Abstract: According to the embodiments, a semiconductor package includes a semiconductor chip, a first conductive layer, a second conductive layer, and a power feeder. The semiconductor chip is provided on a substrate, is sealed with a resin, and contains a transmission/reception circuit. The first conductive layer is grounded and covers a first region on a surface of the resin. The second conductive layer is not grounded and covers a second region on the surface of the resin other than the first region. A power feeder electrically connects the semiconductor chip to the second conductive layer.

Abstract: According to one embodiment, a wireless device includes a board, a semiconductor chip, a radiation element, a sealing resin, a conductive layer, and a first conductive wall. The semiconductor chip is mounted on the board and includes a transmission/reception circuit. The radiation element is formed on the board. The sealing resin seals the semiconductor chip. The conductive layer covers at least a portion of a surface of the sealing resin. The first conductive wall is provided between the semiconductor chip and the radiation element and is connected to the conductive layer.