Abstract: A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes. Conductive plates are disposed on the current electrodes, and conductive wires used for an external connection of the device are fixed on the conductive plates, but not directly on the current passing electrode. A large plate is first fixed on the semiconductor chip, and then the back surface of the large plate is removed to form the individual conductive plates. Because the conductive wires are soldered onto the conductive plates, the semiconductor chip does not receive impact of wire bonding. Even when the conductive wires are wire bonded to the conductive plates, the plates may serve as shock absorbers during wire bonding procedure to reduce the impact of the wire bonding.

Abstract: A semiconductor device includes a power supply semiconductor chip that has a current passing electrode. A conductive plate is disposed on the current electrode, and a conductive wire that is used for an external connection of the device is fixed on the conductive plate, but not directly on the current passing electrode. The conductive plate may serve as a shock absorber during wire bonding procedure, and may contact more than one current passing electrodes so that the number of wire bonding procedures is reduced in manufacturing the device.

Abstract: A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes and a plurality of control electrodes. Conductive plates are disposed on the current electrodes and the control electrodes, and extend to regions for external connections. The conductive plates also includes connecting regions that are suspended between the chip and the external connection regions and suppers vibration propagating to the chip. One conductive plate unit for the current passing electrodes and another conductive plate unit for the control electrodes are separately soldered on the corresponding electrodes. Alternatively, only one unit may be soldered on the semiconductor chip, and portions of the unit may be removed to fabricate the device. Because of the absence of wire-bonding steps, the semiconductor chip does not receive impact of wire-bonding during the manufacturing process.

Abstract: A semiconductor device includes a power supply semiconductor chip that has a current passing electrode. A conductive plate is disposed on the current electrode, and a conductive wire that is used for an external connection of the device is fixed on the conductive plate, but not directly on the current passing electrode. The conductive plate may serve as a shock absorber during wire bonding procedure, and may contact more than one current passing electrodes so that the number of wire bonding procedures is reduced in manufacturing the device.

Abstract: A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes. Conductive plates are disposed on the current electrodes, and conductive wires used for an external connection of the device are fixed on the conductive plates, but not directly on the current passing electrode. A large plate is first fixed on the semiconductor chip, and then the back surface of the large plate is removed to form the individual conductive plates. Because the conductive wires are soldered onto the conductive plates, the semiconductor chip does not receive impact of wire bonding. Even when the conductive wires are wire bonded to the conductive plates, the plates may serve as shock absorbers during wire bonding procedure to reduce the impact of the wire bonding.

Abstract: A method for treating waster water containing oil composed of esters, which makes reactivation of spent adsorbent possible or unnecessary, and facilitates treatment of waste adsorbent. In order to realize the above method, oil composed of esters is adsorbed into an electroconductive adsorbent from the waste water, and is converted to water soluble materials by electrolytic hydrolysis using the adsorbent as a part of cathode for separating from and reactivating the adsorbent, or adsorbing step and reactivating step are performed concurrently. In accordance with the present invention, reactivation of spent adsorbent becomes possible and an amount of generated waste decreases remarkably, and generated waste adsorbent hitherto can be readily incinerated because of eliminating adsorbed oil. Secondary waste is not generated because no chemicals are used other than electric power.