Abstract: The present invention provides an imaging module manufacturing method capable of performing positioning of an imaging element unit and a lens unit with high accuracy and provides an imaging module manufacturing device. In a manufacturing device (200), in a state where a top surface (11a) of a housing (11) of a lens unit (10) is adsorbed to an adsorption surface (75d) of an adsorption head (75a) so as to hold the lens unit (10) on a Z axis and an imaging element unit (20) is held on the Z axis, a Z axis direction position of the imaging element unit (20) with respect to the lens unit (10) is changed, a measurement chart (89) is imaged by the imaging element (27), and a position and an inclination of the imaging element unit (20) with respect to the lens unit (10) are adjusted based on imaging signals obtained by the imaging.

Abstract: The present invention provides an imaging module manufacturing method capable of performing positioning of an imaging element unit and a lens unit with high accuracy and provides an imaging module manufacturing device. In a manufacturing device (200), in a state where a top surface (11a) of a housing (11) of a lens unit (10) is adsorbed to an adsorption surface (75d) of an adsorption head (75a) so as to hold the lens unit (10) on a Z axis and an imaging element unit (20) is held on the Z axis, a Z axis direction position of the imaging element unit (20) with respect to the lens unit (10) is changed, a measurement chart (89) is imaged by the imaging element (27), and a position and an inclination of the imaging element unit (20) with respect to the lens unit (10) are adjusted based on imaging signals obtained by the imaging.

Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.

Abstract: To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal expansion smaller than the transparent substrate (20) and approximately equal to a wafer (31). Next, the transparent substrate (20) is diced into plural pieces to form a plurality of cover glasses (6). Then heat cure adhesive (32) is coated on each spacer (5) and the spacers (5) are attached on the wafer (31) on which a plurality of light receiving section (3) and pads (10) are previously formed. Finally, the heat cure adhesive (32) is heated to be cured.

Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.

Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.

Abstract: A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.

Abstract: To a transparent substrate (20) on which a plurality of spacers (5) are formed, an infrared cut filter (IRCF) substrate (27) is attached. The IRCF substrate (27) has a coefficient of thermal expansion smaller than the transparent substrate (20) and approximately equal to a wafer (31). Next, the transparent substrate (20) is diced into plural pieces to form a plurality of cover glasses (6). Then heat cure adhesive (32) is coated on each spacer (5) and the spacers (5) are attached on the wafer (31) on which a plurality of light receiving section (3) and pads (10) are previously formed. Finally, the heat cure adhesive (32) is heated to be cured.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: The present invention provides a method of cleaning a cover glass having a spacer which is to be incorporated in a solid image pickup device, comprising: a dry cleaning step performed after dry etching; a wipe-off cleaning step performed after the dry cleaning step; a primary wet cleaning step performed after the wipe-off cleaning step; and a secondary wet cleaning step performed after the primary wet cleaning step, wherein the cover glass having a spacer is fabricated by a manufacturing process including the steps of: bonding a spacer substrate to a glass substrate with an adhesive; applying a photoresist to the spacer substrate; exposing and developing the photoresist by use of a photomask and forming an etching mask corresponding to the spacer on the spacer substrate; and forming a spacer on the glass substrate by the dry etching the spacer substrate.

Abstract: A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: A device for joining substrates (11) is provided inside a clean booth (12). a single axis robot (46) and a five axis robot (47) convey a wafer (25) and a glass substrate (33). A transcribing station (91) obtains a transcribing film (112) on which adhesive is applied from a film supplying section (113), and presses the transcribing film (112) to the glass substrate (33) so as to transcribe the adhesive to the glass substrate (33). A peeling station (92) peels the transcribing film (112) from the glass substrate (33). A joining station (57) positions the wafer (25) and the glass substrate (33), adjusts parallelism of joining surfaces of the wafer (25) and the glass substrate (33), and joins these substrates together. Since the handling and the joining of the wafer (25), the glass substrate (33) and the transcribing film (112) are performed in the clean booth, it is prevented that a yield ratio of the product decreases because of the adhesion of foreign matters.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: The compact image pickup module includes an imaging lens, a lens-barrel holding the imaging lens, an image pickup element, an image pickup element holder holding the pickup element and into which the barrel is fitted so as to be rotatable about an optical axis of the imaging lens and movable in a direction of the optical axis, a cylindrical cam having as an upper or a lower surface thereof, an annular cam surface whose center is set at the optical axis and being formed in one of the barrel and the element holder and an abutment member being abutted against the cam surface under a state where the barrel is fitted into the element holder and formed in the other. After focusing is performed through relative rotation of the barrel and the element holder, the barrel and the element holder are fixed to each other. The lens unit includes the barrel and the imaging lens having multiple lenses held by the barrel.

Abstract: The present invention provides a method of cleaning a cover glass having a spacer which is to be incorporated in a solid image pickup device, comprising: a dry cleaning step performed after dry etching; a wipe-off cleaning step performed after the dry cleaning step; a primary wet cleaning step performed after the wipe-off cleaning step; and a secondary wet cleaning step performed after the primary wet cleaning step, wherein the cover glass having a spacer is fabricated by a manufacturing process including the steps of: bonding a spacer substrate to a glass substrate with an adhesive; applying a photoresist to the spacer substrate; exposing and developing the photoresist by use of a photomask and forming an etching mask corresponding to the spacer on the spacer substrate; and forming a spacer on the glass substrate by the dry etching the spacer substrate.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: The present invention provides a method of manufacturing solid-state imaging devices comprising the steps of: forming a large number of solid-state image sensing devices over a wafer; forming, in positions matching said solid-state image sensing devices on the under face of a transparent flat plate to be joined to said wafer, frame-shaped spacers of a prescribed thickness each in a shape of surrounding an individual solid imaging element; aligning said wafer and said transparent flat plate opposite each other; supporting with a fixed table substantially the whole of one of the under face of said wafer and the upper face of said transparent flat plate, supporting substantially the other face with a pressing member via an elastic member, and thereby joining said wafer and said transparent flat plate via said spacers by the pressing member; and splitting said wafer and said transparent flat plate individual solid-state image sensing devices.

Abstract: A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.