Patents by Inventor Ko-Cheng Liu

Ko-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging substrate and package structure
    Patent number: 9520351
    Abstract: A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in thickness; and a plurality of circuit layers alternately stacked with the dielectric layers. Therefore, the package warpage encountered in the prior art is avoided.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: December 13, 2016
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang
  • PACKAGING SUBSTRATE AND PACKAGE STRUCTURE
    Publication number: 20150332998
    Abstract: A packaging substrate and a package structure are provided. The packaging substrate includes a plurality of dielectric layers, two of which have a difference in thickness; and a plurality of circuit layers alternately stacked with the dielectric layers. Therefore, the package warpage encountered in the prior art is avoided.
    Type: Application
    Filed: December 9, 2014
    Publication date: November 19, 2015
    Inventors: Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang
  • PACKAGE SUBSTRATE AND STRUCTURE
    Publication number: 20150237717
    Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.
    Type: Application
    Filed: August 7, 2014
    Publication date: August 20, 2015
    Inventors: Chang-fu Lin Chang, Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang