Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed.

Abstract: A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a di

Abstract: Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Abstract: Provided are a crystal substrate etching method capable of processing with high accuracy, a piezoelectric vibrating reed of which the outer shape is formed by the method, a piezoelectric vibrator having the piezoelectric vibrating reed, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezo-electric vibrator. A crystal substrate and an auxiliary substrate are successively dry-etched from a second surface side of the crystal substrate in a state where the auxiliary substrate having approximately the same etching rate as the crystal substrate is bonded to a first surface of the crystal substrate.

Abstract: Provided are a glass substrate bonding method capable of securely anodically bonding a bonding material and a glass substrate even when Si having a large resistance value is used as a material for the bonding material, a glass assembly obtained by the glass substrate bonding method, a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A glass substrate bonding method includes an anodic bonding step of anodically bonding a bonding material fixed to an inner surface of a lid substrate wafer to a base substrate wafer. The bonding material is formed of an ITO film and a Si film which are sequentially formed on the inner surface of the lid substrate wafer.

Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract: Provided are a pattern forming method and apparatus capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator having the electrode pattern formed by the pattern forming method and apparatus, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A pattern forming method for forming a pattern on a substrate in a deposition chamber by a sputtering method is provided. The deposition chamber includes a table configured to be able to dispose a plurality of substrates thereon and a target which serves as a raw material of the pattern.

Abstract: Provided are a masking material capable of suppressing the occurrence of pattern blurring when forming a pattern on a substrate by a sputtering method, a piezoelectric vibrator using the masking material, a method of manufacturing the piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece each having the piezoelectric vibrator. A masking material which is used when forming a pattern on a substrate by a sputtering method includes openings corresponding to the pattern, and portions where the openings are not formed have a uniform thickness.

Abstract: The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; outer electrodes which are formed on an outer surface of the first substrate; inner electrodes which are formed on the first substrate so as to be accommodated in the cavity; penetration electrodes which are formed so as to penetrate through the first substrate so that the outer electrodes and the inner electrodes are electrically connected; and a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the inner electrodes at the inner side of the cavity. The first substrate and the second substrate are bonded by a bonding film that is formed of a low-melting-point glass, and the bonding film is heated to a predetermined bonding temperature when the first substrate and the second substrate are bonded together, and is formed by being heated to a temperature higher than the bonding temperature before the bonding is performed.

Abstract: A method for manufacturing a piezoelectric vibrator is provided. The piezoelectric vibrator includes: a package in which a first substrate and a second substrate are superimposed so as to form a cavity therebetween; extraction electrodes which are formed on the first substrate so as to be extracted from the inner side of the cavity to an outer edge of the first substrate; a piezoelectric vibrating reed which is sealed in the cavity and electrically connected to the extraction electrodes at an inner side of the cavity; and outer electrodes which are formed on an outer surface of the package so as to be electrically connected to the extraction electrodes at the outer side of the cavity.

Abstract: There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

Abstract: A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

Abstract: There are provided a piezoelectric vibrating reed which can be reliably bonded ultrasonically and which can be efficiently manufactured, a piezoelectric vibrator, a method of manufacturing a piezoelectric vibrator, an oscillator, an electronic apparatus, and a radio-controlled timepiece. A piezoelectric vibrating reed includes: a piezoelectric plate having vibrating portions and a base portion adjacent to the vibrating portions; excitation electrodes formed in the vibrating portions; mount electrodes formed in the base portion; lead-out electrodes for making the excitation electrodes and the mount electrodes electrically connected to each other; and a passivation film which is formed of an electrically insulating material and covers the excitation electrodes and the lead-out electrodes. These electrodes disposed on one surface of the base portion are formed only in a region covered by the passivation film.

Abstract: The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

Abstract: An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.

Abstract: Providing a package and a method for manufacturing the package capable of achieving improvement in the degree of vacuum in the cavity, and to provide a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. There is provided a package which includes a plurality of kinds of gettering materials 20, 21 having different activation temperatures and which are capable of being activated by heating is disposed in the cavity C.

Abstract: Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded.

Abstract: A piezoelectric vibrator which can be manufactured efficiently and a manufacturing method thereof are provided. The piezoelectric vibrator includes: a tuning-fork-type piezoelectric vibrating piece which has a pair of vibration arm portions, excitation electrodes formed on base end portions of the vibration arm portions, and weight metal films formed on distal end portions of the vibration arm portions; and a package which houses the piezoelectric vibrating piece therein. A gettering film on which a laser radiation flaw is formed is formed on intermediate portions between the base end portions and the distal end portions of the vibration arm portions. A first metal film included in the excitation electrode, a second metal film included in the weight metal film and the gettering film are formed using the same material.

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Abstract: The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.