Patents by Inventor Kiichiro Kato

Kiichiro Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensitive adhesive sheet and use thereof
    Patent number: 6255423
    Abstract: A pressure sensitive adhesive composition comprising: (A) a carboxyl group containing copolymer obtained by solution polymerization of (a) a carboxyl group containing polymerizable monomer and (b) another monomer copolymerizable with the monomer (a); (B) a neutralizer; and (C) a crosslinking agent. This pressure sensitive adhesive composition is suitable for use in a wafer surface protective sheet employed for protecting a circuit pattern formed on a wafer surface from cutting debris, etc. at the time of polishing the back of the wafer. When this pressure sensitive adhesive composition is used, not only is the voltage of peel electrification extremely low at the time of stripping of the pressure sensitive adhesive sheet but also, even if the pressure sensitive adhesive remains on the wafer surface, the residual pressure sensitive adhesive can easily be removed by washing with water.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: July 3, 2001
    Assignee: Lintec Corporation
    Inventors: Kiichiro Kato, Takeshi Kondoh, Kazuhiro Takahashi
  • Pressure sensitive adhesive composition and use thereof
    Patent number: 6180742
    Abstract: A pressure sensitive adhesive composition comprising: (A) a carboxyl group containing copolymer obtained by solution polymerization of (a) a carboxyl group containing polymerizable monomer and (b) another monomer copolymerizable with the monomer (a); (B) a neutralizer; and (C) a crosslinking agent. This pressure sensitive adhesive composition is suitable for use in a wafer surface protective sheet employed for protecting a circuit pattern formed on a wafer surface from cutting debris, etc. at the time of polishing the back of the wafer. When this pressure sensitive adhesive composition is used, not only is the voltage of peel electrification extremely low at the time of stripping of the pressure sensitive adhesive sheet but also, even if the pressure sensitive adhesive remains on the wafer surface, the residual pressure sensitive adhesive can easily be removed by washing with water.
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: January 30, 2001
    Assignee: Lintec Corporation
    Inventors: Kiichiro Kato, Takeshi Kondoh, Kazuhiro Takahashi
  • Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
    Patent number: 6040048
    Abstract: An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided, which enables easy removal of any residual pressure sensitive adhesive by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: March 21, 2000
    Assignee: Lintec Corporation
    Inventors: Kiichiro Kato, Takeshi Kondoh, Katsuhisa Taguchi, Kazuhiro Takahashi