Patents by Inventor Klaus Keite-Telgenbuescher

Klaus Keite-Telgenbuescher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11390783
    Abstract: An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: July 19, 2022
    Assignee: TESA SE
    Inventors: Christian Schuh, Klaus Keite-Telgenbüscher, Chris Gäbert
  • Publication number: 20210403767
    Abstract: A reactive PSA film that includes: (a) a polymeric film former matrix; (b) one or more reactive components; and (c) a reagent selected from an initiator, a curing agent and an activator. The component (b) is present at a mass fraction of 30%, as based on the sum of (a), (b) and (c). Further, ?50 wt % of the polymer film former matrix is a crystallizable polymer which: (i) exhibits a crystallization enthalpy of <1 J/g in a DSC measurement on cooling at 10 K/min from at least 30K above a peak temperature of the melting peak of the matrix and ?100° C.; and (ii) exhibits a crystallite fusion enthalpy of ?15 mJ/mg in its pure state in a first heating curve of a DSC measurement at 10 K/min and after storage for ? one month from 15 to 25° C. and relative humidity from 30 to 70%.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 30, 2021
    Applicant: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Frank Hannemann, Claudia Moehrke, Stefan Kramp
  • Patent number: 11148407
    Abstract: Methods produce a folded connection, sealed by means of an adhesive composition and by means of first and second sheetlike elements, wherein a flange of the first sheetlike element, having a first surface (11) and a second surface (12), is taken back over a flange of the second sheetlike element. The methods apply at least one layer of an adhesive composition to the flange of the first sheetlike element, bead the flange of the first sheetlike element around the flange of the second sheetlike element, and apply the adhesive composition to both the first and second surfaces of the flange of the first sheetlike element.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 19, 2021
    Assignee: TESA SE
    Inventors: Klaus Keite-Telgenbüscher, Christian Schuh
  • Patent number: 11142672
    Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: October 12, 2021
    Assignee: TESA SE
    Inventors: Klaus Keite-Telgenbüscher, Christian Schuh, Bernd Lühmann, Thilo Dollase, Minyoung Bai, Thorsten Krawinkel
  • Publication number: 20210238342
    Abstract: A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state makes it possible to produce epoxy adhesives having pressure-sensitive properties.
    Type: Application
    Filed: June 5, 2020
    Publication date: August 5, 2021
    Applicant: tesa SE
    Inventors: Christian SCHUH, Klaus KEITE-TELGENBÜSCHER, Yao SHU
  • Patent number: 11046870
    Abstract: The invention relates to a joining method wherein a first surface (2) of a first adherend (1) and a second surface (8) of a second adherend (6) are bonded to one another by provision of an adhesive tape (3) having a first side (4) and a second side (7), there being disposed on the first side (4) a first activatable adhesive and on the second side (7) a second activatable adhesive, the latter being an activatable pressure-sensitive adhesive, the first side (4) of the adhesive tape (3) is contacted with the first surface (2) of the first adherend (1) to produce a preliminary assembly, the second surface (8) of the second adherend (6) is joined in a joining movement to the second side (7) of the adhesive tape (3), the joining movement having a tangential component and a perpendicular component relative to the second side (7) of the adhesive tape (3), with a ratio between tangential and perpendicular components of greater than 0.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: June 29, 2021
    Assignee: TESA SE
    Inventors: Christian Schuh, Björn Zeysing, Klaus Keite-Telgenbüscher
  • Patent number: 10876021
    Abstract: An adhesive having water vapor barrier properties, comprising an adhesive base comprised of at least one epoxy syrup at least one elastomer at least one initiator optionally at least one tackifier resin and optionally at least one further reactive resin and optionally a solvent, wherein the adhesive base without solvent has a water vapor permeation rate after activation of the reactive resin component of less than 100 g/m2d, preferably of less than 60 g/m2d, in particular less than 30 g/m2d, wherein the epoxy syrup comprises bisepoxy monomers and high molecular weight uncrosslinked polyepoxies produced therefrom, exhibits good barrier properties and is also sufficiently pressure sensitive to achieve easy handleability.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: December 29, 2020
    Assignee: TESA SE
    Inventors: Christian Schuh, Klaus Keite-Telgenbüscher, Annalena Graucob
  • Patent number: 10711087
    Abstract: A process for producing a viscous epoxy syrup from at least one liquid multifunctional epoxy, comprising the steps of: adding an initiator selected from the group consisting of electron-poor monoisocyanate, photoinitiator and thermal initiator to at least one liquid multifunctional epoxy; mixing the components; polymerizing the multifunctional epoxy such that the viscosity of the resulting epoxy syrup is at least twice as high, preferably at least four times as high and in particular at least ten times as high as the viscosity of the employed epoxy in the unreacted state makes it possible to produce epoxy adhesives having pressure-sensitive properties.
    Type: Grant
    Filed: June 2, 2016
    Date of Patent: July 14, 2020
    Assignee: TESA SE
    Inventors: Christian Schuh, Klaus Keite-Telgenbüscher, Yao Shu
  • Publication number: 20200153001
    Abstract: Disclosed is an electrochemical cell or a stack of at least two electrochemical cells, wherein at least two components of the electrochemical cell or of the stack of electrochemical cells are bonded together by means of a strip of adhesive which can be removed again, in particular without residue or destruction, by stretching substantially in the bonding plane, wherein the strip of adhesive comprises one or more adhesive material layers and optionally one or more carrier layers, and wherein the outer upper surface and the outer lower surface of the strip of adhesive are formed by the one or more adhesive material layers. Also disclosed is the use of a strip of adhesive of this kind for bonding together components in an electrochemical cell or in a stack of at least two electrochemical cells.
    Type: Application
    Filed: March 29, 2018
    Publication date: May 14, 2020
    Applicant: TESA SE
    Inventors: Klaus KEITE-TELGENBÜSCHER, Christoph TZSCHOCH
  • Patent number: 10633559
    Abstract: A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: April 28, 2020
    Assignee: TESA SE
    Inventors: Hans Karl Engeldinger, Judith Grünauer, Klaus Keite-Telgenbüscher
  • Patent number: 10626305
    Abstract: A barrier adhesive for the encapsulation of an (opto)electronic arrangement comprising an adhesive base composed of at least one reactive resin having at least one activatable group, at least one polymer, especially an elastomer, optionally at least one tackifying resin, where the adhesive base has a water vapour permeation rate after the activation of the reactive resin of less than 100 g/m2d, preferably of less than 50 g/m2d, especially less than 15 g/m2d, a transparent molecularly dispersed getter material and optionally a solvent, wherein the getter material is at least one silane having at least one alkoxy group and at least one activatable group.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: April 21, 2020
    Assignee: TESA SE
    Inventors: Klaus Keite-Telgenbüscher, Christian Schuh
  • Patent number: 10618837
    Abstract: The invention relates to a rolled up thin glass composite comprising a thin glass film and at least one further layer (10, 11, 20, 30) applied over the surface of one side of the thin glass film, wherein the at least one further layer (10, 11, 20, 30) is applied to a radially outer side of the rolled up thin glass film and the at least one further layer (10, 11, 20, 30) contains a desiccant which protects the thin glass film against stress corrosion cracking.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: April 14, 2020
    Assignee: TESA SE
    Inventors: Christian Schuh, Klaus Keite-Telgenbüscher, Tanita Czeski
  • Publication number: 20200055107
    Abstract: Systems and methods produce or provide a folded connection, sealed by means of an adhesive composition, between a first sheetlike element and a second sheetlike element. The systems and methods bond a second flange of the second sheetlike element with at least one layer of an adhesive composition to a first flange of the first sheetlike element, in such a way that an end of the second flange of the second sheetlike element is indented by a distance relative to an end of the first flange of the first sheetlike element. The systems and methods bead the first flange of the first sheetlike element around the second flange of the second sheetlike element and, after the beading, an adhesive-composition part is placed around an edge of the first flange of the first sheetlike element and bonded to a second surface of the first flange of the first sheetlike element.
    Type: Application
    Filed: August 7, 2019
    Publication date: February 20, 2020
    Applicant: tesa SE
    Inventors: Christoph METTE, David TUFFE, Klaus KEITE-TELGENBÜSCHER
  • Patent number: 10529923
    Abstract: The invention relates to a method for absorbing permeates from a sheet material I, as used, for example, in organic electronic structures, this method being easy to carry out. Such a method includes, according to the invention, directly or indirectly bringing sheet material I into planar contact with a sheet material II, which contains at least one getter material and is capable of absorbing at least one permeate from sheet material I, there being no adhesive connection between sheet material I and sheet material II.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 7, 2020
    Assignee: tesa SE
    Inventors: Klaus Keite-Telgenbüscher, Christian Schuh, Anita Reichenbach
  • Publication number: 20190308398
    Abstract: Disclosed is a composite film comprising a coating layer, a polymer film layer, and an adhesive layer, the coating layer being joined to one major surface of the polymer film layer, and the adhesive layer being joined to the opposite major surface of the polymer film layer, in such a way that the polymer film layer is embedded between the coating layer and the adhesive layer. Self-healing properties of the coating and elastic properties of the film act synergistically in such a way that the protective film exhibits a wear resistance which is achieved by neither coating nor film alone.
    Type: Application
    Filed: July 3, 2017
    Publication date: October 10, 2019
    Applicant: TESA SE
    Inventors: Monika JUNGHANS, Klaus KEITE-TELGENBÜSCHER
  • Publication number: 20190284450
    Abstract: An adhesive comprising a getter material and optionally a solvent comprising a catalyst activatable by means of an external stimulus for the reaction of the getter material with a permeate can tolerate brief contact with permeates such as moisture in particular before user application, without any significant impairment of getter capacity.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Applicant: TESA SE
    Inventors: Christian SCHUH, Klaus KEITE-TELGENBÜSCHER, Chris GÄBERT
  • Publication number: 20190255832
    Abstract: Methods produce a folded connection, sealed by means of an adhesive composition and by means of first and second sheetlike elements, wherein a flange of the first sheetlike element, having a first surface (11) and a second surface (12), is taken back over a flange of the second sheetlike element. The methods apply at least one layer of an adhesive composition to the flange of the first sheetlike element, bead the flange of the first sheetlike element around the flange of the second sheetlike element, and apply the adhesive composition to both the first and second surfaces of the flange of the first sheetlike element.
    Type: Application
    Filed: October 16, 2017
    Publication date: August 22, 2019
    Applicant: tesa SE
    Inventors: Klaus KEITE-TELGENBÜSCHER, Christian SCHUH
  • Patent number: 10386209
    Abstract: Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances.
    Type: Grant
    Filed: June 19, 2017
    Date of Patent: August 20, 2019
    Assignee: TESA SE
    Inventors: Bernd Lühmann, Klaus Keite-Telgenbüscher, Minyoung Bai, Thilo Dollase
  • Publication number: 20190241775
    Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
    Type: Application
    Filed: March 29, 2019
    Publication date: August 8, 2019
    Applicant: tesa SE
    Inventors: Klaus KEITE-TELGENBÜSCHER, Christian SCHUH, Bernd LÜHMANN, Thilo DOLLASE, Minyoung BAI, Thorsten KRAWINKEL
  • Patent number: 10323163
    Abstract: The aim of the invention is to effectively protect a flat adhesive compound from permeates originating from the surroundings as well as from permeates trapped during lamination, winding, stacking or other processing steps. For this purpose, the adhesive tape comprises at least the following layers in the indicated order: a first outer adhesive compound layer A, a layer B, which contains at least one inorganic getter material, and a second outer adhesive compound layer C. The invention also relates to the use of said adhesive tape as an encapsulation material.
    Type: Grant
    Filed: December 5, 2013
    Date of Patent: June 18, 2019
    Assignee: TESA SE
    Inventors: Klaus Keite-Telgenbüscher, Jan Ellinger, Judith Grünauer, Anika Petersen