Abstract: A socket (10) includes an adaptor (28) which has a seating surface (28b) for an IC (100) and which has a plurality of contact member receiving holes (28d) in the seating surface. The tips (14c) of a plurality of contact members (14) are received through the contact member receiving holes (28d) of the adaptor, with contact established with each respective terminal (101) of the IC (100) that has been placed on the seating surface. The IC on the seating surface is held by means of rotary latches (22). The latches (22) have an opened position for placement of the IC on the seating surface of the adaptor and a closed position for holding the IC from above it, rotating about a shaft (32) fixed to the base. A cover (20) is movable between first and second positions and a links (24) connected to the cover (24) open the latches when the cover is at a first position and close the latches when the cover is at a second position.

Abstract: A socket (1) includes a body (1a) and a cover (3). Body (1a) has a base (2) having a horizontally movable slide (4) thereon on which a BGA package can be mounted and a plurality of contact members (6) arranged on base (2) corresponding to a pattern of solder balls of the BGA package. Each of contact members (6) has a pair of spring arms (6a, 6b) which can be opened and closed in response to movement of slide (4). In one embodiment, a cover (3) is vertically movable relative to body (1a). The cover (3) has motion transfer portions (31) having a wedge shape which are engageable with tapered force receiving portions (43) of slide(4). As cover (3) is pushed down, engagement surfaces (31) of motion transfer portions (30) engage force receiving surfaces (43) of slide (4) and slide (4) moves so that arms (6a, 6b) of contact members (6) are opened. In another embodiment, the motion transfer parts (31) are provided on a head (11) which has an air suction holder for a BGA package.

Abstract: A socket (10) having a base (12), an adapter (24) which has a mounting seat for a semiconductor device (100) and which is installed on the base, and a plurality of contact members (14) which are caused to engage respective terminals of the semiconductor device that has been placed on the mounting seat of the adapter. Each contact member (14) has a pair of arms (90, 130, 144) provided by the bifurcation of one end, with the other end being fixed to the base. Each contact member is caused to nip a respective terminal (102) of the semiconductor device arranged on the mounting seat at the tip portion of the pair of arms and has butting surfaces (92, 131, 148) that determine the minimum spacing distance of the tip portions of the arms on the opposing sides of each pair of arms.

Abstract: A socket (1) for removably receiving semiconductor devices (8) for testing purposes has film contacts (81) each having a continuous or discontinuous annulus (71, 73, 76, 78) that has been formed on a film substrate and with a recess (72, 74, 77, 79) formed within the annulus exposed at a bottom of a seating or accommodating portion (31). When a BGA type semiconductor device (8) is received in the accommodating part (31) and a cover (16) is closed, electrically conductive balls (9) on the bottom of the semiconductor device (8) are pressed against respective film annular contacts (81, 82, 83, 84) thereby effecting an electric connection. Since the bottom most portion of the electrically conductive balls (9) are located within the recesses of the annular contacts, they will not be deformed. Since the film contacts (81) are prepared by etching and plating, the pitch can be easily narrowed, or otherwise modified.

Abstract: A plurality of contacts (6) are arranged on a base (2) in conformity with a pattern of solder ball terminals (11) of a BGA package (9). Each contact (6) has a pair of arms (6a and 6b) which flexibly open or close to effect contact disengagement or compressive contact engagement sandwiching the solder balls of the BGA package. A slide member (4) which is capable of sliding in the opening and closing direction of the arms (6a and 6b) of the contacts (6) is provided on the base and is constructed in such a way that the arms (6a and 6b) of each contact run through the slide member (4). A lead guide (7) is vertically slidable on positioning parts (2a) depending downwardly from the base (2) for receiving lead portions (6d) in upper, relatively larger bore portions (70a) and guiding the lead portions as the body is mounted on a circuit board substrate.

Abstract: A socket (2, 52) for attachment to a printed substrate (10, 60), has a central aperture therethrough. A connective part (3, 53) including a flexible insulative sheet (8, 58) is provided to cover the aperture and act as an electrically connective interface between an electrical part (31, 81) mounted in the socket and the printed substrate. The flexible sheet (8, 58) has a first contact means (5, 55) associated with a first surface of the flexible sheet for electrically connecting with leads (32, 82) of the electrical part and a second contact means (6, 56) associated with a second surface of the flexible sheet for electrically connecting with the printed substrate. An electroconductive member (7, 57) provides electrical connection between the first and second contact means. Such a socket is especially useful for testing electrical parts with high clock speeds and a large number of leads.

Abstract: A socket with a main socket body 10 for use in a burn-in test of a bare chip 80 with a large number of contact connectors BP is provided with a positioning plate 42 in the top of the socket body 10. This positioning plate has a plurality of through holes 42c with contact members 48 slidingly contained therein. The through holes 42c and contact members 48 are aligned in one to one relationship to contact connections on the bare chip on one side of positioning plate 42 and a plurality of electroconductive film contacts 50 on the other side of the positioning plate 42. The film contacts are movably supported in the socket. Additionally, the film contacts 50 are electrically connected in a one-to-one relationship to socket contact 56 contained in the socket for providing electrical connection between bare chip 80 and socket 10.

Abstract: A socket for removably mounting an electric part such as an IC package (30) has a cover (14) which when pushed down from a raised at rest position causes a drive shaft (26) fixed to the cover (14) to move down rotating a first lever (36) and actuating a second lever (38). Upon such rotation a latch (48) moves to a receded position which is obliquely above a plurality of contact elements (28) and, at the same time, vertically movable arms (50) rise to a selected vertical position from a cavity (52). The IC package (30) is then received on the vertically movable arms (50).

Abstract: A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).

Abstract: A socket for mounting an electrical part such as an IC chip 60 in a freely detachable manner in which the electrical part 60 has a plurality of connective terminal parts of a prescribed pitch, has socket terminals 50 fixed in the socket 10 and a plurality of electroconductive parts 34 positioned on an insulating substrate 32. Each of the electroconductive parts 34 has first and second contact areas (34a, 34b) areas with the first contact area 34a having the same pitch as the pitch between the connective terminal parts BP. The insulating substrate 32 is held by a spring biased support member to provide for reliable contacting with the electrical part 60. The first contact area 34a of the electroconductive parts 34 provides electrical connection with one of the connective terminal parts BP of the electrical part 60 and the second contact part 34b provides electrical connection with one of the socket terminals 50 thereby providing reliable electrical connections between the electrical part 60 and the socket.

Abstract: A socket has a base (10) that is to be fixed on a printed wiring substrate (not shown in the drawings) and a cover (12), in the shape of a square frame, that is reciprocably movable in the vertical direction relative to base (10). An adaptor (20) is fixed to the center of base (10) by means of bolts (22) and an elevator carrier (24) is mounted on adaptor (20) in such a manner as to move among first, second and third vertically disposed positions in dependence upon movement of the cover (12). A large number of contact elements (26) are arranged in a pattern corresponding to the lead terminal pattern of an IC package for loading in the socket. Above each contact row, there is provided a linkage mechanism (32, 36) including a laterally extending bar (36a) movable toward and away from contact elements (26) in dependence upon the vertical movement of the cover (12).

Abstract: A socket has a main socket body 10 and a plurality of contact members 12 adapted for making electrical contact with electrical parts (20, 30) of both small outline package (SOP) type and small outline J-leaded package (SOJ) type. The contact members 12 have a base part 12a that is fixed in the main socket body, a contact part (12d, 12e and 12f) which guides and makes pressure contact with the connection terminals (22, 32) of the electrical part (20, 30) and a connective part 12c which integrally connects the base part (12a) and the contact part (12d, 12e and 12f). Each contact also includes a spring reinforcement and current bypass part (12h). The contact part further includes an upper guide portion (12f), a lower guide portion (12d) and a contact portion (12e).

Abstract: A socket for testing integrated circuit (IC) packages (100) has a lower block (10) with a plurality of contact elements (11) movable between open and closed positions mounted therein, an upper block (20) fixed on the lower bock (10) and formed with a lead insertion hole (21) for the insertion of each lead (101) of the IC package (100), a cover member (30) adapted for vertical, up and down movement relative to the upper block (20), and a spring biased slide block (40) mounted to slidably reciprocate in a recess formed between the upper and lower blocks (10,20) in a direction which crosses, at approximately a right angle, the direction in which a lead (101) of an IC package (100) would be inserted into an opened contact element (11). The slide block (40) has a plurality of apertures (41) for opening and closing contact elements (11) upon movement of the cover member (30) by the use of a contact part opening and closing element (50) converting movement of the cover (30) to sliding action of the slide block (40).

Abstract: Generally U-shaped contact elements (11) mounted in a socket body (2) each has a flexible portion (13), a generally U-shaped bent portion (14) which bends approximately 180.degree. and a contact portion (15). A head (31) which supports an IC package (21) moves toward the main socket body (2) to mount the IC package (21) in socket (1). Immediately before reaching the mounting position of the IC package, an arm (9) of a lever (7), rotatably journaled in the socket body (2), is pushed by head (31) rotating lever (7). Arm (10) of lever (7), sandwiched between the contact flexible portion (13) and the lower end of the contact portion (15), rotates therewith pressing contact portions (15) against leads (26) of the IC package, thereby effecting an electric connection between the two.

Abstract: A socket with a base 10 and a cover member 20 rotable with respect to the base 10 for use especially in a burn-in test of an electrical part 100 with a narrow pitch between leads 100a of the electrical part which has a holding cover 27 within the cover 20 which is rotable and pivotable and a plurality of thin insulating sheet members 15 positioned between a plurality of contacts 14 contained in the base 10 to insure reliable operation.

Abstract: A socket for mounting an electrical part 30 in a freely detachable manner in which the electrical part 30 has a plurality of terminal leads 30a of a prescribed pitch P between the leads 30a has socket terminals 52 fixed in the socket and flexible electroconductive parts 38 corresponding to the pitch of the terminal leads on an insulating substrate 40 for making electrical contact with the terminal leads 30a of the electrical part 30 and the fixed socket terminals 52.

Abstract: A socket having contact elements (22, 22', 50, 89) movable into and out of engagement with terminal leads (14a, 87) of an electrical component has a connection assembly (28, 34; 28', 34'; 58, 60, 66; 90, 91, 95) rotatably mounted to the base (10, 52, 80) of the socket for moving the contact elements into and out of engagement with the terminal leads. The connection assembly is driven by a movable cover (12) or by a motor (46) through a shaft (26, 54) which may be interconnected with comparable shafts on other sockets.

Abstract: A socket with a base and a reciprocating cover for use in the burn-in test of an electrical part which is characterized in that during the time from immediately before mounting of the electrical part to the completion of mounting thereof, the electrical part is moved in such a manner that a terminal lead of the electrical part will come in contact and wipe a contact element of the socket so that any oxide film on the surface of the contact element of socket is removed. Also, a latch can be provided for holding the socket in desired mounting position during the above described wiping and contacting procedure.

Abstract: A socket for mounting an integrated circuit chip to electrically connect chip leads in a test circuit during burn-in testing of the chip has rotably-mounted chip holders and has a plurality of resilient contacts arranged to be movable with forward motion of a reciprocating member to displace the holders and contacts against a bias force to receive the chip in the socket. The holders and contacts are movable with return motion of the reciprocating member to return to their original positions in response to the noted bias to detachably retain the chip in the socket and resiliently engage the contacts with respective chip leads with selected force. A rotably movable subordinate lever element engages the reciprocating member and the contacts to facilitate moving of the contacts as a group between their original and displaced positions in response to movement of the reciprocating member.

Abstract: A socket for testing integrated circuit units has contact elements and holding members movable on a body and has a cover reciprocable toward the body to move the contact elements and holding members in selected sequence for receiving an integrated circuit unit in a carrier on the body and away from the body to permit the holding members to engage the carrier and to permit the contact elements to engage terminals on the integrated circuit on the carrier for releasably connecting the terminals in a test circuit.