Abstract: An endoscope includes a housing with a distal end insertable into a cavity; an image capture device at the distal end to obtain 3D images, and process them to form a video signal; and a folded substrate folded into a U-shape having first and second legs. The image capture device includes a detector and a lens system with right and left multi-band pass filters having right pass bands that are complements of left pass bands. The lens system receives the 3D images including right and left images. The detector faces the lens system to obtain the right and left images. A processing circuit faces the proximal end behind the detector to process signals from the detector. The folded substrate includes the detector at an outer side of the first leg facing the lens system and the processing circuit at an outer side of the second leg facing the proximal end.

Abstract: A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive fabric that supports a large number of Coriolis-coupled supermodes. Such a fabric can be shaped into arbitrary waveguides that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple stationary Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.

Abstract: To isolate an active portion of a gyroscope resonator from mounting stresses propagating through a resonator attachment center, the resonator includes a stress isolation feature that includes alternating concentric symmetric regions of high and low stiffness. The resonator may be separated into a large number of thin, compliant spring elements and larger stiff mass elements, the aggregate areas of which optimized for an aggregate resonator spring constant (by selecting a width and a length of the spring elements), an aggregate mass (by selecting a size of the mass elements), a thermoelastic loss maximum (by selecting a width of the spring elements) and an operating frequency (by selecting a ratio of the aggregate spring to the aggregate mass).

Abstract: A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive “fabric” that supports a large number of Coriolis-coupled “supermodes. Such a “fabric” can be shaped into arbitrary “waveguides” that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple “stationary” Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.

Abstract: A resonator paradigm, where the resonator structure is made up of a very large number of small, coupled Coriolis sensitive units arranged in a periodic 1D or 2D (and, possibly, in the future, 3D) structure to create a Coriolis-sensitive “fabric” that supports a large number of Coriolis-coupled “supermodes. Such a “fabric” can be shaped into arbitrary “waveguides” that propagate either pulses of excitation that are Coriolis-coupled, thus enabling an acoustic version of a FOG-type gyroscope (where a pulse of excitation travels along a passive waveguide and it's phase/time delay is measured), or support multiple “stationary” Coriolis-coupled vibration modes analogous to optical laser modes in an RLG where counter-propagating modes of oscillation are maintained at constant amplitude via a continuous addition of energy.

Abstract: A MEMS accelerometer incorporating a metrology element to directly measure minute changes in measurement baseline. In particular, the MEMS accelerometer incorporates a metrology bar (MB). Embodiments also relate to stress isolation into the sensor design to isolate the sensitive areas of the chip (i.e., the metrology baseline and the proof mass mounting points) from outside stress.

Abstract: A MEMS thermal stress isolation system is disclosed. The MEMs thermal stress isolation system is a MEMS embedded hardware implementation designed to isolate the sensitive sensor die from external stresses caused by rigid attachment to packaging and to allow the sensor to perform with improved immunity to the negative impacts of rigid sensor packaging attachment. A planar, micro-etched interface structure is integrated into the MEMS wafer stack, which serves as the mechanical connection between the MEMS sensor and the external packaging.

Abstract: An endoscope includes a housing with a distal end insertable into a cavity; an image capture device at the distal end to obtain 3D images, and process them to form a video signal; and a folded substrate folded into a U-shape having first and second legs. The image capture device includes a detector and a lens system with right and left multi-band pass filters having right pass bands that are complements of left pass bands. The lens system receives the 3D images including right and left images. The detector faces the lens system to obtain the right and left images. A processing circuit faces the proximal end behind the detector to process signals from the detector. The folded substrate includes the detector at an outer side of the first leg facing the lens system and the processing circuit at an outer side of the second leg facing the proximal end.

Abstract: A dual objective endoscope for insertion into a cavity of a body for providing a stereoscopic image of a region of interest inside of the body including an imaging device at the distal end for obtaining optical images of the region of interest (ROI), and processing the optical images for forming video signals for wired and/or wireless transmission and display of 3D images on a rendering device. The imaging device includes a focal plane detector array (FPA) for obtaining the optical images of the ROI, and processing circuits behind the FPA. The processing circuits convert the optical images into the video signals. The imaging device includes right and left pupil for receiving a right and left images through a right and left conjugated multi-band pass filters. Illuminators illuminate the ROI through a multi-band pass filter having three right and three left pass bands that are matched to the right and left conjugated multi-band pass filters.

Abstract: An inertial sensor that includes a planar mechanical resonator with embedded sensing and actuation for substantially in-plane vibration and having a central rigid support for the resonator is disclosed. At least one excitation or forcing electrode is disposed within an interior of the resonator to excite in-plane vibration of the resonator, and at least one sensing or pickoff electrode is disposed within the interior of the resonator for sensing the motion of the excited resonator. In one embodiment, the planar resonator includes a plurality of slots in an annular pattern around the central rigid support. The planar resonator has a simple pair of in-plane vibration modes.

Abstract: A dual objective endoscope for insertion into a cavity of a body for providing a stereoscopic image of a region of interest inside of the body including an imaging device at the distal end for obtaining optical images of the region of interest (ROI), and processing the optical images for forming video signals for wired and/or wireless transmission and display of 3D images on a rendering device. The imaging device includes a focal plane detector array (FPA) for obtaining the optical images of the ROI, and processing circuits behind the FPA. The processing circuits convert the optical images into the video signals. The imaging device includes right and left pupil for receiving a right and left images through a right and left conjugated multi-band pass filters. Illuminators illuminate the ROI through a multi-band pass filter having three right and three left pass bands that are matched to the right and left conjugated multi-band pass filters.

Abstract: A method of fabricating a resonant vibratory sensor, such as a disc resonator gyro. A silicon baseplate wafer for a disc resonator gyro is provided with one or more locating marks. The disc resonator gyro is fabricated by bonding a blank resonator wafer, such as an SOI wafer, to the fabricated baseplate, and fabricating the resonator structure according to a pattern based at least in part upon the location of the at least one locating mark of the fabricated baseplate. MEMS-based processing is used for the fabrication processing. In some embodiments, the locating mark is visualized using optical and/or infrared viewing methods. A disc resonator gyroscope manufactured according to these methods is described.

Abstract: A method of fabricating a resonant vibratory sensor, such as a disc resonator gyro. A silicon baseplate wafer for a disc resonator gyro is provided with one or more locating marks. The disc resonator gyro is fabricated by bonding a blank resonator wafer, such as an SOI wafer, to the fabricated baseplate, and fabricating the resonator structure according to a pattern based at least in part upon said location of said at least one locating mark of said fabricated baseplate. MEMS-based processing is used for the fabrication processing. In some embodiments, the locating mark is visualized using optical and/or infrared viewing methods. A disc resonator gyroscope manufactured according to these methods is described.

Abstract: An inertial sensor includes a mesoscaled disc resonator comprised of micro-machined substantially thermally non-conductive wafer with low coefficient of thermal expansion for sensing substantially in-plane vibration, a rigid support coupled to the resonator at a central mounting point of the resonator, at least one excitation electrode within an interior of the resonator to excite internal in-plane vibration of the resonator, and at least one sensing electrode within the interior of the resonator for sensing the internal in-plane vibration of the resonator. The inertial sensor is fabricated by etching a baseplate, bonding the substantially thermally non-conductive wafer to the etched baseplate, through-etching the wafer using deep reactive ion etching to form the resonator, depositing a thin conductive film on the through-etched wafer.

Abstract: Parametrically disciplined operation of a symmetric nearly degenerate mode vibratory gyroscope is disclosed. A parametrically-disciplined inertial wave gyroscope having a natural oscillation frequency in the neighborhood of a sub-harmonic of an external stable clock reference is produced by driving an electrostatic bias electrode at approximately twice this sub-harmonic frequency to achieve disciplined frequency and phase operation of the resonator. A nearly symmetric parametrically-disciplined inertial wave gyroscope that can oscillate in any transverse direction and has more than one bias electrostatic electrode that can be independently driven at twice its oscillation frequency at an amplitude and phase that disciplines its damping to zero in any vibration direction. In addition, operation of a parametrically-disciplined inertial wave gyroscope is taught in which the precession rate of the driven vibration pattern is digitally disciplined to a prescribed non-zero reference value.

Abstract: The present invention discloses an inertial sensor comprising a planar mechanical resonator with embedded sensing and actuation for substantially in-plane vibration and having a central rigid support for the resonator. At least one excitation or torquer electrode is disposed within an interior of the resonator to excite in-plane vibration of the resonator and at least one sensing or pickoff electrode is disposed within the interior of the resonator for sensing the motion of the excited resonator. In one embodiment, the planar resonator includes a plurality of slots in an annular pattern; in another embodiment, the planar mechanical resonator comprises four masses; each embodiment having a simple degenerate pair of in-plane vibration modes.

Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Abstract: The present invention discloses an inertial sensor having an integral resonator. A typical sensor comprises a planar mechanical resonator for sensing motion of the inertial sensor and a case for housing the resonator. The resonator and a wall of the case are defined through an etching process. A typical method of producing the resonator includes etching a baseplate, bonding a wafer to the etched baseplate, through etching the wafer to form a planar mechanical resonator and the wall of the case and bonding an end cap wafer to the wall to complete the case.

Abstract: A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

Abstract: An inertial sensor includes a mesoscaled disc resonator comprised of micro-machined substantially thermally non-conductive wafer with low coefficient of thermal expansion for sensing substantially in-plane vibration, a rigid support coupled to the resonator at a central mounting point of the resonator, at least one excitation electrode within an interior of the resonator to excite internal in-plane vibration of the resonator, and at least one sensing electrode within the interior of the resonator for sensing the internal in-plane vibration of the resonator. The inertial sensor is fabricated by etching a baseplate, bonding the substantially thermally non-conductive wafer to the etched baseplate, through-etching the wafer using deep reactive ion etching to form the resonator, depositing a thin conductive film on the through-etched wafer.