Abstract: A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.

Abstract: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: The invention relates to a method for the production of a layered or stacked inorganic/organic composite material, a predominantly inorganic material being provided and a polymer material being provided, characterized in that the predominantly inorganic material has a glass transition temperature or melting temperature lower than 500° C., that the predominantly inorganic material and the polymer material are each molten, and that the predominantly inorganic material and the polymer material are coextruded from the melt and thus form the composite material.

Abstract: The invention relates to a pressure-sensitive supporting material, which can be (intrinsically) heated by an inner heat source, and to the use thereof. The heatable supporting material is characterized in that the supporting material comprises a pressure-sensitive adhesive layer inside of which heat is generated. The pressure-sensitive adhesive layer is a pressure-sensitive adhesive compound, which can be heated by electric current, induction, a chemical reaction or by a physical phase transition. The heatable supporting material has a high heating capacity and is suited for producing pressure-sensitive tapes for adhering heatable mirrors.

Abstract: The invention provides a planar element which is intrinsically heatable and which is particularly suitable for attachment to multi-dimensionally curved surfaces. For this purpose the planar element features particularly high deformability, achieved in accordance with the invention through a planar element having a layer sequence comprising a heating layer and a contacting layer, each of these two layers being composed of a polymeric material based on elastomers and/or on plastic polymers which have a particular elongation at break and at the same time a particular tensile elasticity modulus. Furthermore, the invention provides an adhesively bonded assembly comprising a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and the use of such a planar element for heating an adhesively bonded assembly.

Abstract: A double-sidedly bondable planar element which has an electrical contacting layer via which it is self-regulatingly intrinsically heatable and at the same time has a high flexibility. The particular features of this planar element are that the planar element in the storage condition is adhesive on one side only, and is therefore particularly easy to handle, and that, on bonding, the adhesive passes through cutouts in the contacting layer, and the planar element thus becomes double-sidedly bondable. The invention further provides a method for the bonding of this planar element, including as a key step the passage of the adhesive through the cutouts in the contacting layer, thus turning a single-sidedly adhesive planar element into a double-sidedly adhesive planar element.

Abstract: A method for encapsulating an electronic, optionally optoelectronic, arrangement against permeants, in which a pressure-sensitive adhesive composition based on a partly crystalline polyolefin is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated, wherein the polyolefin has a density between 0.86 and 0.89 g/cm and a crystallite melting point of at least 90° C.

Abstract: A multirange indicator is proposed which permits quantitative dose determination of high-energy actinic radiation, where the dose for different wavelength ranges can be respectively determined in parallel. To this end, the multirange indicator has two indicator systems designed with mutually corresponding properties, thus eliminating any mutual distortion of the results of the dose measurements. The first indicator system is based on a photolatent Lewis acid or photolatent Lewis base, and the second indicator system is based on a polysubstituted triphenylmethane dye. Both the multirange indicator and its use for the production of various dose-measurement devices are described.

Abstract: The present invention relates to a method for encapsulating an electronic arrangement against permeants, in which a pressure-sensitive adhesive composition based on vinylaromatic block copolymers is provided, and in which the pressure-sensitive adhesive composition is applied onto and/or around the regions of the electronic arrangement which are to be encapsulated.

Abstract: A heating element including a current conductor through which electric power is conducted and electricity converted into heat by a voltage drop across an ohmic resistor. The heating element is a planar or a strip-shaped structure and is provided with at least one support layer and an adhesive layer, while the current conductor is designed as an additional, current-conducting layer which is arranged between the support layer and the adhesive layer. The support layer, the current-conducting layer, and the adhesive layer are transparent.

Abstract: A double-sidedly self-adhesive planar element which is intrinsically heatable in a self-regulating way and at the same time has a particularly high flexibility. The planar element has a layer sequence of a posistor heating layer, a contacting layer and an adhesive layer, the contacting layer being a two-dimensional perforate contacting element which within the planar element is therefore present as a contacting element which has not been applied to a backing. Also disclosed is an adhesively bonded assembly of a bonding substrate and a planar element of the aforesaid kind, a method of producing a planar element of the aforesaid kind, and a method of using a planar element of the aforesaid kind for heating an adhesively bonded assembly.

Abstract: Process for producing partially-self-adhesively treated backing materials comprising partially deformed domes or polygeometric forms of adhesive.

Abstract: The invention relates to the use of a non-woven fabric which is over-stitched by means of stitching threads as a supporting material for medical purposes. The invention is characterized in that the maximum tensile force of supporting material is equal to at least 30 N/cm and at least one side of the supporting material is partially or completely coated with a self-adhesive mass.

Abstract: Backing materials which have been given a self-adhesive treatment on at least one side, characterized in that the self-adhesive composition is a pressure-sensitive hotmelt adhesive composition which at a frequency of 0.1 rad/s has a dynamic-complex glass transition temperature of less than −3° C., preferably from −6° C. to −30° C. and, with particular preference, from −9° C. to −25° C., and their use, in particular, for producing medical products such as plasters, bandages or dressings.

Abstract: Process for the at least partial direct coating of an extensible backing material with a pressure-sensitive adhesive composition, the backing material being guided by a transporting apparatus against a coating apparatus in such a way that the coating apparatus applies the pressure-sensitive adhesive composition to the backing material, characterized in that the coating apparatus is abhesively treated.