Patents by Inventor Kimihiko Sudo

Kimihiko Sudo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10594100
    Abstract: A flexible type electrical feed-through involves a flexible printed circuit (FPC) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FPC part is wrapped around a metal part, forming a connector assembly. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. Multiple connector parts may be coupled to an inner side of the feed-through, to each mate with a respective flexible cable assembly electrically connected to a respective actuator of a multi-actuator hard disk drive. A floating board-to-board connector part may be coupled to the outer side of the feed-through, which in turn is electrically connected to a printed circuit board assembly of a hard disk drive, and which is able to tolerate connector mating misalignment.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: March 17, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Miki Namihisa, Kimihiko Sudo, Hiromitsu Masuda, Nobumasa Nishiyama, Satoshi Nakamura, Hiroshi Matsuda
  • Patent number: 10575424
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: February 25, 2020
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Patent number: 10515668
    Abstract: A low permeability electrical feed-through involves a laminate structure having alternating conductive and insulating layers with a conductive through-hole positioned therethrough, by which a lower connector pad is electrically connected with an upper connector pad. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. An insulating layer is positioned and configured such that an associated horizontal leak path can meet an allowable feed-through leak rate, while the collection of layers is configured such that an associated vertical leak path can meet the feed-through leak rate.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: December 24, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Seong-Hun Choe, Kazuhiro Nagaoka
  • Publication number: 20190378545
    Abstract: A flexible type electrical feed-through involves a flexible printed circuit (FPC) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FPC part is wrapped around a metal part, forming a connector assembly. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. The FPC may be shaped so that when wrapped around the metal part, portion(s) of the metal part are exposed on at least one side, which when adhered to a metal enclosure base, provides for a metal-to-metal bonding interface. A board-to-board connector receptacle and/or plug may be electrically connected to the feed-through, enabling smaller electrical connection pads on the feed-through.
    Type: Application
    Filed: June 11, 2018
    Publication date: December 12, 2019
    Inventors: Kimihiko Sudo, Miki Namihisa, Masahiro Kishimoto, Kazuhiro Nagaoka
  • Patent number: 10460768
    Abstract: A base member includes a recessed portion extending in radial directions and recessed upward from a lower surface of the base member, and a hole extending through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface defining a loop-shaped surface in the radial direction. A connector is located on a lower side of the recessed portion to cover the hole portion. An adhesive is located between the connector and the recessed portion.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: October 29, 2019
    Assignees: NIDEC CORPORATION, WEST DIGITAL TECHNOLOGIES, INC.
    Inventors: Masahiro Akagi, Takeshi Ohiro, Tomohiro Yoneda, Akihiro Yudate, Takayuki Ishino, Sho Nakamura, Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20190304510
    Abstract: A low permeability electrical feed-through involves a laminate structure having alternating conductive and insulating layers with a conductive through-hole positioned therethrough, by which a lower connector pad is electrically connected with an upper connector pad. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. An insulating layer is positioned and configured such that an associated horizontal leak path can meet an allowable feed-through leak rate, while the collection of layers is configured such that an associated vertical leak path can meet the feed-through leak rate.
    Type: Application
    Filed: June 21, 2019
    Publication date: October 3, 2019
    Inventors: Kimihiko Sudo, Seong-Hun Choe, Kazuhiro Nagaoka
  • Patent number: 10424345
    Abstract: A misalignment-tolerant flexible type electrical feed-through assembly, which is able to tolerate connector misalignment, involves a flexible circuit assembly (FCA) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FCA part is wrapped around a plurality of metal parts, where the metal parts are slidable relative to each other. Such a feed-through assembly may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: September 24, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Miki Namihisa, Kimihiko Sudo, Takako Hayakawa, Yuichi Arai
  • Patent number: 10395694
    Abstract: A low permeability electrical feed-through involves a laminate structure having alternating conductive and insulating layers with a conductive through-hole positioned therethrough, by which a lower connector pad is electrically connected with an upper connector pad. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. An insulating layer is positioned and configured such that an associated horizontal leak path can meet an allowable feed-through leak rate, while the collection of layers is configured such that an associated vertical leak path can meet the feed-through leak rate.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: August 27, 2019
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Seong-Hun Choe, Kazuhiro Nagaoka
  • Publication number: 20190104630
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: February 20, 2017
    Publication date: April 4, 2019
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 10164358
    Abstract: An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 25, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kyosuke Yoshida, Kimihiko Sudo, Takako Hayakawa, Hajime Eguchi, Yuta Onobu
  • Publication number: 20180322909
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: November 8, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180308526
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 25, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180308525
    Abstract: A base member includes a recessed portion arranged to extend in radial directions and recessed upward from a lower surface of the base member, the radial directions being directions perpendicular to a vertical direction or directions parallel to these directions; and a hole portion arranged to pass through the recessed portion in the vertical direction. The recessed portion includes a recessed portion loop-shaped surface being a loop-shaped surface perpendicular to the vertical direction. A connector is arranged on a lower side of the recessed portion to cover the hole portion. An adhesive is arranged between the connector and the recessed portion.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 25, 2018
    Inventors: Jiro Kaneko, Takako Hayakawa, Kimihiko Sudo, Yuta Onobu
  • Publication number: 20180097301
    Abstract: An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Kyosuke Yoshida, Kimihiko Sudo, Takako Hayakawa, Hajime Eguchi, Yuta Onobu
  • Patent number: 9870806
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 16, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Publication number: 20170278551
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: January 13, 2017
    Publication date: September 28, 2017
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 9734874
    Abstract: In the context of a hard disk drive (HDD), an adhesive leak channel structural feature is positioned in an area at which an electrical feed-through is adhered with an adhesive to an enclosure base, where the leak channel feature inhibits the leakage of gas through the adhesive. Embodiments include providing the leak channel feature on the base and/or on the feed-through. Embodiments may further include application of an electrodeposition coating to the base in an area at which the adhesive is in contact.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: August 15, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Seong-Hun Choe, Kimihiko Sudo, Yuta Onobu, Takehito Nagata, Hajime Eguchi, Kyosuke Yoshida, Naoshi Mizumoto
  • Publication number: 20170221527
    Abstract: In the context of a hard disk drive (HDD), an adhesive leak channel structural feature is positioned in an area at which an electrical feed-through is adhered with an adhesive to an enclosure base, where the leak channel feature inhibits the leakage of gas through the adhesive. Embodiments include providing the leak channel feature on the base and/or on the feed-through. Embodiments may further include application of an electrodeposition coating to the base in an area at which the adhesive is in contact.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 3, 2017
    Inventors: Seong-Hun Choe, Kimihiko Sudo, Yuta Onobu, Takehito Nagata, Hajime Eguchi, Kyosuke Yoshida, Naoshi Mizumoto
  • Patent number: 9721619
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an interface of an electrical feed-through connector and an HDD enclosure base. The laminated film seal may be constructed of a heat sealant layer that bonds with a surface of the base and a surface of the electrical connector, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: August 1, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu
  • Patent number: 9721620
    Abstract: A hermetically-sealed hard disk drive (HDD) utilizes a laminated film seal to seal an HDD cover-to-base interface. The laminated film seal may be constructed of a heat sealant layer hermetically-coupled to and forming a seal with the base, a barrier layer which inhibits gas from escaping from inside the HDD, and a film surface protective layer which protects the heat sealant and barrier layers. Embodiments may include a heat sealant layer comprising a thermoplastic polymer such as polypropylene, a barrier layer comprising a metal such as aluminum, and a film surface protective layer comprising a thermoplastic polymer such as polyethylene terephthalate.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: August 1, 2017
    Assignee: Western Digital Technologies, Inc.
    Inventors: Kimihiko Sudo, Takako Hayakawa, Yuichi Arai, Yuta Onobu