Patents by Inventor Kimio Yamakawa
Kimio Yamakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7766218Abstract: To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 ?m and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.Type: GrantFiled: September 20, 2006Date of Patent: August 3, 2010Assignee: Nihon Handa Co., Ltd.Inventors: Kimio Yamakawa, Katsutoshi Mine
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Publication number: 20090236404Abstract: [PROBLEMS] To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. [MEANS FOR SOLVING PROBLEMS] A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 ?m and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver.Type: ApplicationFiled: September 20, 2006Publication date: September 24, 2009Applicant: NIHON HANDA CO., LTD.Inventors: Kimio Yamakawa, Katsutoshi Mine
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Patent number: 7375158Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.Type: GrantFiled: May 29, 2003Date of Patent: May 20, 2008Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Hiroki Ishikawa, Katsutoshi Mine, Kimio Yamakawa, Kazumi Nakayoshi
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Publication number: 20050181213Abstract: A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.Type: ApplicationFiled: May 29, 2003Publication date: August 18, 2005Inventors: Hiroki Ishikawa, Katsutoshi Mine, Kimio Yamakawa, Kazumi Nakayoshi
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Patent number: 6761947Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.Type: GrantFiled: January 17, 2003Date of Patent: July 13, 2004Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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Patent number: 6750550Abstract: An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.Type: GrantFiled: June 20, 2000Date of Patent: June 15, 2004Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
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Patent number: 6720083Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.Type: GrantFiled: March 20, 2002Date of Patent: April 13, 2004Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
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Patent number: 6621173Abstract: A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1×108 Pa at −65° C. and a shear frequency of 10 Hz.Type: GrantFiled: January 14, 2000Date of Patent: September 16, 2003Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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Publication number: 20030129347Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.Type: ApplicationFiled: January 17, 2003Publication date: July 10, 2003Inventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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Patent number: 6551676Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.Type: GrantFiled: August 27, 1999Date of Patent: April 22, 2003Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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Patent number: 6518204Abstract: A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.Type: GrantFiled: March 7, 2002Date of Patent: February 11, 2003Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Kimio Yamakawa, Kazumi Nakayoshi, Hiroki Ishikawa, Ryoto Shima, Junji Nakanishi, Tomoko Kato, Minoru Isshiki, Katsutoshi Mine
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Patent number: 6513680Abstract: A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.Type: GrantFiled: April 25, 2001Date of Patent: February 4, 2003Assignee: Dow Corning Toray Silicone Co., LTD.Inventors: Kazumi Nakayoshi, Hiroki Ishikawa, Ryoto Shima, Junji Nakanishi, Tomoko Kato, Minoru Isshiki, Kimio Yamakawa
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Patent number: 6498400Abstract: A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.Type: GrantFiled: March 21, 2001Date of Patent: December 24, 2002Assignee: Dow Corning Toray Silicone Co., LTDInventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine
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Publication number: 20020160624Abstract: A curable organopolysiloxane composition comprises: (A) an organopolysiloxane with two or more silicon-bonded hydrogen atoms contained in one molecule in an amount not exceeding 0.05 wt. %; (B) an organopolysiloxane with two or more alkenyl groups in one molecule {alkenyl groups of this components are to be in an amount of 0.01 to 1 mole per 1 mole of a silicon-bonded hydrogen atoms contained in said component (A)}; and (C) a hydrosilylation-reaction metal catalyst (with content of metal atoms within the range of 0.01 to 1,000 ppm in terms of weight units). A method of manufacturing a semiconductor device comprises: applying onto the surface of a semiconductor device and curing, the aforementioned curable organopolysiloxane composition.Type: ApplicationFiled: March 7, 2002Publication date: October 31, 2002Inventors: Kimio Yamakawa, Kazumi Nakayoshi, Hiroki Ishikawa, Ryoto Shima, Junji Nakanishi, Tomoko Kato, Minoru Isshiki, Katsutoshi Mine
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Publication number: 20020142177Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.Type: ApplicationFiled: March 20, 2002Publication date: October 3, 2002Inventors: Kimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
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Patent number: 6410642Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting component comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.Type: GrantFiled: June 20, 2000Date of Patent: June 25, 2002Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Kimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
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Patent number: 6379792Abstract: A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.Type: GrantFiled: July 6, 2000Date of Patent: April 30, 2002Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Minoru Isshiki, Kimio Yamakawa, Yoshito Ushio, Ryoto Shima, Katsutoshi Mine
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Publication number: 20020008123Abstract: A paste dispensing container comprising a cylindrical container having positioned therein a piston slidable along the walls of the container, a first end closed with a cap to seal paste within the container, a connecting portion at a second end of the container for connection with a pressurized fluid supply, and a leakage preventing cover having an air orifice covering the second end of the container. The paste dispensing container can be vacuum packaged in a gas-impermeable film for shipping and storage to prevent exposure of the paste contained therein to air.Type: ApplicationFiled: April 25, 2001Publication date: January 24, 2002Inventors: Kazumi Nakayoshi, Hiroki Ishikawa, Ryoto Shima, Junji Nakanishi, Tomoko Kato, Minoru Isshiki, Kimio Yamakawa
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Patent number: 6304000Abstract: A semiconductor device comprising a semiconductor chip, a semiconductor chip attachment site facing the semiconductor chip, and an adhesive silicone sheet bonding the semiconductor chip to the chip attachment site, wherein at least the surfaces of the sheet that connect the semiconductor chip and chip attachment site are a semi-cured product of a curable silicone composition.Type: GrantFiled: November 6, 2000Date of Patent: October 16, 2001Assignee: Dow Corning Toray Silicone Company, Ltd.Inventors: Minoru Isshiki, Katsutoshi Mine, Yoshiko Otani, Kimio Yamakawa
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Publication number: 20010018124Abstract: A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer. A semiconductor device comprising a semiconductor element; a substrate; and a hot-melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot-melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone-modified epoxy resin adhesive, a silicone adhesive, and a silicone-modified polyimide adhesive, and the spacer has the form of particles.Type: ApplicationFiled: March 21, 2001Publication date: August 30, 2001Inventors: Kimio Yamakawa, Minoru Isshiki, Yoshiko Otani, Katsutoshi Mine