Abstract: To provide a piezoelectric vibrator, an oscillator, an electronic part, an electronic apparatus, a method of fabricating a piezoelectric vibrator and a method of fabricating an electronic part capable of swiftly and easily providing a plurality of electrodes for applying a voltage to a piezoelectric vibrating piece while maintaining airtightness at inside of a hermetically sealed vessel, there is provided a piezoelectric vibrator including a hermetically sealed vessel 2 constituted by overlapping a lid member 6 and a base member 7 in a plate-like shape, a piezoelectric vibrating piece 3 provided at inside of the hermetically sealed vessel 2, a lead-out electrode 16 provided at an overlapping face 6a of the lid member 6, electrically connected to the piezoelectric vibrating piece 3 by way of a connecting portion, and extending the connecting portion 15 to an edge portion of the overlapping face 6a of the lid member 6, an external electrode 27 electrically connected to the lead-out electrode 16 from a side face

Abstract: To provide a manufacturing method of a small-sized quartz crystal vibrating piece, which can decrease processing variations due to accuracy of matching a front and a rear of a mask in etching of a quartz crystal wafer. According to a manufacturing method of a quartz crystal vibrating piece to be processed by etching a quartz crystal wafer from a front and a rear, a size of a mask used for etching is changed depending on a front and a rear of the quartz crystal wafer, a mask of a small size is defined as a reference mask, and a mask of a large size is defined as a relative mask so as to perform etching. The mask is unified to the size to be processed from the reference mask by over etching, even processing accuracy can be obtained, the small-sized quartz crystal vibrating piece can be manufactured, and the quartz crystal vibrating piece can be provided inexpensively and stably.

Abstract: The present invention is enabling to easily solder again in soldering of a surface mount type piezoelectric vibrator. An external electrode is formed by an alloy metal of Cr and Ni, namely, NiCr. Further, on the surface of NiCr, an oxidation resistant film for oxidation resistance is formed by a film of Au. Therefore, in the structure of an external electrode, the layer of NiCr is formed on the surface of glass, and further, the layer of Au is formed thereon. In the meantime, NiCr and Au are deposited by spattering (a spatter method) as a film with a low stress. In the external electrode of such a structure, the layer of Au is dispersed in the solder by soldering, however, since Cr in NiCr reduces the diffusion speed of Ni into the solder, Ni is remained in the external terminal. Since Ni is a metal to make the alloy metal with the solder, it is possible to perform soldering again by removing this quartz crystal vibrator.

Abstract: In a method for manufacturing a piezo-electric vibrator, a vibrator is provided having a vibrator piece and a frame surrounding a periphery of the vibrator piece. A first exciting electrode is formed on the vibrator piece. A weight is disposed on the vibrator piece in spaced-apart relation to the first exciting electrode. A characteristic of the vibrator is then adjusted. The first exciting electrode is removed and a metal film is formed on a surface of the vibrator. The metal film is patterned and a second exciting electrode is formed on the vibrator piece.

Abstract: A method of fabricating a piezoelectric vibrator comprises providing a piezoelectric oscillating plate having a piezoelectric vibrator piece and frame integrally connected to a base end portion of the piezoelectric vibrator piece and surrounding the piezoelectric vibrator piece. A pair of excitation electrodes is disposed on surfaces of two sides of the piezoelectric vibrator piece for vibrating the piezoelectric vibrator piece. Bond films are formed on upper and lower surfaces of the frame and are connected to the excitation electrodes. Shortcircuiting electrodes are disposed on the piezoelectric oscillating plate for causing a shortcircuit to electrically connect the bond films to each other. The piezoelectric vibrator piece is covered to seal the piezoelectric vibrator piece in an airtight manner via the bond films without hampering vibration of the piezoelectric vibrator piece.

Abstract: A piezo-electric vibrator having an electrode structure enabling to avoid unevenness of junction is to be provided. Plural electrode patterns 160 consisting of a pair of exciting electrode films 80 and 81 formed on a crystal vibrator 110 and frame electrodes 38 and 39 formed on each frame-shaped portion 100 and connected to a pair of exciting electrode films 80 and 81 are formed, and course adjusting of frequency is carried out. After that, plural electrode patterns consisting of a pair of exciting electrodes 80 and 81 formed on each crystal vibrator piece 110 and joining films 40 and 41 formed on each frame-shaped portion 100 and connected to the pair of exciting electrode films 80 and 81 in which each of them is shorted is formed on a crystal wafer 130 forming plural vibrators 20 consisting of the crystal vibrator piece 110 and the frame-shaped portion 100 again so as to carry out anode junction by making applying voltage possible.

Abstract: A piezoelectric vibrator has a piezoelectric oscillating plate having a piezoelectric vibrator piece and a frame integrally connected to a base end portion of the piezoelectric vibrator piece and surrounding the piezoelectric vibrator piece. A pair of excitation electrodes are disposed on surfaces of two sides of the piezoelectric vibrator piece for vibrating the piezoelectric vibrator piece. Bond films are formed on upper and lower surfaces of the frame and are connected to the excitation electrodes. A pair of lids seal the piezoelectric vibrator piece in an airtight manner via the bond films without hampering vibration of the piezoelectric vibrator piece. Shortcircuiting electrodes are disposed on the piezoelectric oscillating plate for causing a shortcircuiting to electrically connect the bond films to each other.

Abstract: To provide a piezoelectric vibrator having an electrode structure capable of bonding a large area, on a quartz wafer formed with a plurality of vibrators each comprising a quartz vibrator piece and a frame, there are formed electrode patterns each including a pair of excitation electrode films on the respective quartz vibrator piece and bond films formed on the respective frame and connected to the pair of excitation electrode films and the electrode patterns are connected to each other by sputter films for shortcircuiting constituting metal films.

Abstract: To provide an anodic bonding method which can favorably bond between members different in thermal expansion coefficient. In an anodic bonding method of applying a voltage to and bonding between a first member 10 having a bonding film 11 on a bonding surface and a second member 12 closely put on the bonding surface of the first member 10 through the bonding film 11 in a manner that the first member 10 is rendered as an anode, characterized in that: the bonding film 11 is of a metal film and the second member 12 is of a soda-lime glass, and a bonding temperature is at 100-200° C. and an application voltage is at 0.5-5.0 kV.

Abstract: A piezoelectric vibrator has a piezoelectric vibration plate having a piezoelectric vibration piece. First and second oscillation electrode films are disposed on the piezoelectric vibration plate for undergoing oscillating movement to vibrate the piezoelectric vibration plate. Each of the first and second oscillation electrode films terminates in a bonding film portion. A pair of cover members form a hermetically sealed cavity containing the piezoelectric vibration piece of the piezoelectric vibration plate. The cover members are anodically bonded together through the bonding film portions of the first and second oscillation electrode films. Each lead electrode of a pair of lead electrodes has a portion connected to a respective one of the bonding film portions of the first and second oscillation electrode films.

Abstract: To provide a piezoelectric vibrator having an electrode structure capable of bonding a large area, on a quartz wafer formed with a plurality of vibrators each comprising a quartz vibrator piece and a frame, there are formed electrode patterns each including a pair of excitation electrode films on the respective quartz vibrator piece and bond films formed on the respective frame and connected to the pair of excitation electrode films and the electrode patterns are connected to each other by sputter films for shortcircuiting constituting metal films.