Patents by Inventor Kirby Sand
Kirby Sand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8390111Abstract: One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.Type: GrantFiled: October 23, 2007Date of Patent: March 5, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventor: Kirby Sand
-
Patent number: 8043880Abstract: One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.Type: GrantFiled: July 28, 2005Date of Patent: October 25, 2011Assignee: Hewlett-Packard Development, L.P.Inventors: Charles C Haluzak, John R Sterner, Kirby Sand
-
Patent number: 8007078Abstract: A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.Type: GrantFiled: October 4, 2010Date of Patent: August 30, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C Haluzak, Chien-Hua Chen, Kirby Sand
-
Patent number: 7988264Abstract: A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.Type: GrantFiled: June 24, 2010Date of Patent: August 2, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Publication number: 20110025782Abstract: A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.Type: ApplicationFiled: October 4, 2010Publication date: February 3, 2011Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Patent number: 7828417Abstract: A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet.Type: GrantFiled: April 23, 2007Date of Patent: November 9, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Publication number: 20100259583Abstract: A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.Type: ApplicationFiled: June 24, 2010Publication date: October 14, 2010Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Patent number: 7766462Abstract: A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.Type: GrantFiled: February 21, 2007Date of Patent: August 3, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Patent number: 7723811Abstract: A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.Type: GrantFiled: May 3, 2006Date of Patent: May 25, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C Haluzak, Jeffrey R Pollard, Kirby Sand, John R Sterner, Henry Kang, Chien-Hua Chen, James Denning Smith
-
Patent number: 7618682Abstract: A method for providing an anti-stiction coating on a metal surface includes reacting a vapor of perfluorooctylhydroxamic acid with the metal surface in a reaction chamber.Type: GrantFiled: September 25, 2006Date of Patent: November 17, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Paul Felice Reboa, Kirby Sand
-
Patent number: 7611919Abstract: In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.Type: GrantFiled: April 21, 2005Date of Patent: November 3, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Kirby Sand, Charles C. Haluzak, Chien-Hua Chen
-
Publication number: 20080272446Abstract: A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.Type: ApplicationFiled: May 3, 2006Publication date: November 6, 2008Inventors: Charles C. Haluzak, Jeffrey R. Pollard, Kirby Sand, John R. Sterner, Henry Kang, Chien-Hua Chen, James Denning Smith
-
Publication number: 20080259125Abstract: A microfluidic device includes first and second glass substrates bonded together. The first glass substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second glass substrate is bonded to the second opposed surface of the first glass substrate whereby an outlet of a channel formed in the second glass substrate substantially aligns with the through slot. The channel of the second glass substrate has an inlet that is larger than the outlet.Type: ApplicationFiled: April 23, 2007Publication date: October 23, 2008Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Publication number: 20080199981Abstract: A method of forming a fluid ejection device includes forming a pair of first glass layers and forming a second glass layer. Each first glass layer includes a first side and a second side with the second side defining a first fluid flow structure. The second glass layer includes a first side and a second side opposite the first side, with each respective first side and second side defining a second fluid flow structure. The second glass layer is bonded in a sandwiched position between the respective first glass layers with each respective second fluid flow structure of the second glass layer in fluid communication with the respective first fluid flow structure of the respective first glass layers to define a fluid flow pathway for ejecting a fluid.Type: ApplicationFiled: February 21, 2007Publication date: August 21, 2008Inventors: Charles C. Haluzak, Chien-Hua Chen, Kirby Sand
-
Publication number: 20080074771Abstract: A method for providing an anti-stiction coating on a metal surface includes reacting a vapor of perfluorooctylhydroxamic acid with the metal surface in a reaction chamber.Type: ApplicationFiled: September 25, 2006Publication date: March 27, 2008Inventors: Paul Felice Reboa, Kirby Sand
-
Publication number: 20080068697Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.Type: ApplicationFiled: November 1, 2007Publication date: March 20, 2008Inventors: Charles Haluzak, Kenneth Faase, John Sterner, Chien-Hua Chen, Kirby Sand, Bao-Sung Yeh, Michael Regan
-
Publication number: 20080048313Abstract: One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.Type: ApplicationFiled: October 23, 2007Publication date: February 28, 2008Inventor: Kirby Sand
-
Patent number: 7320899Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.Type: GrantFiled: October 29, 2004Date of Patent: January 22, 2008Assignee: Hewlett-Packard Development Company, L.P.Inventors: Charles C Haluzak, Kenneth Faase, John R Sterner, Chien-Hua Chen, Kirby Sand, Bao-Sung Bruce Yeh, Michael J. Regan
-
Patent number: 7303976Abstract: One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.Type: GrantFiled: May 10, 2005Date of Patent: December 4, 2007Assignee: Hewlett-Packard Development Company, L.P.Inventor: Kirby Sand
-
Publication number: 20070090479Abstract: A system for controlling bond front propagation in wafer-scale packaging includes a first substrate, a second substrate, and a bonder pressure plate having protruded structures thereon to selectively establish at least one point of contact between the first and second substrates to initiate a bond front therebetween. The protruded structures are selectively configured to control the propagation of the bond front.Type: ApplicationFiled: October 20, 2005Publication date: April 26, 2007Inventors: Chien-Hua Chen, Kirby Sand, Bradley John