Patents by Inventor Kishore N. Renjan

Kishore N. Renjan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded Packaging Concepts for Integration of ASICs and Optical Components
    Publication number: 20210090908
    Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.
    Type: Application
    Filed: June 24, 2020
    Publication date: March 25, 2021
    Inventors: Kishore N. Renjan, Bilal Mohamed Ibrahim Kani, Kyusang Kim, Manoj Vadeentavida, Pierpaolo Lupo, Prashanth S. Holenarsipur, Praveesh Chandran, Vinodh Babu, Yuta Kuboyama
  • Invisible compartment shielding
    Patent number: 10037948
    Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: July 31, 2018
    Assignee: APPLE INC.
    Inventors: Phillip R. Sommer, Kishore N. Renjan, Manoj Vadeentavida
  • INVISIBLE COMPARTMENT SHIELDING
    Publication number: 20180053731
    Abstract: A method for shielding a compartment in a module of an electronic device includes molding the module using a mold material that activates when a laser is applied. The method also includes cutting a trench on the mold of the module around a certain portion of the module using the laser. The method further includes plating the trench using a certain metal. The method also includes filling the trench with a filler material. The method further includes encapsulating the module, the mold, the trench, and the filler material.
    Type: Application
    Filed: August 19, 2016
    Publication date: February 22, 2018
    Inventors: Phillip R. Sommer, Kishore N. Renjan, Manoj Vadeentavida