Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Abstract: A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal film formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal film superposed on a surface thereof, activating both the surface of the thin metal film and a surface of a metal foil, and press-bonding the activated thin-metal film surface to the activated metal foil surface.

Abstract: A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material (13) can be prevented from being broken because the ceramics material (13) is heated while being placed on a holder (14) and is pressure-joined under a pressure of 1 kg/mm2 or lower.

Abstract: The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad sheet for lead frame is manufactured by press-bonding copper foil to nickel foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding copper foil having nickel plating on one or both sides of it to the other copper foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding aluminum foil to nickel foil at the reduction rate of 0.1 to 3%. Further, it is also manufactured by press-bonding copper foil having nickel plating on one side of it to aluminum foil at the reduction rate of 0.1 to 3%. Clad sheet is comprising three layer of copper/nickel/copper or copper/nickel/aluminum.

Abstract: A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar (17) columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

Abstract: A method of efficiently and inexpensively fabricating a chip-size package having an electrode pitch expanded by forming a conductor wiring on the electrode forming surface side of a semiconductor chip, especially, a method for facilitating wiring and bump forming. A semiconductor device comprising a semi-conductor elements and conductor wirings formed on the semiconductor elements by etching wiring-forming metal foil; and a fabrication method for a semiconductor device comprising the steps of laminating wiring forming metal foil on the electrode forming surface side on the semiconductor, forming a resist wiring pattern on the metal foil, etching the metal foil, and slicing the device into individual elements.

Abstract: A structure of a multilayer printed wiring board having a wiring lead-out port can be easily formed. A large number of products can be easily manufactured with good size reproducibility. A method of manufacturing the same is also are disclosed. The multilayer printed wiring board is characterized by having a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor perfectly covered by an earth circuit and the wiring lead-out port.

Abstract: A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring and conductor wiring on the semiconductor, and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring.

Abstract: A multilayered circuit board is produced by: a. laminating a copper foil conductor layer and a nickel foil or nickel plating etch-stopping layer by simultaneously press-bonding the nickel and copper layer to form a multilayered clad sheet; b. selectively etching the multilayered clad sheet; c. forming an insulating layer and an outer conductor layer on the surface of the clad sheet; d. patterning the outer conductor layer; and e. electrically connecting the internal conductor layer and the outer conductor layer by interposing a columnar conductor formed in the base by etching.

Abstract: A completely-enclosed cell wherein if the internal pressure in the cell rises because of short circuit or overcharging, temperature rise and explosion of the cell is effectively prevented, the current is cut off, and the internal pressure is simultaneously and quickly released. The cell includes a sealer comprising a valve body composed of a metal substrate perforated at narrowly spaced intervals in the endless periphery and a metal foil 72 substrate to cover the perforations. The cell a structure in which a narrow gap portion of a 98 metal plate deformable even by a weak force of when the internal pressure increases elongates and the portion surrounded by the through holes projects 122.

Abstract: The object of the present invention is to provide an explosion-proof safety valve assemblage having a lead cap which allows some of the manufacturing man-hour in the process such as precision working and positioning to be deleted, since the lead cap is integrally formed with an explosion-proof safety valve and serves to provide a current circuit in a battery in place of a conventional one composed of lead plate or lead wire which requires such precision working and positioning operations, and to provide a closed secondary battery using the above mentioned safety valve assemblage.

Abstract: In the present invention, which produces a clad sheet for a multilayered printed circuit board capable of being economically manufactured and having excellent performance, a multilayered printed circuit board using thereof and a manufacturing method thereof, a multilayered printed circuit board is manufactured by

Abstract: A closing plate for a battery comprises a metal substrate provided with a safety valve at a peripheral portion thereof. The safety valve is protected by applying a protection film to the metal substrate of the closing plate. The closing plate comprises a metal substrate, metal foil which is adhered to the lower surface of the metal substrate, and a protection film attached to the upper surface of the metal substrate, which protection film has previously been provided with a cut in a prescribed shape.

Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent a rise in temperature and explosion so that it may assure the safety and reliability of the battery, when, the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like in such a completely closed battery. A closed battery of the present invention is provided with a closing member serving as a valve chip, which is composed of a metal substrate 1 in which a valve element 5 is provided and defined by a break line 3, and a metal foil 2 adhered to the inner surface of the metal substrate 1.

Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent itself from temperature rising and exploding so that in such a completely closed battery it may assure the safety and reliability thereof, when the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like. A valve element 5 is provided with a slit 3 between the circumference thereof and a metal substrate 1. When the internal pressure of a battery is elevated, the valve element 5 is smoothly raised up together with a metal foil 2 from a bending fulcrum portion 4 to thereby cut a lead wire 6 or permit a braze portion 8 to detach from the lead wire 6, thus disconnecting the current reliably.

Abstract: A closed battery which is capable of rapidly releasing the internal pressure there while simultaneously disconnecting the current to prevent the internal temperature of the battery from rising and causing the battery to explode. Thus, when the internal pressure of the closed battery is elevated due to a short circuit, overcharge, reverse charge, or the like, internal gas in the battery can be safely discharged and the battery prevented from bursting.

Abstract: The object of the present invention is to provide a closed battery capable of rapidly releasing the internal pressure thereof and at the same time disconnecting the current to effectively prevent itself from temperature rising and explosion so that it may assure the safety and reliability thereof, when the internal pressure is elevated due to short circuit, overcharge, reverse charge, or the like in such a completely closed battery. The formation of a valve element 5 whose center is eccentric to the center of a metal substrate 1 produces a slit 3 having a large width portion around the circumference of a valve element 5. When the internal pressure of a battery is elevated, the valve element 5 is smoothly raised up together with a metal foil 2 from the bending fulcrum portion 4 to thereby cut a lead wire 6 or permit a braze portion 8 to detach from the lead wire 6, thus reliably disconnecting the current.

Abstract: The object of the present invention is to provide safety valve elements for condenser use, which rupture precisely at a predetermined pressure especially stably in a low pressure range so as to release inner pressure outside and can be manufactured readily, and to provide a condenser which incorporates the safety valve elements. The safety valve elements for condenser use according to the present invention comprises a metal substrate A which is provided with a perforated opening C and a metal foil B laid over the metal substrate A to close the perforated opening C.

Abstract: A safety valve element for battery use which ruptures at a stable pressure range so as to release the inner pressure of the battery is disclosed. The safety valve element for battery use comprises a metal substrate which is provided with a perforated opening and a metal foil laminated on the metal substrate so as to close the perforated opening. A battery which is provided with such a safety valve is also disclosed. A battery case provided with such a safety valve is also disclosed. The battery and the battery case lid is produced by forming the perforated opening in the metal substrate, pressure welding the metal foil to the metal substrate and molding the clad material into a form of the battery case lid.

Abstract: Clad material comprises a metal substrate which is provided with a multiplicity of perforated openings therein and a metal foil which is laminated on the metal substrate to close the perforated openings. To produce such a clad material, at least one surface of the metal substrate and corresponding one surface of the metal foil are respectively subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surfaces face each other. Alternately, only one surface of the metal substrate is subjected to a dry etching and the metal substrate and the metal foil are laminated in such a manner that the etched surface of the metal substrate defines a laminating surface. It may be possible to provide a nickel plating on the metal substrate or the metal foil. The clad material can be effectively used for producing safety valve chips which rupture accurately at low pressures which fall in a stable pressure range on a mass production basis.