Patents by Inventor Klaus Elian

Klaus Elian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus having a back-bias magnet and a semiconductor chip element
    Patent number: 9164156
    Abstract: An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: October 20, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Elian, Georg Ernst, Horst Theuss
  • Method for Making a Sensor Device Using a Graphene Layer
    Publication number: 20150287788
    Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
    Type: Application
    Filed: June 20, 2015
    Publication date: October 8, 2015
    Inventors: Klaus Elian, Guenther Ruhl, Horst Theuss, Irmgard Escher-Poeppel
  • Bias field generator including a body having two body parts and holding a packaged magnetic sensor
    Patent number: 9153369
    Abstract: A device is disclosed. In one embodiment the device comprises a bias field generator configured to provide a magnetic bias field for a magnetic sensor, the bias field generator including a body comprising magnetic or magnetizable material, a packaged magnetic sensor accommodating the magnetic sensor and a recess disposed in the body, wherein the packaged magnetic sensor is arranged in the recess, and wherein the body includes two separate body parts, each body part include a part of the recess, and each body part is configured to hold in place the packaged magnetic sensor.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: October 6, 2015
    Assignee: Infineon Technologies AG
    Inventors: Franz Stegerer, Klaus Elian, Michael Weber
  • Film-covered open-cavity sensor package
    Patent number: 9153706
    Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: October 6, 2015
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Helmut Wietschorke
  • Method of Packaging a Semiconductor Chip Using a 3D Printing Process and Semiconductor Package Having Angled Surfaces
    Publication number: 20150249043
    Abstract: In one aspect, a method of packaging a semiconductor module includes providing a semiconductor module having a first surface, a second surface opposite the first surface and edge sides extending between the first surface and the second surface. A packaging assembly is formed at least partly by a 3D printing process. The packaging assembly includes the semiconductor module and a protective covering that extends over the first surface.
    Type: Application
    Filed: February 28, 2014
    Publication date: September 3, 2015
    Applicant: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss
  • Sensor package and method of manufacturing thereof
    Patent number: 9121885
    Abstract: A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment includes a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on or around the encapsulation, wherein the soft magnet includes a composition of an insulating material and a material having soft magnetic properties.
    Type: Grant
    Filed: August 16, 2010
    Date of Patent: September 1, 2015
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Horst Theuss, Guenther Ruhl
  • Magnetic sensor device
    Patent number: 9121880
    Abstract: A magnetic sensor device includes a magnet configured to generate a bias magnetic field. A plurality of electrical wires extend through the magnet. A magnetic sensor chip is attached to an end face of a first electrical wire of the plurality of electrical wires.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: September 1, 2015
    Assignee: Infineon Technologies AG
    Inventor: Klaus Elian
  • SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM
    Publication number: 20150226810
    Abstract: A sensor arrangement according to an embodiment includes a substrate, and at least one sensor and a control circuit mounted on the substrate, wherein the at least one sensor and the control circuit are located on the substrate to be mountable inside a battery cell and outside the battery cell, respectively.
    Type: Application
    Filed: February 25, 2015
    Publication date: August 13, 2015
    Inventors: Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Mueller, Mathias Vaupel, Manfred Fries, Guenther Ruhl, Horst Theuss, Matthias Rose, Stephan Auer, Tue Fatt David Wee, Sie Boo Chiang
  • Magnet package and method for producing a magnet package
    Publication number: 20150194249
    Abstract: A magnet package is created, which includes a package body, wherein the package body is formed of a permanent magnetic material, and at least one electric contact, which is covered by the package body.
    Type: Application
    Filed: January 6, 2015
    Publication date: July 9, 2015
    Inventor: Klaus ELIAN
  • Method for making a sensor device using a graphene layer
    Patent number: 9070615
    Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: June 30, 2015
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Guenther Ruhl, Horst Theuss, Irmgard Escher-Poeppel
  • SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD
    Publication number: 20150132614
    Abstract: A sensor arrangement according to an embodiment comprises a transmitter to be arranged inside a battery cell and to transmit a signal based on at least one sensed operational parameter of the battery cell wirelessly.
    Type: Application
    Filed: November 12, 2013
    Publication date: May 14, 2015
    Inventors: Klaus Elian, Jochen Dangelmaier, Franz Michael Darrer, Thomas Müller, Mathias Vaupel, Manfred Fries, Günther Ruhl, Horst Theuss
  • Semiconductor package and method for fabricating the same
    Patent number: 8952489
    Abstract: A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: February 10, 2015
    Assignee: Infineon Technologies AG
    Inventors: Klaus Elian, Jens Pohl, Horst Theuss, Renate Hofmann, Alexander Glas, Carsten Ahrens
  • Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals
    Publication number: 20150024807
    Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
    Type: Application
    Filed: July 22, 2013
    Publication date: January 22, 2015
    Inventors: Klaus Elian, Horst Theuss, Thomas Mueller
  • Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals
    Publication number: 20150023523
    Abstract: A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.
    Type: Application
    Filed: October 28, 2013
    Publication date: January 22, 2015
    Inventors: Klaus Elian, Horst Theuss, Thomas Mueller
  • APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY, A RECHARGEABLE BATTERY OR A BATTERY, AND A METHOD FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A BATTERY
    Publication number: 20150004451
    Abstract: An apparatus for determining a state of a rechargeable battery or of a battery has a sensor device and an evaluation device. The sensor device brings about an interaction between an optical signal and a part of the rechargeable battery or of the battery, which part indicates optically acquirable information about a state of the rechargeable battery or of the battery, and detects an optical signal caused by the interaction. The sensor device furthermore provides a detection signal having information about the detected optical signal. The evaluation device determines information about a state of the rechargeable battery or of the battery on the basis of the information of the detection signal. Furthermore, the evaluation device provides a state signal having the information about the determined state.
    Type: Application
    Filed: June 23, 2014
    Publication date: January 1, 2015
    Inventors: Klaus Elian, Jochen Dangelmaier, Manfred Fries, Juergen Hoegerl, Georg Meyer-Berg, Thomas Mueller, Guenther Ruhl, Horst Theuss, Mathias Vaupel
  • Pre-mold for a magnet semiconductor assembly group and method of producing the same
    Publication number: 20140377915
    Abstract: A method of manufacturing pre-molds for a magnet semiconductor assembly group is provided, wherein the method comprises forming a plurality of permanent magnetizable elements on a carrier structure in a sensor-free area of the carrier structure by applying a permanent magnetizable molding material on the carrier structure.
    Type: Application
    Filed: June 20, 2013
    Publication date: December 25, 2014
    Inventor: Klaus ELIAN
  • Film-Covered Open-Cavity Sensor Package
    Publication number: 20140346623
    Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.
    Type: Application
    Filed: May 23, 2013
    Publication date: November 27, 2014
    Inventors: Klaus Elian, Helmut Wietschorke
  • APPARATUS FOR MEASURING A PRESSURE, A METHOD FOR MANUFACTURING AN APPARATUS FOR MEASURING A PRESSURE AND A BATTERY
    Publication number: 20140342203
    Abstract: An apparatus for measuring a pressure includes a semiconductor die and a circuit board. The semiconductor die includes a micro-mechanical element generating a measurement signal indicating information on an external pressure applied to the micro-mechanical element. The semiconductor die further includes an output interface providing the measurement signal. The circuit board includes at least one electrically-conductive line and an opening. The semiconductor die is attached to the circuit board, so that the micro-mechanical element faces the whole of the circuit board and the at least on electrically-conductive line is connected to the output interface.
    Type: Application
    Filed: May 14, 2013
    Publication date: November 20, 2014
    Inventor: KLAUS ELIAN
  • Energy harvester
    Patent number: 8841785
    Abstract: An energy harvesting system and method includes a rotatable member with an electrically conductive coil mounted to the rotatable member and adapted to move with the rotatable member such that the movement of the coil through a magnetic field induces a voltage in the coil. An energy storage device is coupled to the coil.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: September 23, 2014
    Assignee: Infineon Technologies AG
    Inventors: Horst Theuss, Klaus Elian
  • Method for Making a Sensor Device Using a Graphene Layer
    Publication number: 20140264255
    Abstract: A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces.
    Type: Application
    Filed: May 28, 2014
    Publication date: September 18, 2014
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Elian, Guenther Ruhl, Horst Theuss, Irmgard Escher-Poeppel