Patents by Inventor Kin Fung

Kin Fung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11547356
    Abstract: A wearable device for healthcare and a method thereof, wherein the device is worn on a finger for measuring the health data of the user, including but not limited to, the heart rate, blood oxygen saturation, etc. The wearing size of the device is adjustable for different sizes of fingers. In one embodiment, the device includes a main body at least partially worn on a digit of a user; at least one physiological sensor attached to the main body for detecting physiological information; and at least two branches coupled to the main body for holding the digit while reducing the movement of the device. At least a part of at least one branch is changeable such that the wearing size of the device is adjustable for different sizes of digits. In another embodiment, at least a part of at least one branch is movable such that the wearing size of the device is adjustable for different sizes of digits.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: January 10, 2023
    Assignee: BELUN Technology (IP) Company Limited
    Inventors: Ka Cheung Kwok, Wang Kin Fung, Luis Ng, Ngok Man Sze, Kwan Wai To
  • Publication number: 20220143359
    Abstract: An anti-drowsiness device includes a head cover; an electroencephalograph, which is formed on the head cover, the electroencephalograph receiving the brain-waves all the time and generating a sleep-detection signal when a specific frequency, which shows drowsiness, is received, and an electrostimulator, which is formed on the head cover, the electrostimulator generating electrostimulation when receiving the sleep-detection signal.
    Type: Application
    Filed: December 17, 2021
    Publication date: May 12, 2022
    Inventors: Riko YOHENA, Kin Fung Wong, Masako TOBARI, Yudai KAWAWADA, Nan WU, Yu LI
  • Publication number: 20200375538
    Abstract: A wearable device for healthcare and a method thereof, wherein the device is worn on a finger for measuring the health data of the user, including but not limited to, the heart rate, blood oxygen saturation, etc. The wearing size of the device is adjustable for different sizes of fingers. In one embodiment, the device includes a main body at least partially worn on a digit of a user; at least one physiological sensor attached to the main body for detecting physiological information; and at least two branches coupled to the main body for holding the digit while reducing the movement of the device. At least a part of at least one branch is changeable such that the wearing size of the device is adjustable for different sizes of digits. In another embodiment, at least a part of at least one branch is movable such that the wearing size of the device is adjustable for different sizes of digits.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 3, 2020
    Inventors: Ka Cheung KWOK, Wang Kin FUNG, Luis NG, Ngok Man SZE, Kwan Wai TO
  • Publication number: 20200085306
    Abstract: An electronic device measures physiological information of a living subject. The electronic device includes a sensor assembly, a first driving unit with an electromagnetic structure and a second driving unit. The first driving unit drives the sensor assembly to scan the living subject's skin along a scan path in a non-contact way to determine a measuring position. The second driving unit drives the sensor assembly to move towards and contact the living subject's skin to measure the physiological information based on the measuring position. In a typical embodiment, the sensor is configured under a measurement surface where a wrist of a user is put on. The sensor scans the user's wrist along a scan path under the wrist in a non-contact way and move upwards to contact the user's wrist for measuring the physiological information based on the scanning result.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: Kwan Wai TO, Wang Kin FUNG, Luis NG, Ngok Man SZE, Chi Tin LUK, Wenbo GU
  • Patent number: 10312214
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: June 4, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Yi Kei Law, Chuek Wah Tang, Pak Kin Leung, Gary Peter Widdowson, Wing Chiu Lai, Kin Fung Yu, Jiang Wen Deng
  • Patent number: 10192761
    Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: January 29, 2019
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Kin Fung Yu, Yu Xing Cao, Wing Chiu Lai, Kai Siu Lam, Gary Peter Widdowson, Ying Zhuo Liu
  • Patent number: 10128325
    Abstract: Multiple intertwined inductor coils combine to form one or more transformer devices of a semiconductor device. The intertwined inductor coils are formed of only two metallization layers and vias coupling the layers. The inductor coils are vertically oriented and include a magnetic axis parallel to the substrate surface. A plurality of metal wires are provided on both a first device level and a second device level. Each of the metal wires on the first device level is coupled to two wires on the second device level and forms a first inductor coil. The two metal wires on the second device level that form part of the first inductor coil, are separated by a third wire that is coupled to two different first device level metal wires and forms part of a different second inductor coil intertwined with the first inductor coil.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: November 13, 2018
    Assignee: WAFERTECH, LLC
    Inventors: Kin Fung (Wayne) Lam, Hsin-I Li, Wen-Bin Tsai
  • Publication number: 20180068973
    Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 8, 2018
    Inventors: Yi Kei LAW, Chuek Wah TANG, Pak Kin LEUNG, Gary Peter WIDDOWSON, Wing Chiu LAI, Kin Fung YU, Jiang Wen DENG
  • Publication number: 20170238449
    Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.
    Type: Application
    Filed: February 9, 2017
    Publication date: August 17, 2017
    Inventors: Kin Fung YU, Yu Xing CAO, Wing Chiu LAI, Kai Siu LAM, Gary Peter WIDDOWSON, Ying Zhuo LIU
  • Patent number: 9520355
    Abstract: MIM capacitors that are temperature and/or voltage independent, and a methodology for formulating the MIM capacitors for use in semiconductor integrated circuits, is provided. Vertical MIM capacitive structures include at least two vertically separated electrodes and a capacitor dielectric that includes portions of different dielectric materials provided in a desired area ratio. The disclosure provided for selecting dielectrics and dielectric thicknesses, determining an area ratio that produces temperature and/or voltage independent MIM capacitors, and forming capacitive devices with the desired area ratio. In one embodiment, the capacitor dielectric includes at least one SiO dielectric portion and at least one SiN dielectric portion and a total capacitive area includes the SiN and SiO dielectric portions arranged such that the ratio of the area of the SiO portions to the area of the SiN portions is about 1.15:1.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: December 13, 2016
    Assignee: WAFERTECH. LLC
    Inventors: Hsin-I Li, Wen-Bin Tsai, Kin Fung Lam
  • Publication number: 20150279921
    Abstract: Multiple intertwined inductor coils combine to form one or more transformer devices of a semiconductor device. The intertwined inductor coils are formed of only two metallization layers and vias coupling the layers. The inductor coils are vertically oriented and include a magnetic axis parallel to the substrate surface. A plurality of metal wires are provided on both a first device level and a second device level. Each of the metal wires on the first device level is coupled to two wires on the second device level and forms a first inductor coil. The two metal wires on the second device level that form part of the first inductor coil, are separated by a third wire that is coupled to two different first device level metal wires and forms part of a different second inductor coil intertwined with the first inductor coil.
    Type: Application
    Filed: March 23, 2015
    Publication date: October 1, 2015
    Inventors: Kin Fung (Wayne) Lam, Hsin-I Li, Wen-Bin Tsai
  • Publication number: 20150228738
    Abstract: A split-gate flash cell device and method for forming the same are not provided. The split-gate flash cell device includes a floating gate transistor. The floating gate transistor includes a floating gate and a control gate disposed over at least a portion of the floating gate, along a side of the floating gate and over a portion of the substrate adjacent the floating gate. The control gate includes a portion of SiGe material. In some embodiments, the control gate is a composite material with a lower SiGe layer and an upper material layer. The upper material layer is polysilicon or other suitable materials.
    Type: Application
    Filed: February 7, 2014
    Publication date: August 13, 2015
    Applicant: WaferTech, LLC
    Inventors: Wen-Bin TSAI, Hsin-I LI, Kin Fung LAM
  • Publication number: 20150221713
    Abstract: MIM capacitors that are temperature and/or voltage independent, and a methodology for formulating the MIM capacitors for use in semiconductor integrated circuits, is provided. Vertical MIM capacitive structures include at least two vertically separated electrodes and a capacitor dielectric that includes portions of different dielectric materials provided in a desired area ratio. The disclosure provided for selecting dielectrics and dielectric thicknesses, determining an area ratio that produces temperature and/or voltage independent MIM capacitors, and forming capacitive devices with the desired area ratio. In one embodiment, the capacitor dielectric includes at least one SiO dielectric portion and at least one SiN dielectric portion and a total capacitive area includes the SiN and SiO dielectric portions arranged such that the ratio of the area of the SiO portions to the area of the SiN portions is about 1.15:1.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 6, 2015
    Applicant: WaferTech, LLC
    Inventors: Hsin-l LI, Wen-Bin Tsai, Kin Fung Lam
  • Patent number: 9035529
    Abstract: A commutator has a plurality of commutator segments fixed to an insulating support member. The commutator segments are formed by cold or hot forming a copper billet cut from a length of copper wire. Each billet has a volume approximately equal to the volume of one commutator segment. Each commutator segment has a main body and an anchor integrally formed with the main body. The commutator segments are spaced about a circle and then an insulating support member is molded to the commutator segments to fix the commutator segments to the support member.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: May 19, 2015
    Assignee: Johnston Electric S.A.
    Inventors: Raven Wai Kei Mok, Zhi Yang Yao, Xiao Jun Yang, Chung Fai Choi, Wilfried Gorlt, James Ching Sik Lau, Alan Kin Fung Man, Kui Man Lai
  • Patent number: 8941499
    Abstract: A first sensor is coupled to a seat back surface and/or a seat belt, and a second sensor is positioned remotely from the first sensor. The first sensor is configured to generate a raw signal indicative of biological data and noise, and the second sensor is configured to generate a baseline signal indicative of noise associated with the first sensor. A computing device is programmed to determine a state of the occupant based on at least the raw signal and the baseline signal.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: January 27, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kin Fung, Timothy Dick
  • Patent number: 8698639
    Abstract: Methods of assessing driver behavior include monitoring vehicle systems and driver monitoring systems to accommodate for a driver's slow reaction time, attention lapse and/or alertness. When it is determined that a driver is drowsy, for example, the response system may modify the operation of one or more vehicle systems. The systems that may be modified include: visual devices, audio devices, tactile devices, antilock brake systems, automatic brake prefill systems, brake assist systems, auto cruise control systems, electronic stability control systems, collision warning systems, lane keep assist systems, blind spot indicator systems, electronic pretensioning systems and climate control systems.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: April 15, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventors: Kin Fung, Timothy J. Dick
  • Publication number: 20130033382
    Abstract: A first sensor is coupled to a seat back surface and/or a seat belt, and a second sensor is positioned remotely from the first sensor. The first sensor is configured to generate a raw signal indicative of biological data and noise, and the second sensor is configured to generate a baseline signal indicative of noise associated with the first sensor. A computing device is programmed to determine a state of the occupant based on at least the raw signal and the baseline signal.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Kin Fung, Timothy Dick
  • Publication number: 20120212353
    Abstract: Methods of assessing driver behavior include monitoring vehicle systems and driver monitoring systems to accommodate for a driver's slow reaction time, attention lapse and/or alertness. When it is determined that a driver is drowsy, for example, the response system may modify the operation of one or more vehicle systems. The systems that may be modified include: visual devices, audio devices, tactile devices, antilock brake systems, automatic brake prefill systems, brake assist systems, auto cruise control systems, electronic stability control systems, collision warning systems, lane keep assist systems, blind spot indicator systems, electronic pretensioning systems and climate control systems.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 23, 2012
    Applicant: Honda Motor Co., Ltd.
    Inventors: Kin Fung, Timothy J. Dick
  • Patent number: D925041
    Type: Grant
    Filed: May 20, 2019
    Date of Patent: July 13, 2021
    Assignee: AMORV (IP) COMPANY LIMITED
    Inventors: Chi Tin Luk, Wang Kin Fung, Kwan Wai To, Pieter Lesage, Alexander Crolla, Stefanie Mertens
  • Patent number: D956242
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: June 28, 2022
    Assignee: BELUN TECHNOLOGY (IP) COMPANY LIMITED
    Inventors: Ka Cheung Kwok, Kwan Wai To, Wang Kin Fung, Alexander Crolla, Stefanie Mertens