Patents by Inventor Kohei Toyama

Kohei Toyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of using an ID saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method
    Patent number: 5226403
    Abstract: An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of the ingot to obtain wafers. The feed of the single crystal ingot to the blade of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern.
    Type: Grant
    Filed: May 15, 1991
    Date of Patent: July 13, 1993
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventor: Kohei Toyama