Abstract: A micromechanical component placed on a substrate face includes at least one cell. A counter-electrode of a cell capacitor is placed under a cavity. The counter-electrode can be made from a first part of a lower conductive layer. An optionally circular membrane used as an electrode of the capacitor is placed above the cavity. The membrane is homogeneous, has a substantially uniform thickness, and can be part of an upper conductive layer preferably supported by a second part of the lower conductive layer. A caustic channel used to remove the sacrificial coating in order to form the cavity is laterally connected thereto. The channel has a vertical dimension equal to the vertical dimension of the cavity. A closure is adjacent to the channel and disposed outside the membrane. The component can be used as a pressure sensor, and can have several cells each adjacent to six other cells. A process for fabricating a micromechanical component is also provided.

Abstract: A method of determining an intactness of a configuration having a plurality of sensor groups, includes the steps of forming, for all of the sensor groups, associated test signals by summing up electric signals of all respective other ones of the sensor groups. All the test signals are compared with one another; and it is selectively determined that an intactness exists, if the test signals are all substantially equal to one another, and it is determined that the intactness does not exist if the test signals are not substantially equal to one another. The configuration is provided such that each sensor group can be disconnected so as to exclude its signal from the aggregate signal. The configuration is preferably provided in a CMOS circuit on a single semiconductor chip.

Abstract: A recess is produced in a material layer by creating at least a first and a second structure in various steps. The layers define each other laterally and extend to the bottom of the recess. The first structure and the second structure are so narrow that they can be made by creating conformally produced layers that have an independent thickness and are smaller than the depth of the recess. The conformally produced layers are formed in an appropriate deposition process. A covering structure can be produced on top of the first and second structure. An opening can be made in the covering structure, through which the first structure and the second structure can be removed in an etching step.

Abstract: In an SOI substrate, an active zone is completely surrounded by a trench filled with insulating material. Disposed adjacent to the trench is a first doped zone which is formed, in particular, by out-diffusion from a doped layer disposed on the wall of the trench. The first doped zone and a second doped zone form a p-n junction of a photodiode.