 30 to 160 ?m, so as to form through-holes 2 having a diameter at the surface of the substrate 11 of from 0.1 to 42 ?m at a hole density of from 30 to 50,000 per 100 cm2.

Abstract: A pressure-sensitive adhesive layer 3 is formed on a release treated surface of a release liner 4, and gas from holes 40 in the release liner 4 is made to move to the outside of the pressure-sensitive adhesive layer 3, thus forming through holes 31 in the pressure-sensitive adhesive layer 3. The pressure-sensitive adhesive layer 3 and a base material 2 having provided therein gas-passing channels that communicate to the outside of the pressure-sensitive adhesive sheet are then laminated together such that the gas-passing channels in the base material 2 and the through holes 31 in the pressure-sensitive adhesive layer 3 communicate with one another, thus obtaining a pressure-sensitive adhesive sheet 1. According to the pressure-sensitive adhesive sheet 1, air entrapment and blistering can be prevented or eliminated while securing adequate adhesive strength and with no marring of the appearance.

Abstract: A pressure sensitive adhesive sheet which comprises a substrate sheet (1) and a pressure sensitive adhesive layer (2) disposed at least on one face of the substrate sheet, wherein the pressure sensitive adhesive layer (2) has a structure such that (a) on a surface of the substrate sheet (1) directly or on a pressure sensitive adhesive base layer (2a) having a prescribed thickness which is formed on a surface of the substrate sheet, a plurality of stripe-shaped protrusions (2b) are formed in parallel at a prescribed distance continuously from one end portion to the other end portion of the substrate sheet (1), and (b) a plurality of independent discontinuous protrusions (2c, 2c-1, 2c-2, 2c-3) are disposed in the form of islands between adjacent stripe-shaped protrusions (2b). The pressure sensitive adhesive sheet enables to easily remove the trapped air formed during application of the sheet and exhibits excellent appearance and adhesive strength.

Abstract: To provide a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated via through-holes, and yet the appearance compares favorably with that of a pressure-sensitive adhesive sheet having no through-holes therein, as a substrate 11 there is used one having a surface roughness (Ra) of not less than 0.03 ?m, a lightness (L*) in the L*a*b* color system of not more than 60 in the case of having a chroma (C*) of not more than 60 and a lightness (L*) of not more than 85 in the case of having a chroma (C*) greater than 60, and a contrast ratio of not less than 90%, through-holes 2 passing through the substrate 11 and a pressure-sensitive adhesive layer 12 are made to have a diameter in the substrate 11 and the pressure-sensitive adhesive layer 12 of from 0.1 to 200 ?m, a diameter at a surface of the substrate 11 of from 0.

Abstract: The present invention relates to a pressure sensitive adhesive sheet 1 comprising a base material 11 and a pressure sensitive adhesive layer 12 wherein a plurality of through holes 2 passing through one face of the pressure sensitive adhesive sheet 1 to the other face are formed. The hole diameter of the through holes 2 is 0.1 to 300 ?m and the hole density is 30 to 50,000/100 cm2. It is preferable to form the through holes 2 using a laser beam machining. According the pressure sensitive adhesive sheet 1, an air trapping or a blister can be prevented or removed without disfiguring the pressure sensitive adhesive sheet and while securing a sufficient adhesive strength.

Abstract: A pressure sensitive adhesive sheet 1 comprises a base material 11 and a pressure sensitive adhesive layer 12, and has a plurality of through-holes 2 formed therein passing through one face to another face, such that the hole diameter of the through-holes 2 on the surface of the base material 11 is 0.1 to 42 ?m, the outer diameter of a recess 21 at the peripheral edge of the through-holes 2 on the surface of the base material 11 is not greater than 60 ?m, and the modulus of elasticity in tension of the base material 11 is 190 to 600 MPa. The through-holes of the pressure sensitive adhesive sheet 1 allow preventing or eliminating an air trapping and a blister, while the pressure sensitive adhesive sheet 1 exhibits good appearance, with the through-holes being invisible to the naked eye, even when the pressure sensitive adhesive sheet 1 is stretched.

Abstract: In a pressure-sensitive adhesive sheet 1 that comprises a base material 11 and a pressure-sensitive adhesive layer 12, and has formed therein by thermal processing a plurality of through holes 2 passing through one surface to the other surface of the pressure-sensitive adhesive sheet 1, as the base material 11, one is used for which, upon heating at a heating rate of 20° C./min under a nitrogen atmosphere, the temperature at a thermal decomposition peak where the mass reduction is greatest is not more than 450° C., or the difference between the temperature at the thermal decomposition peak and the temperature at a melting peak is not more than 250° C. According to this pressure-sensitive adhesive sheet 1, the appearance of the pressure-sensitive adhesive sheet 1 is not marred by the through holes 2 formed by the thermal processing.

Abstract: A pressure-sensitive adhesive sheet for automobile marking comprising a substrate 11 and a pressure-sensitive adhesive layer 12, wherein the substrate 11 has a storage elastic modulus at 60 to 80° C. of 7.0×101 MPa or more, and preferably a storage elastic modulus at 5 to 10° C. of 1.0×102 to 1.0×103 MPa. As a result there can be obtained a pressure-sensitive adhesive sheet for automobile marking that allows preventing blistering even when used at high temperatures of about 60 to 80° C., without restrictions regarding a pressure-sensitive adhesive composition, and with no need for a primer to be applied to an adherend.

Abstract: A pressure-sensitive adhesive layer 3 is formed on a release treated surface of a release liner 4, and gas from holes 40 in the release liner 4 is made to move to the outside of the pressure-sensitive adhesive layer 3, thus forming through holes 31 in the pressure-sensitive adhesive layer 3. The pressure-sensitive adhesive layer 3 and a base material 2 having provided therein gas-passing channels that communicate to the outside of the pressure-sensitive adhesive sheet are then laminated together such that the gas-passing channels in the base material 2 and the through holes 31 in the pressure-sensitive adhesive layer 3 communicate with one another, thus obtaining a pressure-sensitive adhesive sheet 1. According to the pressure-sensitive adhesive sheet 1, air entrapment and blistering can be prevented or eliminated while securing adequate adhesive strength and with no marring of the appearance.

Abstract: To provide a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated via through-holes, and yet the appearance compares favorably with that of a pressure-sensitive adhesive sheet having no through-holes therein, as a substrate 11 there is used one having a surface roughness (Ra) of not less than 0.03 ?m, a lightness (L*) in the L*a*b* color system of not more than 60 in the case of having a chroma (C*) of not more than 60 and a lightness (L*) of not more than 85 in the case of having a chroma (C*) greater than 60, and a contrast ratio of not less than 90%, through-holes 2 passing through the substrate 11 and a pressure-sensitive adhesive layer 12 are made to have a diameter in the substrate 11 and the pressure-sensitive adhesive layer 12 of from 0.1 to 200 ?m, a diameter at a surface of the substrate 11 of from 0.

Abstract: To provide a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated through through-holes, and yet the through-holes are not readily visible at the substrate surface, and moreover a good appearance can be maintained even under an environment in which liquid becomes attached after the pressure-sensitive adhesive sheet has been stuck on, in a pressure-sensitive adhesive sheet 1 comprising a substrate 11 and a pressure-sensitive adhesive layer 12, a plurality of through-holes 2 passing through from one surface to the other surface of the pressure-sensitive adhesive sheet 1 are formed through laser processing, and here the through-holes 2 are made to have a diameter at a surface of the substrate 11 of from 0.1 to 42 ?m, the through-holes 2 are made to have a diameter at a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer 12 of from 0.

Abstract: A pressure-sensitive adhesive sheet 1 comprising a base material 11 and a pressure-sensitive adhesive layer 12 has formed therein a plurality of through holes 2 passing through from one surface to the other surface thereof. The through holes 2 have a diameter in a range of 0.1 to 300 ?m, and a hole density in a range of 30 to 50,000 per 100 cm2. Moreover, the pressure-sensitive adhesive layer 12 has a storage modulus at Tmax (the maximum temperature to which the pressure-sensitive adhesive sheet 1 may be exposed after having been stuck onto an adherend) of not less than 4.5×103 Pa, and a loss tangent at Tmax of not more than 0.78. According to the pressure-sensitive adhesive sheet 1, air entrapment and blistering can be prevented or eliminated while securing adequate adhesive strength and with no marring of the appearance, and furthermore air escaping ability is excellent even after being exposed to high temperature after having been stuck onto the adherend.

Abstract: To produce a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated through through-holes, and yet the through-holes are not readily visible at a substrate surface, a sure-sensitive adhesive surface of a pressure-sensitive adhesive layer 12 in a laminate comprising a substrate 11 and the pressure-sensitive adhesive layer 12 is irradiated with a CO2 laser having a pulse width of from 1 to 140 ?sec, a pulse energy at each processing point of from 0.01 to 3.0 mJ, and a beam spot diameter at each processing point of from 30 to 160 ?m, so as to form through-holes 2 having a diameter at the surface of the substrate 11 of from 0.1 to 42 ?m at a hole density of from 30 to 50,000 per 100 cm2.

Abstract: Provided is a pressure-sensitive adhesive sheet comprising a substrate sheet and provided thereon an adhesive layer, wherein taper type concave grooves which are opened to an end edge part of the pressure-sensitive adhesive sheet and which are expanded toward a surface direction of the adhesive layer are provided in the adhesive layer in the form of plural parallel straight or curved belts, a lattice or an oblique lattice, and through holes having a diameter of 0.1 to 100 ?m on the surface of the substrate sheet which pass through one face of the pressure-sensitive adhesive sheet to the other face thereof are provided in the substrate sheet and the adhesive layer at a density of 10 to 10000 holes/100 cm2.

Abstract: A substrate 2 having provided in a pressure-sensitive adhesive layer 3 side thereof recesses 21 that continue as far as side edges of the substrate 2, and a pressure-sensitive adhesive layer 3 in which are formed a plurality of penetrating passages 31 that penetrate through the pressure-sensitive adhesive layer 3 in a thickness direction are laminated together such that the recesses 21 in the substrate 2 and the penetrating passages 31 in the pressure-sensitive adhesive layer 3 communicate with one another, thus obtaining a pressure-sensitive adhesive sheet 1. According to this pressure-sensitive adhesive sheet 1, air entrapment and blistering can be prevented or eliminated while securing adequate adhesive strength and with no marring of the appearance of the pressure-sensitive adhesive sheet.

Abstract: A pressure-sensitive adhesive sheet 1 comprising a base material 11 and a pressure-sensitive adhesive layer 12 has formed therein a plurality of through holes 2 that pass through from one surface to the other surface thereof. The through holes 2 have a diameter in a range of 0.1 to 300 ?m, and a hole density in a range of 30 to 50,000 per 100 cm2. Moreover, the pressure-sensitive adhesive layer 12 has a storage modulus at 70 ° C. of not less than 9×103 Pa, and a loss tangent at 70° C. of not more than 0.55. According to the pressure-sensitive adhesive sheet 1, air escaping ability is not impaired even upon being subjected to very high pressure, or pressure and heat, during storage, transportation or the like, and hence air entrapment and blistering can be prevented or eliminated stably.

Abstract: The present invention relates to a pressure sensitive adhesive sheet 1 comprising a base material 11 and a pressure sensitive adhesive layer 12 wherein a plurality of through holes 2 passing through one face of the pressure sensitive adhesive sheet 1 to the other face are formed. The hole diameter of the through holes 2 is 0.1 to 300 ?m and the hole density is 30 to 50,000/100 cm2. It is preferable to form the through holes 2 using a laser beam machining. According the pressure sensitive adhesive sheet 1, an air trapping or a blister can be prevented or removed without disfiguring the pressure sensitive adhesive sheet and while securing a sufficient adhesive strength.

Abstract: An energy beam curable hydrophilic pressure sensitive adhesive composition includes a polymer (A) having an energy beam polymerizable group and an acid group and a neutralizer (B). Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided. The wafer surface protective sheet protects a circuit pattern formed on a wafer surface from grinding dust, etc. at the time of grinding the back of the wafer. The pressure sensitive adhesive composition can easily be removed by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.