Abstract: An adhesive silicone sheet that enroute to its complete cure is inhibited from releasing low-viscosity silicone oil, that provides excellent bond between a semiconductor chip and the corresponding chip attachment site, and that as a consequence of these features supports the fabrication of highly reliable semiconductor devices, The adhesive silicone sheet is produced by a very efficient method which yields an adhesive silicone sheet having particularly good adhesiveness. The siliocone adhesive sheet is used to produce highly reliable semiconductor devices in which the semiconductor chip has been bonded to its attachment site using the subject adhesive silicone sheet.

Abstract: To provides a hot-melt adhesive sheet that provides very precise bonding and a stress-relaxation capacity. Also, to provide highly reliable semiconductor devices in which the semiconductor element is bonded to its element attachment site using this hot-melt adhesive sheet. Hot-melt adhesive sheet that characteristically has hot-melt adhesive on both surfaces of the sheet and spacer within the sheet. Also, semiconductor device characterized in that the semiconductor element therein is bonded to its element attachment site by the above-described hot-melt adhesive sheet.

Abstract: A curable silicon composition, comprising (A) 100 parts by weight of an organopolysiloxane containing silicon-bonded aryl groups and at least two alkenyl groups per molecule, and having a viscosity of from 0.01 to 1,000 Pa.s at 25° C., wherein the aryl groups comprise from 1 to 40 mole % of the total silicon-bonded organic groups in the organopolysiloxane; (B) an organopolysiloxane having a viscosity of from 0.001 to 10 Pa.s at 25° C. and containing at least 2 silicon-bonded hydrogen atoms per molecule, in a quantity sufficient to cure the composition; (C) a platinum catalyst in a quantity sufficient to cure the composition; and (D) 0.00001 to 100 parts by weight of an organopolysiloxane having a viscosity of from 0.01 to 10,000 Pa.s at 25° C.

Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.

Abstract: A method for fabricating a semiconductor device, comprising the steps of coating the surface of a semiconductor element with a curable silicone composition comprising a curable silicone polymer and a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95, wherein the filler is selected from the group consisting of powders of organic resins, hollow forms of organic resin powders, hollow inorganic powders, intrinsically electrically conductive fillers, and fillers having a surface that is electrically conductive; allowing sufficient time to elapse for the filler in the part of the curable silicone composition adjoining the element to migrate into the part of the curable silicone composition remote from the element; and curing the curable silicone composition.

Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: An electrical part containing an electrical element, a cured silicone resin which has been treated with ultraviolet light, a cured sealing resin which has been integrally bonded to the UV treated silicone resin. The cured silicone resin is prepared from an addition reaction curable silicone composition which is a mixture or reaction mixture of (a) an organosiloxane which has silanol groups and (b) an alkoxysilane which has epoxy groups, and/or (c) an organosiloxane which can be expressed by the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwherein R.sup.1 is an epoxy group containing monovalent organic group R.sup.2 is monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group with 1 to 4 carbon atoms, a, b and d are>0 and c is.gtoreq.0.

Abstract: A semiconductor device in which the surface of the semiconductor element is coated with a cured silicone in which there is dispersed filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 characterized in that the concentration of said filler is higher in the layer of said cured material remote from the element than in the layer of said cured material adjoining the element. The method for fabricating such a device comprises coating the surface of a semiconductor element with a curable silicone composition in which there is dispersed a filler having an average particle diameter of 0.01 to 500 micrometers and a specific gravity of 0.01 to 0.95 and thereafter curing said composition after the elapse of sufficient time for the filler in the layer of the composition adjoining the element to migrate into the layer of said composition remote from the element.

Abstract: A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0.

Abstract: Method for curing UV-curable silicone compositions, characterized by the formation of cured silicone, having a low-tack surface that is harder than the interior, by exposing an ultraviolet-curable silicone composition to ultraviolet radiation at a ratio of the exposure dose for wavelengths of 200 to 280 nm (excluding 280 nm) to the exposure dose for wavelengths of 280 to 400 nm of 0.5 to 10.0.

Abstract: A curable composition containing a curable liquid-form organopolysiloxane composition and a curable liquid-form organic resin composition. The organic resin composition is contained as liquid particles in the organopolysiloxane composition. A cured product formed by curing the abovementioned curable liquid composition such that the cured product contains fine particles of a cured organic resin in a cured organopolysiloxane matrix. An electronic part which is covered by the cured product of the abovementioned curable liquid-form composition.

Abstract: A two-part composition comprising a liquid composition (I) composed of the components (A), (C), and (E) described below and a liquid composition (II) composed of the components (A) (B), (C), and (D) described below, which yield upon mixing a curable liquid silicone composition comprising(A) an alkenyl-substituted poyorganopolysiloxane;(B) a hydrogen-substituted organopolysiloxane in an amount that provides 0.3 to 10 moles silicon-bonded hydrogen from component (B) per 1 mole alkenyl in component (A);(C) an inorganic filler that has a specific surface of 50 to 500 m.sup.2 /g;(D) an alkoxy-substituted organopolysiloxane; and(E) platinum catalyst in a quantity sufficient to cure the instant composition;wherein the curable silicone composition that results when liquid composition (I) and liquid composition (II) are mixed, is thixotropic and has a viscosity, immediately upon the mixing that is greater than the viscosity of liquid composition (II).

Abstract: Curable silicone compositions comprise either (a) microparticles of a fluororesin which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture and heat resistance.

Abstract: Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

Abstract: Optical communications fibers made by coating with an addition curable composition made from an alkenyl containing organopolysiloxane, a methylhydrogenpolysiloxane, a platinum-type catalyst, and an alkynyl compound provide reduced hydrogen gas generation on quartz fiber and has less transmission loss when the platinum-type catalyst is present in amounts greater than 20 ppm platinum-type metal, the SiH to aliphatically unsaturated is from 0.75/1.00 to 1.05/1.00, and the weight ratio of total alkynyl groups to platinum-type metal is 1.0/1.0 to 15.0/1.00.