Abstract: A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.

Abstract: The compact image pickup module includes an imaging lens, a lens-barrel holding the imaging lens, an image pickup element, an image pickup element holder holding the pickup element and into which the barrel is fitted so as to be rotatable about an optical axis of the imaging lens and movable in a direction of the optical axis, a cylindrical cam having as an upper or a lower surface thereof, an annular cam surface whose center is set at the optical axis and being formed in one of the barrel and the element holder and an abutment member being abutted against the cam surface under a state where the barrel is fitted into the element holder and formed in the other. After focusing is performed through relative rotation of the barrel and the element holder, the barrel and the element holder are fixed to each other. The lens unit includes the barrel and the imaging lens having multiple lenses held by the barrel.

Abstract: A semiconductor substrate of a solid state imaging device is connected to a cover glass, and then a backgrind is performed so as to make the thickness smaller. On a first face of the semiconductor substrate is formed plural units which is constructed of image sensors and plural contact terminals. At positions of the contact terminals, plural through-holes are formed on the bottom side of the semiconductor substrate, and the contact terminals appear on a second surface of the semiconductor substrate. On an interconnection circuit pattern of the assembly substrate are formed stud bumps. When the semiconductor substrate is assembled onto the assembly substrate, the stud bumps enter into the through-holes to contact to the contact terminals. Thus the interconnection circuit pattern is electrically connected to the image sensors.

Abstract: A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.