Patents by Inventor Klaus Pressel

Klaus Pressel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7910404
    Abstract: A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: March 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Patent number: 7863728
    Abstract: A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principal surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principal surface.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: January 4, 2011
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Patent number: 7858440
    Abstract: Stacked semiconductor chips are disclosed. One embodiment provides an array of first semiconductor chips, covering the array of the first semiconductor chips with a mold material, and placing an array of second semiconductor chips over the array of the first semiconductor chips. The thicknesses of the second semiconductor chips is reduced. The array of the first semiconductor chips are singulated by dividing the mold material.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: December 28, 2010
    Assignee: Infineon Technologies AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Patent number: 7799659
    Abstract: One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip positions arranged in rows and columns, rectilinear separating tracks being arranged between the positions. Crystallographic strains are induced into the region of the separating tracks. This is followed by a laser ablation along the separating tracks, the semiconductor wafer being separated into individual semiconductor chips.
    Type: Grant
    Filed: June 19, 2007
    Date of Patent: September 21, 2010
    Assignee: Infineon Technologies AG
    Inventors: Klaus Pressel, Adolf Koller, Horst Theuss
  • Patent number: 7692588
    Abstract: A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: April 6, 2010
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Patent number: 7687895
    Abstract: A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: March 30, 2010
    Assignee: Infineon Technologies AG
    Inventors: Markus Brunnbauer, Jens Pohl, Klaus Pressel, Thorsten Meyer, Recai Sezi, Stephan Bradl, Ralf Plieninger
  • Publication number: 20100062563
    Abstract: A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 11, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Patent number: 7659618
    Abstract: A semiconductor device for radio frequencies of more than 10 GHz having a semiconductor chip is disclosed. In one embodiment, the semiconductor chip, on its active top side, having a radio-frequency region and a low-frequency region and/or a region which is supplied with DC voltage. In one embodiment, the low-frequency region and/or the region which is supplied with DC voltage of the semiconductor chip is directly embedded in a plastic housing composition, the plastic housing composition is arranged such that it is spaced apart from the radio-frequency region on the active top side of the semiconductor chip.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: February 9, 2010
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Klaus Pressel, Horst Theuss
  • Publication number: 20100019370
    Abstract: A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.
    Type: Application
    Filed: July 24, 2008
    Publication date: January 28, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Publication number: 20090079090
    Abstract: Stacked semiconductor chips are disclosed. One embodiment provides an array of first semiconductor chips, covering the array of the first semiconductor chips with a mold material, and placing an array of second semiconductor chips over the array of the first semiconductor chips. The thicknesses of the second semiconductor chips is reduced. The array of the first semiconductor chips are singulated by dividing the mold material.
    Type: Application
    Filed: September 21, 2007
    Publication date: March 26, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Patent number: 7504711
    Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: March 17, 2009
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • Publication number: 20080308917
    Abstract: An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one conducting line extending into an area of the package structure outside of the outline of the chip. The electronic assembly further includes a substrate embedding the package structure.
    Type: Application
    Filed: June 13, 2007
    Publication date: December 18, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Klaus Pressel, Gottfried Beer
  • Publication number: 20080265383
    Abstract: A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.
    Type: Application
    Filed: November 14, 2007
    Publication date: October 30, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Markus Brunnbauer, Jens Pohl, Klaus Pressel, Thorsten Meyer, Recai Sezi, Stephan Bradl, Ralf Plieninger
  • Publication number: 20080105966
    Abstract: A semiconductor module includes components in a plastic casing. The semiconductor module includes a plastic package molding compound and a semiconductor chip. Also provided in the module are a first principal surface including an upper side of the plastic package molding compound and at least one active upper side of the semiconductor chip, a second principle surface including a back side of the plastic package molding compound, and a multilayered conductor track structure disposed on the first principal surface and a second metal layer disposed on the second principle surface.
    Type: Application
    Filed: October 9, 2007
    Publication date: May 8, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Publication number: 20070293020
    Abstract: One aspect relates to a method for singulating semiconductor wafers to form semiconductor chips. A semiconductor wafer is provided with semiconductor chip positions arranged in rows and columns, rectilinear separating tracks being arranged between the positions. Crystallographic strains are induced into the region of the separating tracks. This is followed by a laser ablation along the separating tracks, the semiconductor wafer being separated into individual semiconductor chips.
    Type: Application
    Filed: June 19, 2007
    Publication date: December 20, 2007
    Applicant: Infineon Technologies AG
    Inventors: Klaus Pressel, Adolf Koller, Horst Theuss
  • Publication number: 20070210883
    Abstract: A substrate including strip conductors with a wiring pattern that connects contact areas to one another. The strip conductors have a small strip conductor width. The contact areas and/or the strip conductors form a narrow connection pitch and include electrically conductive carbon nanotubes.
    Type: Application
    Filed: January 22, 2007
    Publication date: September 13, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • Patent number: 7268423
    Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: September 11, 2007
    Assignee: Infineon Technologies AG
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel
  • Publication number: 20070023896
    Abstract: A semiconductor device for radio frequencies of more than 10 GHz having a semiconductor chip is disclosed. In one embodiment, the semiconductor chip, on its active top side, having a radio-frequency region and a low-frequency region and/or a region which is supplied with DC voltage. In one embodiment, the low-frequency region and/or the region which is supplied with DC voltage of the semiconductor chip is directly embedded in a plastic housing composition, the plastic housing composition is arranged such that it is spaced apart from the radio-frequency region on the active top side of the semiconductor chip.
    Type: Application
    Filed: July 18, 2006
    Publication date: February 1, 2007
    Inventors: Jochen Dangelmaier, Klaus Pressel, Horst Theuss
  • Publication number: 20070026567
    Abstract: A semiconductor module (1) has components (6) for microwave engineering in a plastic casing (7). The semiconductor module (1) has a principal surface (8) with an upper side (9) of a plastic package molding compound (10) and at least one active upper side (11) of a semiconductor chip (12). Disposed on the principal surface (8) is a multilayered conductor track structure (13) which alternately comprises structured metal layers (14, 15) and structured insulation layers (16, 17), where at least one of the insulation layers (16, 17) and/or the plastic package molding compound (10) has at least one microwave insulation region.
    Type: Application
    Filed: June 1, 2006
    Publication date: February 1, 2007
    Inventors: Gottfried Beer, Christoph Kienmayer, Klaus Pressel, Werner Simbuerger
  • Publication number: 20050142933
    Abstract: The present invention describes a rewiring plate for components with connection grids of between approx. 100 nm and 10 ?m, which rewiring plate includes a base body and passages with carbon nanotubes, the lower end of the passages opening out into contact connection surfaces, and the carbon nanotubes forming an electrically conductive connection from the contact connection surfaces to the front surface of the base body.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Inventors: Gottfried Beer, Jochen Dangelmaier, Alfred Haimerl, Manfred Mengel, Klaus Mueller, Klaus Pressel