Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit generating an induced current according to a change in a current applied to the light emitting diode, a main switch controlling power applied to the LED string according to an on/off switching operation, and a capacitor charged with a voltage of the power applied to the LED string when the main switch is switched on and applying the charged voltage to the LED string when the main switch is switched off.

Abstract: A light source module may include a frame part having a plurality of mounting regions arranged to be positioned on different levels and a plurality of light emitting units detachably mounted on the plurality of mounting regions. Each of the plurality of light emitting units includes a base disposed on each mounting region, and a light emitting device disposed above the base and positioned spaced-apart from the mounting region so as to form a space through which air flows, between the mounting region and the light emitting device.

Abstract: There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit for generating an induced current according to a change in a current applied to the light emitting diode. A main switch controls power applied to the LED string according to an on/off switching operation A capacitor is charged with a voltage of the power applied to the LED string when the main switch is switched on, and applies the charged voltage to the LED string when the main switch is switched off.

Abstract: A light source assembly includes a plurality of light source modules detachably connected to one another. Each light source module includes a frame part, an electrical connection part, and at least one light emitting device. The frame part includes a female coupling disposed in one side surface thereof and a male coupling disposed on another side surface thereof and configured to be engaged with a female coupling of another light source module of the plurality. The electrical connection part is disposed on an upper surface of the frame part and extends onto the one side surface having the female coupling disposed therein and onto the other side surface having the female coupling disposed thereon. The at least one light emitting device is mounted on the electrical connection part and disposed on the upper surface of the frame part.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: Provided is a light-emitting device package module including a light-emitting device; a first circuit board receiving the light-emitting device, and electrically connected with the light-emitting device; and a second circuit board assembled with the first circuit board by using a connection member, and electrically connected with the first circuit board.

Abstract: A light source assembly includes a plurality of light source modules detachably connected to one another. Each light source module includes a frame part, an electrical connection part, and at least one light emitting device. The frame part includes a female coupling disposed in one side surface thereof and a male coupling disposed on another side surface thereof and configured to be engaged with a female coupling of another light source module of the plurality. The electrical connection part is disposed on an upper surface of the frame part and extends onto the one side surface having the female coupling disposed therein and onto the other side surface having the female coupling disposed thereon. The at least one light emitting device is mounted on the electrical connection part and disposed on the upper surface of the frame part.

Abstract: There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit for generating an induced current according to a change in a current applied to the light emitting diode. A main switch controls power applied to the LED string according to an on/off switching operation A capacitor is charged with a voltage of the power applied to the LED string when the main switch is switched on, and applies the charged voltage to the LED string when the main switch is switched off.

Abstract: There is provided a light source apparatus including at least one light emitting diode (LED) string including at least one light emitting diode and at least one inductance unit generating an induced current according to a change in a current applied to the light emitting diode, a main switch controlling power applied to the LED string according to an on/off switching operation, and a capacitor charged with a voltage of the power applied to the LED string when the main switch is switched on and applying the charged voltage to the LED string when the main switch is switched off.

Abstract: A light-emitting device package including: a substrate including a first surface and a second surface; a light-emitting chip mounted on the first surface; and an electrode pad portion that is disposed on the second surface and electrically connects the light-emitting chip to an external device, wherein the electrode pad portion has a shape with rotational symmetry with respect to a predetermined angle when a normal line running through a center of the second surface is used as a rotation axis.

Abstract: A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including an added wire bonding unit for connecting a redundant bond finger to an added bond finger, or an added wire bonding unit for connecting a redundant bond finger connected to a first printed circuit pattern to a redundant solder ball pad connected to a second printed circuit pattern.

Abstract: A linear channel select filter for an Intermediate Frequency selector of a satellite broadcasting tuner, linearly changes a desired frequency by adjusting an output current, and includes: a transconductance (GM) current cell controller for determining a control voltage according to a select signal, generating the output current according to an differential input voltage, linearly controlling the output current according to the control voltage, and providing a linearly variable resistance according to the linearly controlled output current, and a capacitor circuit coupled to the GM cell controller to provide a capacitance to generate a cutoff frequency voltage according to the output current and the variable resistance. An occupying area and a size of the filter are reduced.