Abstract: One embodiment of a microelectronic component system includes a base adapted for supporting a microelectronic component, a membrane sealed to the base, and a glass lid built-up on the membrane and hermetically sealing the membrane.

Abstract: One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.

Abstract: In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.

Abstract: A method of forming a micro-display includes forming a device that includes forming a partially reflecting layer on a first substrate and forming a plate overlying the partially reflecting layer, and adhering the device to a second substrate.

Abstract: A fluid filling system includes a vacuum filling chamber configured to receive a wafer, a conduit coupled to the vacuum filling chamber, and a vacuum pump fluidly coupled to the vacuum filling chamber through the conduit, the vacuum pump being configured to create a vacuum within the wafer level packaging cavity, wherein the vacuum filling chamber includes a body having a vacuum orifice, a first substrate sealingly coupled to the body to seal a first end of the vacuum orifice, and a second substrate sealingly coupled to the body to seal a second end of the vacuum orifice.