Abstract: An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and, preferably, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer. The adhesion layer is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 &mgr;m. The electrostatic chucking device may be manufactured by a low-temperature compression bonding process under pressure at a temperature of 100 to 250° C. between the metal substrate and the first insulation layer, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer using thermoplastic polyimide-based adhesion films.

Abstract: An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 &mgr;m.

Abstract: The present invention discloses an electrostatic chucking device having a laminated structure which is formed by sequentially laminating a first insulation layer, an electrode layer and a second insulation layer on metal substrate, wherein the first insulation layer and the second insulation layer are constituted of polyimide films, and at least the adhesion between the metal substrate and the first insulation layer, and, preferably, further, the adhesions including the adhesion between the first insulation layer and the electrode layer and the adhesion between the electrode layer and the second insulation layer are performed by using thermoplastic polyimide-based adhesive films having a film thickness of 5 to 50 &mgr;m.

Abstract: There are provided a static electricity chuck which can vary the temperature of a wafer in a short time without adversely effecting throughput, and a wafer stage having the static electricity chuck. The static electricity chuck includes a dielectric member 4 formed of insulating material, an electrode 5 of conductor which is disposed at the lower side of the dielectric member 4, and a heater 6 which is disposed at the lower side of the electrode 5 and heats the dielectric member 4. The wafer stage 1 includes the static electricity chuck which is provided on a metal jacket having cooling apparatus.

Abstract: Disclosed is a wafer stage allowing a plasma process under a heating condition at a high temperature, particularly, 400.degree. C. or more using the improved electrostatically chucking technology with the increased temperature-controllability. The wafer stage includes an electrostatic chuck and a temperature adjusting jacket disposed under said electrostatic chuck. The electrostatic chuck includes: a dielectric member made from an insulating material; an electrode formed of a brazing layer, which is disposed on the underside of said dielectric member for fixing said dielectric member; an aluminum nitride plate disposed on the underside of said electrode, to which said dielectric member is fixed through said electrode; a heater, disposed on the underside of said aluminum nitride plate, for heating said dielectric member; and a metal plate disposed on the underside of said aluminum nitride plate and also at least on a top or bottom side of said heater.

Abstract: A shaping mold for the production of ultra-thin shaped rubber articles, has a main body which is dipped into a latex liquid so as to make the latex adhered to the surface of the main body. The adhered latex is heat-dried to form an ultra-thin shaped rubber article over the surface. The mold is such that at least the surface of its main body is made of an amorphous carbon and that its bottom part is fitted with electrifying electrodes and has therebetween a heating area to be heated by resistance heating due to its electrification. The same shaping mold from its dipping step through the inspecting step of inspecting the shaped article as adhered to the surface of the mold. In the heat-drying step of the method, the shaped article as adhered to the surface of the shaping mold is heated and dried from the inside of the mold with preventing as much as possible formation of pin holes in the shaped article.

Abstract: A shaping mold for the production of ultra-thin shaped rubber articles, has a main body which is dipped into a latex liquid so as to make the latex adhered to the surface of the main body. The adhered latex is heat-dried to form an ultra-thin shaped rubber article over the surface. The mold is such that at least the surface of its main body is made of an amorphous carbon and that its bottom part is fitted with electrifying electrodes and has therebetween a heating area to be heated by resistance heating due to its electrification. The same shaping mold can be used from its dipping step through the inspecting step of inspecting the shaped article as adhered to the surface of the mold. In the heat-drying step of the method, the shaped article as adhered to the surface of the shaping mold is heated and dried from the inside of the mold with preventing as much as possible formation of pin holes in the shaped article.