Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.

Abstract: An antenna device according to an aspect of the present invention includes a plurality of radiation elements, an array antenna, a skin material, a core material and an antenna casing. The plurality of radiation elements transmit radio waves of a predetermined frequency. The array antenna has a radiation surface and a back surface opposite to the radiation surface. The plurality of radiation elements are disposed on the radiation surface. The skin material is disposed in a direction in which the skin material faces the radiation surface. The core material is disposed between the array antenna and the skin material, and has a plurality of through-holes. The antenna casing is disposed in a direction in which the antenna casing faces the back surface. A distance between centers of adjacent through-holes of the through-hole is equal to or less than one-half of a wavelength corresponding to the predetermined frequency.

Abstract: An antenna device according to an aspect of the present invention includes dielectric plates, a first to fourth vias, lines, a conductor plate, opening sections, and an antenna element for transmission. The first to fourth vias respectively pierce through the dielectric plates corresponding to the vias and transmit high-frequency signals. A high-frequency signal flowing in the first via is transmitted to the element via a line and an opening section. The line is provided on an upper surface of a dielectric plate and is connected to an upper end portion of the first via. The opening section is provided right above a part of the line. A high-frequency signal flowing in the second, the third, and the fourth vias is transmitted from another line. The line is provided on an upper surface of another dielectric plate and is connected to an upper end of the second via.

Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.

Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.

Abstract: The wireless module according to an aspect of the present invention includes a board, a wireless communication chip that at least transmits or receives a high-frequency signal, an insulator, a conductive film, a feed line, first to third conductor patterns, and first and second vias. The chip, the feed line, and the first and second patterns are located on a first wiring layer of the board. The third pattern is at a ground potential and is located on a second wiring layer of the board. The insulator encapsulates the chip. The film covers at least a part of a side surface of the insulator. The feed line electrically connects the chip and the film. The first and second patterns are in contact with the film. The first via connects the first pattern and the third pattern. The second via electrically connects the second pattern and the third pattern.

Abstract: A method for producing a dual-polarized antenna includes providing first, second and third dielectric substrates with first and second main surfaces. The method includes patterning a conductive film on the first main surface of the first dielectric substrate to form a first ground conductor having an opening and a metal patch as a radiation element, the patch aligned to the opening in a lamination direction, patterning a conductive film on the first main surface of the second dielectric substrate to form a first feed probe configured to excite the metal patch, patterning a conductive film on the second main surface of the second dielectric substrate to form a second ground conductor having a slot generally parallel to the first feed probe, and patterning a conductive film on the second main surface of the third dielectric substrate to form a second feed probe generally perpendicular to the slot.

Abstract: An array antenna device according to an embodiment of the present invention includes an array antenna, a core layer, and a first adhesive layer. The array antenna has a first surface on which one or more radiating elements are disposed. The core layer is disposed facing the first surface. The first adhesive layer is present between the array antenna and the core layer and bonds the array antenna and the core layer to each other. The first adhesive layer includes one or more first openings and one or more radiating elements are disposed inside the first opening.

Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.

Abstract: According to one embodiment, an antenna device includes: an antenna substrate which comprises on a front surface thereof a radiation element for transmitting/receiving radio waves; a dielectric layer which covers the front surface and a back surface of the antenna substrate; and a first conductive layer which covers a side surface of the antenna substrate.

Abstract: According to one embodiment, an antenna device includes first and second split ring resonators and a power supply line. The first split ring resonator includes a conductor enclosing a first opening and having a first void separating a part of the conductor. The second split ring resonator is opposed to the first split ring resonator, including a conductor which encloses a second opening and has a second void separating a part of the conductor. The power supply line feeds power to the first or second split ring resonator. The first split ring resonator is not electrically connected to the second split ring resonator. The first void does not overlap with the second void in an opposing direction of the first split ring resonator and the second split ring resonator.

Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.

Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, electrodes, and a slot antenna. The interposer includes conductive layers disposed at least at a side of a component mounting surface and a side of a reverse surface opposite to the component mounting surface. The semiconductor chip is mounted on the component mounting surface and includes a built-in transceiving circuit. The electrodes are disposed in a conductive layer disposed at the side of the reverse surface of the interposer so as to be electrically connected to an outside of the wireless device. At least a portion of the slot antenna is disposed in at least one of the conductive layers of the interposer. A shortest distance between an end in a width direction of the slot antenna and the electrodes is smaller than a sum of a minimum line width and a minimum line space of the interposer.

Abstract: According to an embodiment, a wireless device includes an interposer, a semiconductor chip, and a non-conductor. The interposer comprises a plurality of conductor layers. The semiconductor chip is mounted on the interposer and comprising a built-in transceiver circuit. The non-conductor is placed on the interposer and seals the semiconductor chip. From among the plurality of conductor layers, a first conductor layer and a second conductor layer are symmetrically positioned with respect to center in a thickness direction of the interposer respectively have a first antenna conductor pattern and a second antenna conductor pattern. The first antenna conductor pattern and the second antenna conductor pattern respectively have a first opening and a second opening functioning as a slot antenna and have substantially equal area of a conductor portion. An orthogonal projection of the first opening onto the second conductor layer overlaps with the second opening.

Abstract: According to one embodiment, an antenna device includes first and second split ring resonators and a power supply line. The first split ring resonator includes a conductor enclosing a first opening and having a first void separating a part of the conductor. The second split ring resonator is opposed to the first split ring resonator, including a conductor which encloses a second opening and has a second void separating a part of the conductor. The power supply line feeds power to the first or second split ring resonator. The first split ring resonator is not electrically connected to the second split ring resonator. The first void does not overlap with the second void in an opposing direction of the first split ring resonator and the second split ring resonator.

Abstract: According to one embodiment, a converter includes a first dielectric substrate; a second dielectric substrate provided above the first dielectric substrate through a first adhesive layer; a first signal line provided between the first dielectric substrate and the second dielectric substrate; a first via that penetrates the first dielectric substrate and is coupled to the first signal line on an upper side of the first via; and a first conductor plate provided at least one of below the first dielectric substrate and above the second dielectric substrate.

Abstract: According to an embodiment, a wireless apparatus includes an interposer including a conductive portion; a semiconductor chip mounted on a component mounting surface of the interposer; a sealing resin on the component mounting surface and sealing the semiconductor chip; a conductive layer covering a surface of the sealing resin and a side surface of the interposer and electrically connected to the conductive portion; a first slot-shaped aperture on a principal surface portion of the conductive layer facing the component mounting surface; a second slot-shaped aperture on a side surface portion of the conductive layer facing the side surface and continuing to the first aperture; and a slot-shaped aperture at the conductive portion and continuing to the second aperture. The first to third apertures function as an integrated slot antenna. A total length of the first aperture is longer than a total length of the third aperture.

Abstract: A dual-polarized antenna may include, but is not limited to, a first ground conductor; a metal patch conductive to the first ground conductor; a dielectric substrate having a first main surface and a second main surface opposite to the first main surface; a second ground conductor disposed on the second main surface of the dielectric substrate, the second ground conductor having at least one of an empty space and a non-empty space of insulator; a first feed probe disposed on the first main surface of the dielectric substrate, the first feed probe being coupled to the metal patch; and a second feed probe being spatially separated by the at least one of the empty space and the non-empty space of insulator from the first feed probe, the second feed probe being coupled to the metal patch through the at least one of the empty space and the non-empty space of insulator.

Abstract: According to one embodiment, an antenna device includes: an antenna substrate which comprises on a front surface thereof a radiation element for transmitting/receiving radio waves; a dielectric layer which covers the front surface and a back surface of the antenna substrate; and a first conductive layer which covers a side surface of the antenna substrate.

Abstract: According to an embodiment, a wireless apparatus includes an interposer substrate, a semiconductor chip, a nonconductive layer, and a conductive film. The interposer substrate includes a conductive portion. The semiconductor chip is mounted on a component mounting face of the interposer substrate. The nonconductive layer is provided on the component mounting face to seal the chip. The conductive film is configured to cover a surface of the nonconductive layer and a side of the interposer substrate and is electrically connected to the conductive portion. The film has a first slot aperture. The conductive portion has a second slot aperture connecting to the first slot aperture. The first and second slot apertures serve as an integrated slot antenna. The antenna has first and second portions. The first portion includes a boundary between the first and second slot apertures and has a width larger than a width of the second portion.