Abstract: A partition plate includes a material that blocks transmission of light and partitions an internal space of an enclosure into a light-projecting space where a light projector is disposed and a light-receiving space where a light receiver is disposed. A light shielding plate is configured by a material that blocks transmission of light, is provided between a light-projecting deflector, which is a portion of a deflecting mirror used for light projection, and a light-receiving deflector, which is a portion of the deflecting mirror used for light reception, and integrally rotates with the deflecting mirror. Further, the partition plate has, with respect to at least a part of a peripheral portion of the light shielding plate, an overlap portion where a plate surface of the partition plate and a plate surface of the light shielding plate overlap without being in contact with each other.

Abstract: An optical deflector includes: a reflecting section driven to rotate or oscillate around a drive axis; and a diffraction section configured to diffract light reflected by the reflecting section. The reflecting section is driven to change a first incident angle of light, around the drive axis, incident on the diffraction section from the reflecting section. The diffraction section changes a first emission angle of light emitted from the diffraction section, around a first axis perpendicular to the drive axis and a predetermined direction defined to extend from the reflecting section toward the diffraction section perpendicularly to the drive axis. The diffraction section is driven about the drive axis together with the reflecting section to maintain a second incident angle of light incident on the diffraction section from the reflecting section, around the first axis.

Abstract: A ranging device includes a transmitting section, a receiving section, a housing, a transmissive section, and a heating section. The transmitting section transmits a transmission wave. The receiving section receives a reflection wave caused by reflection of the transmission wave from an object. The housing encloses the transmitting section and the receiving section and has an opening formed for allowing the transmission wave and the reflection wave to pass therethrough. The transmissive section is formed of a material transparent to the transmission wave and the reflection wave, and covers the opening. The heating section includes a mesh of metal having a plurality of mesh openings and is disposed to cover at least a portion of the opening. The heating section generates heat by energising the metal to heat the transmissive section.

Abstract: A scanner has a rotational shaft and at least one reflection surface. The scanner rotates the at least one reflection surface together with the rotational shaft to thereby (i) change a direction of the light beam transmitted from the phototransmitter and incident on the scanner to output a changed light beam in a main scanning direction that is orthogonal to an axial direction of the rotational shaft, and (ii) reflect an arrival light beam arriving from a scanning region to thereby output the light beam to a direction in which the light beam is incident on the scanner. A photoreceiver receives the arrival light beam reflected by the scanner. The photoreceiver includes a received-light deflection mirror that deflects the arrival light beam outputted from the scanner in a second direction different from the first direction, and a light receiving device that receives the arrival light beam deflected by the received-light deflection mirror.

Abstract: A vehicle mounting structure for a ranging device includes a ranging device, a bracket, and a shielding plate. The ranging device measures the distance to an object by emitting transmitted waves and detecting reflected waves from the object to which the transmitted wave has been emitted. The bracket attaches the ranging device in a mounting space formed on an outer surface of a vehicle and capable of accommodating the ranging device. The shielding plate covers the mounting space from the outer-surface side of the vehicle with the ranging device attached in the mounting space. The mounting space is provided on at least one of a front surface of the vehicle, a side surface of the vehicle, or a rear surface of the vehicle. The shielding plate forms an opening for introducing into the mounting space traveling wind occurring along with travel of the vehicle.

Abstract: A vehicle-mounted sensor cleaning device cleans a sensing surface of a vehicle-mounted sensor. The vehicle-mounted sensor cleaning device includes a gas nozzle spraying a gas toward the sensing surface, a gas supply device supplying the gas to the gas nozzle, and a control section controlling operation of the gas supply device. A predetermined value is set in the control section, for indicating an abnormal state of detection accuracy of the vehicle-mounted sensor based on detection accuracy information of an object which is obtained from the vehicle-mounted sensor. A gas supply threshold value is also set, for use in operating the gas supply device to direct a supply of the gas toward the sensing surface before the detection accuracy information becomes equal to or lower than the predetermined value. If the detection accuracy information has become lower than the gas supply threshold value, the control section operates the gas supply device.

Abstract: A vehicle-mounted sensor cleaning device cleans a sensing surface of a vehicle-mounted sensor. The vehicle-mounted sensor cleaning device includes a gas nozzle spraying a gas toward the sensing surface, a gas supply device supplying the gas to the gas nozzle, and a control section controlling operation of the gas supply device. A predetermined value is set in the control section, for indicating an abnormal state of detection accuracy of the vehicle-mounted sensor based on detection accuracy information of an object which is obtained from the vehicle-mounted sensor. A gas supply threshold value is also set, for use in operating the gas supply device to direct a supply of the gas toward the sensing surface before the detection accuracy information becomes equal to or lower than the predetermined value. If the detection accuracy information has become lower than the gas supply threshold value, the control section operates the gas supply device.

Abstract: A partition plate includes a material that blocks transmission of light and partitions an internal space of an enclosure into a light-projecting space where a light projector is disposed and a light-receiving space where a light receiver is disposed. A light shielding plate is configured by a material that blocks transmission of light, is provided between a light-projecting deflector, which is a portion of a deflecting mirror used for light projection, and a light-receiving deflector, which is a portion of the deflecting mirror used for light reception, and integrally rotates with the deflecting mirror. Further, the partition plate has, with respect to at least a part of a peripheral portion of the light shielding plate, an overlap portion where a plate surface of the partition plate and a plate surface of the light shielding plate overlap without being in contact with each other.

Abstract: A scanner has a rotational shaft and at least one reflection surface. The scanner rotates the at least one reflection surface together with the rotational shaft to thereby (i) change a direction of the light beam transmitted from the phototransmitter and incident on the scanner to output a changed light beam in a main scanning direction that is orthogonal to an axial direction of the rotational shaft, and (ii) reflect an arrival light beam arriving from a scanning region to thereby output the light beam to a direction in which the light beam is incident on the scanner. A photoreceiver receives the arrival light beam reflected by the scanner. The photoreceiver includes a received-light deflection mirror that deflects the arrival light beam outputted from the scanner in a second direction different from the first direction, and a light receiving device that receives the arrival light beam deflected by the received-light deflection mirror.

Abstract: There is provided a packaging bag 1 for semiconductor wafer for packaging a shipping container having semiconductor wafers stored therein, wherein the packaging bag is provided with a handle 4. The handle is preferably formed of a welded part 2 and hole 3 opened in the welded part, particularly, a plurality of holes having circular or elliptical shape are preferably provided in the welded part. Whereby there is provided a packaging bag which enables even a heavy shipping container having wafers of large diameter stored therein to be easily taken in and out of an external box, and enables a workability to improve.

Abstract: A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for single crystal processing from a cassette to another cassette, and increasing the workability and labor productivity. A small amount “e” of single-side lapping or single-side polishing is repeated alternately on the two sides “A” and “B” of a semiconductor silicon single crystal wafer “W” to get to a predetermined total lapping or polishing stock removal.

Abstract: A method and apparatus for lapping or polishing a semiconductor silicon single crystal wafer is provided for eliminating the transfer of waviness of a wafer cut by a wire saw apparatus, improving the quality of the wafer, realizing automated lapping or polishing processes, allowing for single crystal processing from a cassette to another cassette, and increasing the workability and labor productivity. A small amount of single-side lapping or single-side polishing is repeated alternately on the two surfaces of a semiconductor silicon single crystal wafer to get to a predetermined total lapping or polishing stock removal.

Abstract: A system for reusing water soluble slurry waste fluid wherein separated available abrasive grains and extracted water soluble coolant are reused. This system is capable of reducing a disposal cost due to a reduction of a load to a waste water disposal plant by effectively reusing water soluble slurry waste fluid, and making a contribution to a reduction of a total slicing cost by reusing abrasive grains and water soluble coolant.

Abstract: A wire saw slicing apparatus is capable of slicing a workpiece into wafers having a flat shape free from undulations (waviness) and includes a feeding device for feeding the workpiece or a wire along a linear feed path to force them together, and a reciprocating device for reciprocating the wire in the axial direction. A program setter sets a first cyclic pattern of the feed speed of the workpiece or the wire and a second cyclic pattern of the reciprocating speed of the wire in such a relation that the first and second cyclic patterns are synchronized at least during a time period of one of the modes of the respective cyclic patterns.

Abstract: Dispersion of cracks in a crack layer across a ground surface is reduced in chamfering a semiconductor silicon wafer. The semiconductor silicon wafer is clamped by a clamp device, which is freely rotated and a polisher having the shape of a ring built in a polishing device, which is freely rotated, is disposed in a place, the polisher having a periphery shaping edge on a peripheral side surface, wherein the polishing device is moved in a radial direction of the wafer so as to position the periphery shaping edge close to the periphery of the wafer, and the wafer and the polishing device are rotated relatively to each other, while slurry containing suspension of abrasive grains is supplied to a narrow space therebetween from a slurry supply nozzle.

Abstract: In a wire saw for slicing a cylindrical workpiece such as a silicon ingot so as to obtain wafers or the like, the feed rate of slurry fed to the workpiece, the viscosity of the slurry, or the feed rate of a wire is varied according to the cutting length in the workpiece or the angle between the wire and the circumference of the workpiece. It becomes possible to obtain wafers or the like, each having a uniform thickness.

Abstract: A method of manufacturing wire for use in a wire saw used for slicing a semiconductor ingot into wafers is disclosed. A starting wire, which is an iron or iron alloy wire plated with copper or copper alloy, is drawn into a fine wire in a finish drawing step. Subsequently, copper or copper alloy plating is removed from the fine wire surface through chemical polishing with an acid treatment solution or a like solution, physical polishing with polishing cloth or the like, or electropolishing, or through combined polishing thereof. The method makes it possible to manufacture wire having excellent quality characteristics without raising a problem such as metal contamination of product wafers sliced from the ingot.

Abstract: There is disclosed a method of manufacturing a semiconductor wafer which includes at least a slicing process for slicing a semiconductor monocrystalline ingot in order to obtain a disc-shaped semiconductor wafer. In the method, the sliced semiconductor wafer is etched before being transported to a subsequent process. Even when a monocrystalline ingot having a large diameter is sliced through use of a wire saw, the method prevents generation of breakage, cracks, chips, or the like in processes subsequent to the slicing process, thereby enabling production of large-diameter wafers with high productivity and high yield through utilization of the advantage of the wire saw in slicing a large-diameter monocrystalline ingot; i.e., high cutting speed and a small amount of slicing stock removal.

Abstract: A method of slicing a semiconductor single crystal ingot by a wire saw slicing apparatus and a semiconductor wafer produced by the method, in which the running direction of the wire is not corresponding with the cleavage directions of the semiconductor single crystal ingot so that occurrence of cracks or breakage in the semiconductor wafer produced by the method can be suppressed significantly without any additional processes or an increase in cost.

Abstract: A system for reusing oily slurry waste fluid is capable of decreasing the total amount of oily slurry waste fluid to be discarded by collecting and reusing available abrasive grains, oil and water from the oily slurry waste fluid, thereby reducing the volume carbon dioxide generated when burning the oily slurry waste fluid and being an effective solution to the environmental problems.