Abstract: It is to provide a light source module capable of downsizing an edge-light type backlight in thickness and reducing the usage amount of resin. A method of manufacturing a light source module includes a process of preparing a substrate with a first reflector including a reflecting surface mounted thereon, a process of mounting a plurality of light emitting elements on the substrate, a process of mounting a wiring board having an electrode on the substrate, a process of connecting the electrode of the light emitting element and the electrode of the wiring board with metal wire, a process of mounting a second reflector having a reflecting surface on the wiring board, and a process of filling the space between the first reflector and the second reflector, with resin.

Abstract: A semiconductor light source device, for enabling to cool LED elements driven with short pulses, effectively, and also being cheaply producible without increasing the number of pats thereof, comprising a plural number of light emitting diode chips 202 on a heat diffusion plate 201, and Pertier elements 208, as being thermoelectric cooling elements, for cooling the plural number of light emitting diode chips 202, wherein a pair of members 208(n) and 2008(p), building up the Pertier element for cooling each the light emitting diode chip, are electrically connected on each of the light emitting diode chip through bumps 207, so as to form said light emitting diode chip and the Pertier element as a unit on the heat diffusion plate, respectively, and thereby moving heat generation within each of the light emitting diode chips, directly, into the heat diffusion plate and/or a heat radiation plate.