Abstract: Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20), a cover member (30) that reciprocates in a direction to be close to or separated from the base member (20), a plurality of contacts (40), an adaptor (50) that moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package, a latch member (60) that rotationally shifts with reciprocation of the cover member (30), and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a Ball Grid Array (BGA), and presses down the BGA placed on the adaptor (50) in the vertical direction.

Abstract: Provided is a socket which protects an upper surface of a semiconductor device from being scratched due to contact, by using a latch plate. A socket (10) includes a base member (20); a cover member (30) which reciprocates in a direction to be close to or separated from the base member (20); a plurality of contacts (40); an adaptor (50), which moves in a direction to be close to or separated from the base member and provides a surface for placing a semiconductor package; a latch member (60) which rotationally shifts with reciprocation of the cover member (30); and a latch plate (70) connected to the latch member (60). The latch plate (70) prevents the leading edge of the latch member (60) from being directly brought into contact with a BGA, and presses down the BGA placed on the adaptor (50) in the vertical direction.

Abstract: A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Abstract: A socket adaptor 10 made of an electrically insulating material has a main adaptor body 12 on which a plurality of through holes 14 containing an upper opening and a lower opening has been formed. In certain preferred embodiments a probe pin 60 and coil spring 62 is placed in each through hole 14. An electrical engagement clipping part 68 for clipping a contact inserted in a respective through hole from said upper opening is formed on the upper end of each probe pin 60. The coil spring 62 is installed on each probe pin and biases the respective probe pin toward a position so that a tip formed on the lower end of the probe pin protrudes from the lower opening.

Abstract: In a contact assembly, a first set of contacts (30-1 through 30-5) is arranged on a first surface and a second set of contacts (40-5 through 4-1) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions (12) of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions (20) of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P2) of the second terminal portions (20) of the first and the second sets of contacts is expanded to a greater degree than the pitch (P1) of the first terminal portions (12) in two preferred embodiments.

Abstract: In a contact assembly, a first set of contacts (30-1 through 30-5) is arranged on a first surface and a second set of contacts (40-5 through 4-1) is arranged on a second surface with respective contacts of each set used as pairs. A plurality of first and second sets are stacked one on top of another separated by insulators, the first terminal portions (12) of respective first and the second sets of contacts are aligned in the direction of stacking and the second terminal portions (20) of the first and second sets of contacts are arranged in such a fashion as to be symmetrical relative to a median line. The pitch (P2) of the second terminal portions (20) of the first and the second sets of contacts is expanded to a greater degree than the pitch (P1) of the first terminal portions (12) in two preferred embodiments.

Abstract: A test socket 10 of the present invention includes a base member 20, a cover member 30 which is installed on base 20 to move in reciprocal straight line movement between a first position away from the base and a second position adjacent the base and a plurality of contact members 40 that are fixed in the base and are capable of making contact with terminals 2 on a semiconductor device 1 when such device 1 is mounted on base 20. A latch member 60 is supported on base 20 in a rotatable manner to move in linkage with the movement of cover member 30. A compression member 80 is pivotably attached to a tip portion 62 of latch member 60 for pressing semiconductor part 1 onto base 20 to achieve reliable contacting between terminals 2 and contacts 40 in response to movement of cover member 30. This socket design will provide for wide area engagement between the surface of semiconductor part 1 and compression member 80 to prevent damage to the semiconductor part 1 during testing.

Abstract: A socket (10) has a base member (20), a cover member (30) which is mounted for alternating motion toward and away from base member (20), a plurality of contacts (40) having an end fixed to the base member (20), a contact regulating member (50) that regulates the position of the movable ends (42, 92) of the contact and an adaptor (60) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member (50). When adaptor (60) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor (60) has been moved toward the contact regulating member (50), the movable ends of the contacts protrude from each through-hole (65) of adaptor (60) for engagement with the solder balls of a BGA device (11), placed on the adaptor (60). The cover member is linked to the base member and latches (70) having a BGA device pressing tip (72) are rotatable with movement of the cover.

Abstract: A socket (1) has a base (2) on which rows of contact pins 4 are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor (5) having rows of contact holes (5d) arranged extending through a seating surface (5c) and which is capable of vertical movement relative to the base (2) so that contact tips (4a) of contact pins (4) can move in respective contact holes (5d). Latches (21) are arranged to be able to press the IC package on the seating surface (5c) of the adaptor (5) and a vertically movable regulator (7) is arranged at a selected position relative to adaptor (5) when stop surfaces (7e) of the regulator are engaged with a part (4e) of the contact pins (4) so as to regulate the position of the contact tips (4a) in the contact holes (5d).

Abstract: A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).

Abstract: A socket (10) has a base member (20), a cover member (30) which is mounted for alternating motion toward and away from base member (20), a plurality of contacts (40) having an end fixed to the base member (20), a contact regulating member (50) that regulates the position of the movable ends (42, 92) of the contact and an adaptor (60) having a seating surface, the adaptor which is mounted for alternating motion toward and away from the contact regulating member (50). When adaptor (60) is removed from the contact regulating member, the movable ends of the contacts do not protrude through the seating surface and when adaptor (60) has been moved toward the contact regulating member (50), the movable ends of the contacts protrude from each through-hole (65) of adaptor (60) for engagement with the solder balls of a BGA device (11), placed on the adaptor (60). The cover member is linked to the base member and latches (70) having a BGA device pressing tip (72) are rotatable with movement of the cover.

Abstract: A test socket 10 of the present invention includes a base member 20, a cover member 30 which is installed on base 20 to move in reciprocal straight line movement between a first position away from the base and a second position adjacent the base and a plurality of contact members 40 that are fixed in the base and are capable of making contact with terminals 2 on a semiconductor device 1 when such device 1 is mounted on base 20. A latch member 60 is supported on base 20 in a rotatable manner to move in linkage with the movement of cover member 30. A compression member 80 is pivotably attached to a tip portion 62 of latch member 60 for pressing semiconductor part 1 onto base 20 to achieve reliable contacting between terminals 2 and contacts 40 in response to movement of cover member 30. This socket design will provide for wide area engagement between the surface of semiconductor part 1 and compression member 80 to prevent damage to the semiconductor part 1 during testing.

Abstract: A socket (10) has a plurality of contacts (13) arranged in base (11). Each contact has one arm (13a) for contacting a solder ball of an electronic package (2). A slider (12) has a seat (12a) for package (2), a plurality of terminal receiving holes (12b), a terminal engagement surface (12c) formed at each terminal receiving hole for engagement with a respective solder ball and a plurality of contact receiving holes (12d). When slider (12) is moved in one directions package (2) can be seated with each ball disposed in a respective terminal receiving hole. When the slider returns, each ball is elastically contacted between an arm (13a) and a terminal engagement surface (12c).

Abstract: A socket (1) has a base (2) on which rows of contact pins 4 are arranged, the contact pins being elastically deformable in the vertical direction, an adaptor (5) having rows of contact holes (5d) arranged extending through a seating surface (5c) and which is capable of vertical movement relative to the base (2) so that contact tips (4a) of contact pins (4) can move in respective contact holes (5d). Latches (21) are arranged to be able to press the IC package on the seating surface (5c) of the adaptor (5) and a vertically movable regulator (7) is arranged at a selected position relative to adaptor (5) when stop surfaces (7e) of the regulator are engaged with a part (4e) of the contact pins (4) so as to regulate the position of the contact tips (4a) in the contact holes (5d).

Abstract: A socket 1 for testing an electric part 10 has a plurality of contact members 4 which are arranged in the shape of a matrix that are held by a contact holder unit 3 which is secured in a central aperture 6 of socket base 2. The contact holder unit 3 contains a plurality of contact holders 30 which each hold one row of contact members 4 having a thickness equal to the pitch p between neighboring contact members, that are joined together.

Abstract: A socket (1) has a base (10) which forms a recess (10d) for receiving a support member (12). The support member (12) has a recessed surface (12a) for carrying a contact film (14) and has bores for mounting spring contact elements (15). The spring contact elements engage contact members (14b) of contact film (14) from below the film. An adapter (13) has a seat (13b) for a BGA package (2) for exposing solder balls (2a) to contact members (14b) from a location above the film. Socket terminal pins (11b) are electrically connected to spring contact elements (15) through circuit paths (13c) on a pitch expansion substrate (11). A cover (20) and a compression member (30) apply a force to the package.

Abstract: A socket (2) for removably mounting a BGA package. A plurality of contacts (7) are mounted in a base (4), the contacts each having a pair of arms (7a and 7b) for effecting compressive electrical contact of the solder balls of the BGA package being held. A slider (5) is slidably mounted on the base (4) for opening and closing of the arms. An external force is applied in a prescribed direction at a cam follower portion (52) of the slider by a cam member (20) provided on a diagonal line of a generally square base (4). The cam engages the cam follower portion (52) of the slider at a selected angle of inclination and is movable in a direction which crosses, at a right angle, the moving direction of the slider.

Abstract: A socket (1) has a base (10) which forms a recess (10d) for receiving a support member (12). The support member (12) has a recessed surface (12a) for carrying a contact film (14) and has bores for mounting spring contact elements (15). The spring contact elements engage contact members (14b) of contact film (14) from below the film. An adapter (13) has a seat (13b) for a BGA package (2) for exposing solder balls (2a) to contact members (14b) from a location above the film. Socket terminal pins (11b) are electrically connected to spring contact elements (15) through circuit paths (13c) on a pitch expansion substrate (11). A cover (20) and a compression member (30) apply a force to the package.

Abstract: A socket having a base (2) which can removably mount a BGA package (9) and a plurality of contact members (6) which are arranged in conformity with the pattern of terminal solder balls (11) of BGA package (9) on base (2) and which have a pair of arms (6a) and (6b) that are capable of opening or closing for pressure contact in the state of sandwiching each terminal of BGA package (9). Partition walls (4a) are provided on slider (4) which is capable of moving in a direction normal to the opening and closing direction of arms (6a) and (6b), the partition walls engage with the pairs of arms of the contact maker (6) respectively, with the arms (6a) and (6b) being opened or closed by the movement of the partition wall.

Abstract: A socket (2) for removably mounting a BGA package. A plurality of contacts (7) are mounted in a base (4), the contacts each having a pair of arms (7a and 7b) for effecting compressive electrical contact of the solder balls of the BGA package being held. A slider (5) is slidably mounted on the base (4) for opening and closing of the arms. An external force is applied in a prescribed direction at a cam follower portion (52) of the slider by a cam member (20) provided on a diagonal line of a generally square base (4). The cam engages the cam follower portion (52) of the slider at a selected angle of inclination and is movable in a direction which crosses, at a right angle, the moving direction of the slider.