Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: A light emitting device (LED) array module includes at least one terminal, a light emitting device (LED) array, and a rank storing device. The LED array includes a plurality of LEDs that emit light when a current is supplied from the outside of the LED array module. The rank storing device is configured to store rank information of the LED array that depends on brightness characteristics of the LEDs, and to output a signal corresponding to the rank information via the at least one terminal.

Abstract: Provided is a light-emitting device package module including a light-emitting device; a first circuit board receiving the light-emitting device, and electrically connected with the light-emitting device; and a second circuit board assembled with the first circuit board by using a connection member, and electrically connected with the first circuit board.

Abstract: A light-emitting device package including: a substrate including a first surface and a second surface; a light-emitting chip mounted on the first surface; and an electrode pad portion that is disposed on the second surface and electrically connects the light-emitting chip to an external device, wherein the electrode pad portion has a shape with rotational symmetry with respect to a predetermined angle when a normal line running through a center of the second surface is used as a rotation axis.

Abstract: A solar cell module having a reduced thickness using a flip-chip approach includes a transparent substrate, a transparent electrode interconnection disposed on the transparent substrate, and a plurality of solar cells disposed on the transparent electrode interconnection, each solar cell having at least one protrusion formed on one surface of the solar cell, the protrusion being bonded to the transparent electrode interconnection.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A semiconductor package includes a semiconductor chip having first and second pads, a first insulation layer pattern formed on the semiconductor chip and having first and second openings that expose the first and the second pads, respectively, a first conductive layer pattern elongated along the first insulation layer pattern from the first pad, a first external terminal formed on the first conductive layer pattern, a second insulation layer pattern formed on the first conductive layer pattern and the first insulation layer pattern to expose the first external terminal and having a third opening in communication with the second opening, a second conductive layer pattern elongated along the second insulation layer pattern from the second pad, and a second external terminal formed on the second conductive layer pattern.

Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including an added wire bonding unit for connecting a redundant bond finger to an added bond finger, or an added wire bonding unit for connecting a redundant bond finger connected to a first printed circuit pattern to a redundant solder ball pad connected to a second printed circuit pattern.

Abstract: A printed circuit board for a high-speed semiconductor package uses bonding wires as a shield structure, e.g., to shield an open portion of signal transmission lines, and thereby reduce the likelihood of coupling noises, e.g., between signal transmission lines.

Abstract: In one embodiment, a circuit substrate strip includes molding blocks composed of a plurality of circuit substrate unit areas. An integrated circuit chip is attached onto each circuit substrate unit area and connected electrically thereto and a heat slug is attached thereon. Resin sealant is applied on the molding blocks by group molding and the cover of the heat slug is exposed out of the upper surface of the resin sealant. At each corner of the circuit substrate unit area, a supporter base is formed. Supporters extending downwards from the four corners of the cover are connected onto a supporter base. After formation of solder balls, the circuit substrate unit areas are separated into individual semiconductor packages by cutting the circuit substrate strip.

Abstract: A semiconductor package utilizing an existing substrate regardless of the change of the semiconductor chip design, and manufacturing method thereof are provided. The semiconductor package including an added wire bonding unit for connecting a redundant bond finger to an added bond finger, or an added wire bonding unit for connecting a redundant bond finger connected to a first printed circuit pattern to a redundant solder ball pad connected to a second printed circuit pattern.