Patents by Inventor Kinji Saijo
Kinji Saijo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8138423Abstract: A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.Type: GrantFiled: November 18, 2005Date of Patent: March 20, 2012Assignee: Toyo Kohan Co., Ltd.Inventors: Mitsuhiro Watanabe, Kinji Saijo, Shinji Ohsawa, Kazuo Yoshida, Koji Nanbu
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Publication number: 20090145630Abstract: To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible and substantial miniaturization can be achieved. In order to achieve this object, a printed wiring board obtained by etching a metal-clad laminate including a conductive layer and an insulating layer is employed, in which a first circuit and a second circuit having different thicknesses formed in a same reference plane coexist. In addition, it is characterized in that a thicker circuit of the first circuit or the second circuit has a clad-like configuration in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked.Type: ApplicationFiled: November 18, 2005Publication date: June 11, 2009Applicants: MULTI INC., TOYO KOHAN CO., LTDInventors: Mitsuhiro Watanabe, Kinji Saijo, Shinji Ohsawa, Kazuo Yoshida, Koji Nanbu
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Patent number: 7284320Abstract: A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.Type: GrantFiled: May 3, 2005Date of Patent: October 23, 2007Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Patent number: 7183190Abstract: A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.Type: GrantFiled: March 27, 2001Date of Patent: February 27, 2007Assignees: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Shingji Ohsawa, Hiroaki Okamoto, Kazuo Yoshida, Tadatomo Suga
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Patent number: 7175919Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.Type: GrantFiled: October 4, 2001Date of Patent: February 13, 2007Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Publication number: 20060163329Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.Type: ApplicationFiled: March 24, 2006Publication date: July 27, 2006Applicant: TOYO KOHAN CO., LTD.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Patent number: 7033641Abstract: A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable of separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.Type: GrantFiled: September 26, 2001Date of Patent: April 25, 2006Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Shinji Ohsawa, Hiroaki Okamoto, Kazuo Yoshida, Tsutomu Seki
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Patent number: 6949412Abstract: A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.Type: GrantFiled: April 10, 2003Date of Patent: September 27, 2005Assignee: Toyo Kohan Co.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Publication number: 20050193555Abstract: A multilayer printed wiring board having a wiring lead-out port has a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. A large number of products can be easily manufactured with good size reproducibility. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3 % reduction and forming a signal circuit conductor covered by an earth circuit and the wiring lead-out port.Type: ApplicationFiled: May 3, 2005Publication date: September 8, 2005Applicant: TOYO KOHAN CO., LTD.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Publication number: 20050164006Abstract: A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.Type: ApplicationFiled: April 12, 2002Publication date: July 28, 2005Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohasawa
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Publication number: 20050082669Abstract: An electronic circuit device capable of providing a stable electrical connection between an electronic component chip and a connecting multi-layer substrate, and being downsized at high density; and a production method therefor. An electronic component chip (1) and a connecting multi-layer substrate (2) or electronic component chips are heated in an inactive atmosphere such as argon or a reducing atmosphere such as hydrogen and pressure-welded to each other with or without an intermediary of an interposer (6), or their joint surfaces are activated and then pressure-welded at room temperature or by heating, thereby producing an electronic circuit device (40) by directly and metallurgically joining them by using any one of the above methods.Type: ApplicationFiled: March 10, 2003Publication date: April 21, 2005Inventors: Kinji Saijo, Kazuo Yoshida, Shinji Ohsawa
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Publication number: 20050084743Abstract: A method of forming a protection film of a safety valve element for battery prevents corrosion. The safety valve element is composed of a safety valve element having a metal substrate with a perforated pore and a metal foil laminated on a metal substrate so as to cover the pore, and a protection film is formed by coating an organic coating at least on one side of the safety valve element.Type: ApplicationFiled: October 21, 2004Publication date: April 21, 2005Applicant: TOYO KOHAN CO., LTD.Inventors: Hiroaki Okamoto, Yoshiyuki Sugimoto, Kinji Saijo, Hiroaki Kawamura
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Publication number: 20050076779Abstract: A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable separating a hydrogen gas (palladium alloy foil) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy foil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.Type: ApplicationFiled: September 26, 2001Publication date: April 14, 2005Inventors: Kinji Saijo, Shinji Ohsawa, Hiroaki Okamoto, Kazuo Yoshida, Tsutomu Seki
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Patent number: 6841877Abstract: A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring.Type: GrantFiled: December 26, 2000Date of Patent: January 11, 2005Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Patent number: 6838318Abstract: A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.Type: GrantFiled: June 9, 2000Date of Patent: January 4, 2005Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Patent number: 6818342Abstract: A method of forming a protective coating on a cell safety valve element by coating the cell safety valve element with a protective film to protect metal portions thereof against corrosion, a cell safety valve element coated with a protective film, a cell sealing plate using the element, and an enclosed cell using the plate. The safety valve element comprises a coating (3) obtained by applying an organic paint onto at least one surface of the cell safety valve element (10) consisting of a metal base plate (1) having a through hole (4) drilled therein and a metal foil (2) laminated on the metal base plate (1) so as to block the through hole (4).Type: GrantFiled: October 17, 2000Date of Patent: November 16, 2004Assignee: Toyo Kohan Co., Ltd.Inventors: Hiroaki Okamoto, Yoshiyuki Sugimoto, Kinji Saijo, Hiroaki Kawamura
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Publication number: 20040175583Abstract: A high polymer plate and conductive plate connecting body formed by connecting a high polymer plate to a conductive plate without using an adhesive agent and a part using the high polymer plate and conductive plate connecting body; the connecting body, wherein the faces of the high polymer plate and the conductive plate opposed to each other are connected to each other after the plates receive an activation under an extremely low pressure; a part.Type: ApplicationFiled: May 3, 2004Publication date: September 9, 2004Inventors: Kinji Saijo, Kazuo Yoshida, Hiroaki Okamoto, Shinji Ohsawa
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Patent number: 6737187Abstract: A closed battery which is capable of rapidly releasing the internal pressure there while simultaneously disconnecting the current to prevent the internal temperature of the battery from rising and causing the battery to explode. Thus, when the internal pressure of the closed battery is elevated due to a short circuit, overcharge, reverse charge, or the like, internal gas in the battery can be safely discharged and the battery prevented from bursting.Type: GrantFiled: August 1, 2001Date of Patent: May 18, 2004Assignees: Toyo Kohan Co., Ltd., Fukuda Metal Foil & Powder Co., Ltd.Inventors: Akiyoshi Takada, Kinji Saijo, Kazuo Yoshida, Nobuyuki Yoshimoto, Yoshihiko Isobe
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Patent number: 6730391Abstract: In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by forming clad sheet for a multilayered printed circuit board 34 by laminating copper foil 19, 24, 33 which are to be formed into conductor layer 10, 17, 18 and nickel plating 20, 21 which are to be etching-stopper layer and simultaneously press-bonding both, producing a base by selectively etching clad sheet for a multilayered printed circuit board 34, forming outer conductor layer 15, 16 on the surface of the base and simultaneously making patterning, and electrically connecting among conductor layer 10, 15, 16 by interposing columnar conductor 17, 18 formed by etching copper foil 19, 24, 33 and nickel plating 20, 21.Type: GrantFiled: February 27, 2001Date of Patent: May 4, 2004Assignee: Toyo Kohan Co., Ltd.Inventors: Kinji Saijo, Shinji Ohsawa, Kazuo Yoshida
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Publication number: 20040069463Abstract: A hollow laminate which is prepared by forming hollow portions of a predetermined shape on opposed faces of a plurality of metal plates, subjecting the joining faces of the metal plates to an activation treatment under an extremely reduced pressure, and then laminating the metal plates having hollow portions and joining them by cold pressure welding; and a heat sink which is prepared by enclosing water as a heat radiating hydraulic fluid in the hollow portion of the hollow laminateType: ApplicationFiled: October 24, 2003Publication date: April 15, 2004Inventors: Kinji Saijo, Tsuguo Kawamura, Shinji Ohsawa, Hiroaki Okamoto, Kazuo Yoshida