Patents by Inventor Kishore N. Renjan
Kishore N. Renjan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107249Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.Type: ApplicationFiled: March 9, 2023Publication date: March 28, 2024Applicant: Apple Inc.Inventors: Kyusang KIM, Ali N. Ergun, Anthony D. Minervini, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan
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Publication number: 20240032203Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: October 3, 2023Publication date: January 25, 2024Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11864322Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: GrantFiled: February 3, 2023Date of Patent: January 2, 2024Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Publication number: 20230386865Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.Type: ApplicationFiled: May 12, 2023Publication date: November 30, 2023Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama
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Patent number: 11817383Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: GrantFiled: March 3, 2022Date of Patent: November 14, 2023Assignee: Apple Inc.Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Patent number: 11765838Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.Type: GrantFiled: August 20, 2021Date of Patent: September 19, 2023Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
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Publication number: 20230213715Abstract: Optical packages and methods of assembly are described in which various optical structures are integrated to increase efficiency. In an embodiment, an optical package includes an optical component with integrated guard fence to prevent the flow of adjacent opaque insulating material onto an optical surface. Additional optic structures are described such as light blocking structures within routing layer to reduce total internal reflection (TIR) within the routing layers, optical lenses, and the use of sacrificial layers to protect optical surfaces of the optical components during assembly.Type: ApplicationFiled: January 3, 2022Publication date: July 6, 2023Inventors: Scott D. Morrison, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Lan H. Hoang, Manoj Vadeentavida
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Publication number: 20230189445Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: February 3, 2023Publication date: June 15, 2023Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11651976Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.Type: GrantFiled: June 24, 2020Date of Patent: May 16, 2023Assignee: Apple Inc.Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama
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Publication number: 20230089258Abstract: Stacked circuit board structures and methods of assembly are described. In an embodiment, a stacked circuit board structure includes first circuit board and a second circuit board including a plurality of pins mounted thereon, and the plurality of pins are secured in a plurality of receptacles that are coupled with the first circuit board to provide electrical connection between the first circuit board and the second circuit board.Type: ApplicationFiled: September 17, 2021Publication date: March 23, 2023Inventors: Lan H. Hoang, Takayoshi Katahira, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Manoj Vadeentavida, Jing Tao
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Publication number: 20230078536Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.Type: ApplicationFiled: June 3, 2022Publication date: March 16, 2023Applicant: Apple Inc.Inventors: Ali N. Ergun, Bilal Mohamed Ibrahim Kani, Chang Liu, Ethan L. Huwe, Jeffrey J. Terlizzi, Jerzy S. Guterman, Jue Wang, Kishore N. Renjan, Kyusang Kim, Lan H. Hoang, Mandar S. Painaik, Manoj Vadeentavida, Sarah B. Gysbers, Takayoshi Katahira, Zhiqi Wang
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Publication number: 20230055647Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.Type: ApplicationFiled: August 20, 2021Publication date: February 23, 2023Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
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Publication number: 20230056922Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.Type: ApplicationFiled: June 10, 2022Publication date: February 23, 2023Inventors: Bilal Mohamed Ibrahim Kani, Ali N. Ergun, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Benjamin J. Grena, David M. Kindlon, Lan H. Hoang
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Patent number: 11576262Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: GrantFiled: March 25, 2021Date of Patent: February 7, 2023Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Patent number: 11552053Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.Type: GrantFiled: June 25, 2020Date of Patent: January 10, 2023Assignee: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran
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Publication number: 20220270955Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: ApplicationFiled: March 3, 2022Publication date: August 25, 2022Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Patent number: 11313741Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: GrantFiled: December 11, 2019Date of Patent: April 26, 2022Assignee: Apple Inc.Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida
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Publication number: 20210405313Abstract: Optical sensor modules and methods of fabrication are described. In an embodiment, an optical component is mounted on a module substrate. In an embodiment, a pillar of stacked wireballs adjacent the optical component is used for vertical connection between the module substrate and a top electrode pad of the optical component.Type: ApplicationFiled: June 25, 2020Publication date: December 30, 2021Applicant: Apple Inc.Inventors: Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Praveesh Chandran
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Publication number: 20210337671Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.Type: ApplicationFiled: March 25, 2021Publication date: October 28, 2021Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
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Publication number: 20210181039Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.Type: ApplicationFiled: December 11, 2019Publication date: June 17, 2021Inventors: Pierpaolo Lupo, Bilal Mohamed Ibrahim Kani, Kishore N. Renjan, Kyusang Kim, Manoj Vadeentavida