Abstract: A filter device for plasticized molding material includes a filter housing and a filter element arranged in the filter housing. The filter housing has at least two housing elements movable relative to each other. A drive is provided, via which the housing elements are movable between an open position and a closed position. The filter element is at least partially released in the open position of the housing elements and can preferably be taken out of the filter housing.

Abstract: The present invention relates to a method (1), resp. a device, system and computer-program product, for material decomposition of spectral imaging projection data. The method comprises receiving (2) projection data acquired by a spectral imaging system and reducing (3) noise in the projection data by combining corresponding spectral values for different projection rays to obtain noise-reduced projection data. The method comprises applying (6) a first projection-domain material decomposition algorithm to the noise-reduced projection data to obtain a first set of material path length estimates, and applying (7) a second projection-domain material decomposition algorithm to the projection data to obtain a second set of material path length estimates. The second projection-domain material decomposition algorithm comprises an optimization that penalizes a deviation between the second set of material path length estimates being optimized and the first set of material path length estimates.

Abstract: Plasticizing unit for a molding machine with an injection cylinder and an axially movable plasticizing screw arranged in the injection cylinder, wherein a filter device for filtering plasticized material, in particular plasticized plastic, is provided, which is or can be arranged axially movable in the injection cylinder.

Abstract: Filter device for a molding machine with at least one filter element for filtering plasticized material, in particular plasticized plastic, wherein, in a fluidically parallel arrangement relative to the at least one filter element, at least one valve element is provided, which is formed to prevent the plasticized material from flowing through the at least one valve element during an injection process in a closed position and to allow the plasticized material to flow through the at least one valve element in an open position, in order to make it possible to relieve the pressure on the at least one filter element after the injection process.

Abstract: The invention relates to a relief orthosis comprising a foot part which comprises a sole, a shank part extending away from the foot part in the proximal direction, and at least one fastening element for fastening the orthosis to a user, which fastening element is disposed on the foot part and/or on the shank part, wherein the foot part is embodied with an adaptable length.

Abstract: A liner for application to an amputation stump as a cushion, having a proximal entry opening (2) of a wall (6) having a sleeve section (3) provided for circumferentially enclosing the amputation stump, and a distal closed end section (4), wherein an inside (7) of the wall (6) of the liner (1) is designed for contact on the amputation stump, permits simplified handling of the wound care on the amputation stump of a prosthesis wearer in that an electrode arrangement (10), having at least one electrode (12), for a dielectric barrier plasma discharge is integrated into the liner (1), which arrangement extends starting from the distal end section (4) into the sleeve section (3), is connected at the distal end section (4) to at least one terminal (11) for a high-voltage control signal and is provided with a dielectric cover for contact on the amputation stump, and in that the dielectric cover is provided, at least in the region of the electrode arrangement (10) on the inside (7), with protrusions (8), which define

Abstract: The invention relates to a relief orthosis comprising a foot part which comprises a sole, a shank part extending away from the foot part in the proximal direction, and at least one fastening element for fastening the orthosis to a user, which fastening element is disposed on the foot part and/or on the shank part, wherein the foot part is embodied with an adaptable length.

Abstract: A relief orthosis includes a foot part which comprises a sole, a shank part extending away from the foot part in the proximal direction, and at least one fastening element for fastening the orthosis to a user, which fastening element is disposed on the foot part and/or on the shank part, and the foot part is embodied with an adaptable length.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: A relief orthosis includes a foot part which comprises a sole, a shank part extending away from the foot part in the proximal direction, and at least one fastening element for fastening the orthosis to a user, which fastening element is disposed on the foot part and/or on the shank part, and the foot part is embodied with an adaptable length.

Abstract: Methods, systems, and computer program products for providing customized content over a network are provided. The method includes associating content with at least one of a domain name, group, and geography for an entity, the content relating to at least one of the domain name, group, and geography. For each entity, the method also includes storing results of the association in a database record that is mapped to a domain name. In response to receiving a request to access a resource by the entity, the method further includes obtaining a domain name of the entity utilizing address information provided in the request, searching a database for the domain name of the entity, retrieving the database record corresponding to the domain name, generating a resource that includes the content, and providing the entity with the resource.

Abstract: An elongate solar cell, comprising a semiconductor body having two mutually opposed faces, at least one of the faces being an active face for receiving incident light, and two mutually opposed edges orthogonal to the faces, the edges comprising electrical contacts thereon for conducting electrical current generated by the solar cell from the light; wherein the electrical contact to at least one of the edges includes an electrically conductive material that contacts only a fractional portion of the at least one edge of the semiconductor body to improve the performance of the solar cell.

Abstract: A solar cell interconnection process for forming a solar cell sub-module for a photovoltaic device, the process including the steps of mounting a plurality of elongate solar cells (101) on a crossbeam (102) on patches of solderable material (201) which is used to maintain solder in position, the elongate solar cells being in a substantially longitudinally parallel and generally co-planar configuration: and establishing one or more conductive pathways (204) extending between adjacent cells to electrically interconnect the elongate solar cells via the contacts (202, 203): wherein the one or more conductive pathways are established by wave soldering.

Abstract: A thin layer of single-crystal silicon is produced by forming first trenches in a silicon substrate having (111) orientation; forming narrower second trenches at the base of the trenches; anisotropically etching lateral channels (4) from the second trenches, until adjacent etch fonts (16) substantially meet; and detaching said layer from the substrate. The trenches may be arranged so that the resultant layer has rows of slots, with the slots in adjacent rows being mutually offset. Solar cells may be formed on strips having two electrical contacts on the same face (6) of each strip (5).

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a process for texturing a surface of a semiconductor material, the process comprising: applying a layer of a protective substance on said surface wherein said layer is sufficiently thin that it has a plurality of apertures therethrough; and contacting said layer and said semiconductor material with an etchant capable of etching said semiconductor material faster than said protective substance, said etchant making contact with said semiconductor material at least through said apertures, for a time and under conditions in which said semiconductor material is etched by said etchant in the vicinity of said apertures to produce a textured surface on said semiconductor material, but said protective substance is substantially unetched.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality of strips, selecting a technique for cutting the wafer into the strips at an angle to the substantially planar surface, in which the combined strip thickness and width of wafer removed by the cutting is less than the thickness of the wafer, cutting the wafer into strips using the selected technique and separating the strips from each other.

Abstract: A method for processing elongate substrates, including forming a plurality of parallel elongate openings (102) through a semiconductor wafer (104) to form a corresponding plurality of elongate substrates (106) between the openings, each of the elongate substrates (106) having opposite edges coplanar with opposite surfaces of the wafer, opposite faces (112) orthogonal to the wafer surfaces, and opposite ends by which the elongate substrates are interconnected; and applying securing means (402) to at least one of the opposite edges of each elongate substrate to engage the edges and thereby inhibit relative movement of the elongate substrates.