Patents by Inventor Klaus Elian

Klaus Elian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230292626
    Abstract: A magnetic field sensor having a semiconductor chip is proposed, the semiconductor chip having at least one magnetic field sensor element, the semiconductor chip being embedded in a semiconductor chip encapsulation, having a permanent magnet, the permanent magnet being embedded in a magnet encapsulation, wherein an interface between the semiconductor chip encapsulation and the magnet encapsulation extends as far as a free surface of the magnetic field sensor. Methods for producing a magnetic field sensor are furthermore disclosed.
    Type: Application
    Filed: March 7, 2023
    Publication date: September 14, 2023
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER, Klaus ELIAN
  • Publication number: 20230194478
    Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.
    Type: Application
    Filed: October 27, 2022
    Publication date: June 22, 2023
    Inventors: Derek Debie, Klaus Elian, Ludwig Heitzer, David Tumpold, Jens Pohl, Cyrus Ghahremani, Thorsten Meyer, Christian Geissler, Andreas Allmeier
  • Publication number: 20230152448
    Abstract: An ultrasonic touch sensor includes: a covering having a contact face configured to receive a touch; a first ultrasonic transducer element; a first semiconductor chip comprising the first ultrasonic transducer element; a second ultrasonic transducer element; and an acoustic barrier formed between the first ultrasonic transducer element and the second ultrasonic transducer element.
    Type: Application
    Filed: November 8, 2022
    Publication date: May 18, 2023
    Inventors: Klaus ELIAN, Christoph STEINER, Horst THEUSS, Matthias EBERL, Fabian MERBELER
  • Publication number: 20230063120
    Abstract: What is proposed is an ultrasonic touch sensor having a contact surface for attaching the ultrasonic touch sensor to a casing, having a first ultrasonic transducer element, having a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element, wherein the first semiconductor chip is potted into a potting compound in such a way that a first cutout is formed from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and wherein the potting compound forms the housing of the ultrasonic touch sensor.
    Type: Application
    Filed: August 30, 2022
    Publication date: March 2, 2023
    Inventors: Klaus ELIAN, Horst THEUSS
  • Publication number: 20230023572
    Abstract: A sensor system for attachment to a casing includes at least one sensor element, where the sensor element is configured for detecting an environment property of an environment which, with the sensor system attached to the casing, is situated on the opposite side of the casing with respect to the sensor system. The sensor system also includes an encapsulation layer, where the sensor element is embedded in the encapsulation layer, and where the encapsulation layer has a contact surface for attaching the sensor system to the casing.
    Type: Application
    Filed: July 15, 2022
    Publication date: January 26, 2023
    Applicant: Infineon Technologies AG
    Inventors: Klaus ELIAN, Matthias EBERL, Fabian MERBELER
  • Patent number: 11561245
    Abstract: A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: January 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Rainer Markus Schaller, Volker Strutz
  • Publication number: 20230010130
    Abstract: An ultrasonic touch sensor is proposed for attachment to a casing, having a semiconductor chip including a substrate side and a component side, the semiconductor chip including an ultrasonic transducer element and the ultrasonic transducer element being arranged on the component side, having an acoustic coupling medium covering the semiconductor chip at least in the region of the ultrasonic transducer element, having electrical contact elements for controlling the ultrasonic transducer element, and the electrical contact elements being arranged on the component side of the semiconductor chip.
    Type: Application
    Filed: June 27, 2022
    Publication date: January 12, 2023
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Jochen DANGELMAIER, Klaus ELIAN, Horst THEUSS
  • Patent number: 11536781
    Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: December 27, 2022
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Klaus Elian, Helmut Wietschorke
  • Publication number: 20220373784
    Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.
    Type: Application
    Filed: April 19, 2022
    Publication date: November 24, 2022
    Inventors: Horst THEUSS, Klaus ELIAN, Cyrus GHAHREMANI
  • Patent number: 11410942
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: August 9, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Publication number: 20220247089
    Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package having a radio-frequency chip and a radio-frequency radiation element, the radio-frequency package being mounted on the printed circuit board. The radio-frequency device furthermore comprises a waveguide component having a waveguide, wherein the radio-frequency radiation element is configured to radiate transmission signals into the waveguide and/or to receive reception signals via the waveguide.
    Type: Application
    Filed: January 24, 2022
    Publication date: August 4, 2022
    Inventors: Walter HARTNER, Tuncay ERDOEL, Klaus ELIAN, Christian GEISSLER, Bernhard RIEDER, Rainer Markus SCHALLER, Horst THEUSS, Maciej WOJNOWSKI
  • Patent number: 11275110
    Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 15, 2022
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Rainer Markus Schaller
  • Patent number: 11239176
    Abstract: A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: February 1, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Publication number: 20210341555
    Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.
    Type: Application
    Filed: April 14, 2021
    Publication date: November 4, 2021
    Inventors: Horst THEUSS, Klaus ELIAN, Helmut WIETSCHORKE
  • Publication number: 20210325454
    Abstract: The disclosure describes techniques for detecting failures or performance degradation of a device including an integrated circuit (IC) components in the field by including additional contacts, i.e. terminals, along with functional contacts of the circuit used for connecting the circuit to a system in which the circuit is a part. These additional contacts may be internal external to the package surface and may be used to measure dynamic changing electrical characteristics over time e.g. voltage, current, capacity, temperature and impedance. These electrical characteristics may be representative of one or more failure modes and may be treated as indicator for device state-of-health (SOH).
    Type: Application
    Filed: April 15, 2020
    Publication date: October 21, 2021
    Inventors: Klaus Elian, Rainer Markus Schaller
  • Publication number: 20210323812
    Abstract: A sensor device includes a sensor chip with a micro-electromechanical systems (MEMS) structure, wherein the MEMS structure is arranged at a main surface of the sensor chip, and a gas-permeable cover arranged over the main surface of the sensor chip, which covers the MEMS structure and forms a cavity above the MEMS structure.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 21, 2021
    Applicant: Infineon Technologies AG
    Inventors: Rainer Markus SCHALLER, Klaus ELIAN, Horst THEUSS
  • Publication number: 20210302474
    Abstract: A sensor apparatus comprises an electrically conductive chip carrier comprising a busbar, a first connection and a second connection, and a differential magnetic field sensor chip which is arranged on the chip carrier and has two sensor elements. The form of the busbar is such that a measurement current path running from the first connection to the second connection through the busbar comprises a main current path and a bypass current path, wherein the main current path and the bypass current path run parallel to one another, and a bypass current flowing through the bypass current path is less than a main current flowing through the main current path. The magnetic field sensor chip is configured to capture a magnetic field induced by the bypass current.
    Type: Application
    Filed: March 30, 2021
    Publication date: September 30, 2021
    Inventors: Klaus ELIAN, Rainer Markus SCHALLER, Volker STRUTZ
  • Publication number: 20210028125
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.
    Type: Application
    Filed: July 22, 2020
    Publication date: January 28, 2021
    Applicant: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian
  • Patent number: 10852363
    Abstract: A semiconductor package may include a sensor chip to measure an amount of electrical current in a current medium. The sensor chip may include a first magnetic sensing element and a second magnetic sensing element. The semiconductor package may include a magnet that produces a magnetic field. The magnet may be arranged asymmetrically with respect to the first magnetic sensing element and the second magnetic sensing element such that a strength of the magnetic field at the first magnetic sensing element is different from a strength of the magnetic field at the second magnetic sensing element.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: December 1, 2020
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Rainer Markus Schaller
  • Publication number: 20200335451
    Abstract: A package comprising a carrier, an electronic component mounted on the carrier, and an identifier indicative of an origin of the package and being formed on and/or in the carrier is disclosed.
    Type: Application
    Filed: March 31, 2020
    Publication date: October 22, 2020
    Applicant: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Elian