Abstract: Provided is a water cooling type cooling system for an electronic device having a plurality of coolant circulation units and coolant supply units separable from each other to be interconnected in series or parallel.

Abstract: Provided is a water cooling type cooling system for an electronic device having a plurality of coolant circulation units and coolant supply units separable from each other to be interconnected in series or parallel.

Abstract: Provided is a water cooling type cooling block for a, semiconductor chip which can increase heat transfer efficiency by inducing turbulent flow even if a coolant flows at low speed. The cooling block includes a heat transfer plate contacting the semiconductor chip, a case connected to the heat transfer plate to enclose the heat transfer plate so as to accommodate a coolant for cooling heat from the heat transfer plate and having a coolant inlet port at its first end and a coolant outlet port at its second end so as to allow movement of the coolant, and a sealing means hermetically sealing the heat transfer plate and the case.

Abstract: Provided is a water cooling type cooling block for a semiconductor chip which can increase heat transfer efficiency by inducing turbulent flow even if a coolant flows at low speed. The cooling block includes a heat transfer plate contacting the semiconductor chip, a case connected to the heat transfer plate to enclose the heat transfer plate so as to accommodate a coolant for cooling heat from the heat transfer plate and having a coolant inlet port at its first end and a coolant outlet port at its second end so as to allow movement of the coolant, and a sealing means hermetically sealing the heat transfer plate and the case.

Abstract: A computer having a cooling apparatus and a heat exchanging device of the cooling apparatus are provided. The cooling apparatus includes a heat exchanging device for absorbing heat from heat-producing components. A passageway is provided in the heat exchanging device and a liquid coolant circulates through the passageway. A heat dissipation device has a liquid coolant reservoir having radiating fins provided on its surface. The heat exchanging device and the reservoir are connected by a first conduit and a second conduit. The liquid coolant circulates from the heat dissipation device to the heat exchanging device and back to the heat dissipation device by means of a pump. The heat dissipation device is separated from an interior space of the computer by a separating wall for isolating the heat-producing components from the flow of ambient air.

Abstract: Cooling apparatus for computers and other electronic devices includes a heat transfer device having a passageway through which a liquid coolant circulates. The coolant circulates from the heat transfer device to a heat dissipation device and back. The heat dissipation device has a reservoir with fins positioned thereon. A fan directs ambient air through the fins to dissipate heat from the liquid coolant. The fan and fins are separated from the interior space of the computer by walls to isolate the heat-producing components from flow of ambient air.

Abstract: A computer (2) has a plurality of heat-producing components, including a microprocessor chip (10). A heat transfer device (22) through which a liquid coolant (C) is circulated is mounted in heat exchanging contact on the component (10). The device (22) may be mounted directly or via a Peltier thermoelectric cooler (14) positioned between the component (10) and the device (22). Coolant (C) from the device (22) is circulated to and through a reservoir (42) mounted on an inner mounting surface (38) of a radiator (34). The radiator (34) has heat dissipating fins (40) exposed to ambient air. The power supply (6) of the computer (2) is mounted directly on the mounting surface (38) so that heat produced by the power supply (6) will be dissipated by the radiator (34). Preferably, a plurality of transistors (66) of the power supply (6) are mounted on the mounting surface (38) separately from the mounting board (64) of the power supply 6).

Abstract: A cooling system for a small computer has one or more heat transfer devices (12, 30) in intimate, heat-exchanging contact with heat-producing computer components. Liquid coolant is circulated through conduits from a reservoir (48) to the devices (12, 30). A radiator (42) is mounted on the outside of the computer housing (7) and is in heat-exchanging contact with the reservoir (48). The contact is preferably provided by a Peltier effect cooling module (46). A pump (P) is positioned in the reservoir casing (50) to pump the coolant. A brushless electric motor is mounted on the casing (50) to power the pump (P). The reservoir (48) has an upstream portion (58) and a downstream portion (60). Coolant is directed through the upstream portion (58) past heat-gathering fins (64) and into the downstream portion (60).