Patents by Inventor Kohei Yokoyama
Kohei Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11071224Abstract: A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.Type: GrantFiled: October 26, 2015Date of Patent: July 20, 2021Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Kohei Yokoyama, Yoshiharu Hirakata
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Publication number: 20200185420Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.Type: ApplicationFiled: February 18, 2020Publication date: June 11, 2020Inventors: Hisao IKEDA, Kouhei TOYOTAKA, Hideaki SHISHIDO, Hiroyuki MIYAKE, Kohei YOKOYAMA, Yasuhiro JINBO, Yoshitaka DOZEN, Takaaki NAGATA, Shinichi HIRASA
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Publication number: 20200106032Abstract: A flexible display device is manufactured with high yield. A display device having high resistance to repeated bending is provided. The display device is manufactured by forming a separation layer over a support substrate; forming, over the separation layer, an inorganic insulating layer including a first portion and a second portion; forming a display element over the inorganic insulating layer to be overlapped with the first portion; forming a connection electrode over the inorganic insulating layer to be overlapped with the second portion; sealing the display element; separating the support substrate and the inorganic insulating layer using the separation layer; attaching a substrate to the inorganic insulating layer to be overlapped with the first portion; and etching the second portion using the substrate as a mask to expose the connection electrode.Type: ApplicationFiled: May 11, 2018Publication date: April 2, 2020Inventors: Takaaki NAGATA, Tatsuya SAKUISHI, Kohei YOKOYAMA, Yasuhiro JINBO, Taisuke KAMADA, Akihiro CHIDA
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Patent number: 10583641Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.Type: GrantFiled: November 6, 2017Date of Patent: March 10, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Masakatsu Ohno, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo, Hisao Ikeda, Kohei Yokoyama, Hiroki Adachi, Satoru Idojiri
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Patent number: 10573667Abstract: Provided is a display device with extremely high resolution, a display device with higher display quality, a display device with improved viewing angle characteristics, or a flexible display device. Same-color subpixels are arranged in a zigzag pattern in a predetermined direction. In other words, when attention is paid to a subpixel, another two subpixels exhibiting the same color as the subpixel are preferably located upper right and lower right or upper left and lower left. Each pixel includes three subpixels arranged in an L shape. In addition, two pixels are combined so that pixel units including subpixel are arranged in matrix of 3×2.Type: GrantFiled: December 1, 2016Date of Patent: February 25, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hisao Ikeda, Kouhei Toyotaka, Hideaki Shishido, Hiroyuki Miyake, Kohei Yokoyama, Yasuhiro Jinbo, Yoshitaka Dozen, Takaaki Nagata, Shinichi Hirasa
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Publication number: 20200057330Abstract: A display device that can switch between normal display and see-through display is provided. Visibility in see-through display is improved. A liquid crystal element overlaps with a light-emitting element. The light-emitting element, a transistor, and the like overlapping with the liquid crystal element transmit visible light. When the liquid crystal element blocks external light, an image is displayed with the light-emitting element. When the liquid crystal element transmits external light, an image displayed with the light-emitting element is superimposed on a transmission image through the liquid crystal element.Type: ApplicationFiled: November 1, 2017Publication date: February 20, 2020Inventors: Shunpei YAMAZAKI, Kohei YOKOYAMA, Takaaki NAGATA, Tatsuya SAKUISHI, Akio YAMASHITA, Yasuhiro JINBO, Hideaki SHISHIDO, Tetsuji ISHITANI
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Patent number: 10522574Abstract: A method for manufacturing a display device is provided. The method includes a step of forming a first layer over a first substrate, a terminal electrode over the first layer, a display element over the first layer, and a peeling layer overlapping with the terminal electrode, a step of forming a second layer over a second substrate, a step of attaching the first substrate to the second substrate with a bonding layer therebetween, a step of separating the first substrate from the first layer, a step of attaching a third substrate to the first layer, a step of separating the second substrate from the second layer together with part of the bonding layer, and a step of attaching a fourth substrate to the second layer. At least one of the first layer and the second layer includes an organic film.Type: GrantFiled: May 10, 2017Date of Patent: December 31, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Akihiro Chida, Tatsuya Sakuishi, Daiki Nakamura, Tomoya Aoyama, Kohei Yokoyama, Daisuke Kubota
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Publication number: 20190348448Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.Type: ApplicationFiled: July 25, 2019Publication date: November 14, 2019Inventors: Shunpei YAMAZAKI, Yoshiharu HIRAKATA, Takashi HAMADA, Kohei YOKOYAMA, Yasuhiro JINBO, Tetsuji ISHITANI, Daisuke KUBOTA
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Patent number: 10442172Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.Type: GrantFiled: June 1, 2017Date of Patent: October 15, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Kayo Kumakura, Tomoya Aoyama, Akihiro Chida, Kohei Yokoyama, Masakatsu Ohno, Satoru Idojiri, Hisao Ikeda, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo
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Patent number: 10367014Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.Type: GrantFiled: October 26, 2015Date of Patent: July 30, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Yoshiharu Hirakata, Takashi Hamada, Kohei Yokoyama, Yasuhiro Jinbo, Tetsuji Ishitani, Daisuke Kubota
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Patent number: 10343191Abstract: An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (30a). Characterized is a wiping device (200) including a stage (230) that supports a sheet-like member (220), a wiping means (210) that wipes an adhering object (30a) adhering on a peripheral portion of the sheet-like member (220), a wiping cloth (241) that is attachably and detachably provided for the wiping means (210), and a solvent (261) that adheres to the wiping cloth (241), in which the wiping means (210) is provided with the wiping cloth (241), makes the solvent (261) adhere to the wiping cloth (241), and wipes the adhering object (30a), or a stack manufacturing apparatus (1000) including such a wiping device (200).Type: GrantFiled: April 13, 2015Date of Patent: July 9, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Masakatsu Ohno, Kayo Kumakura, Satoru Idojiri, Yoshiharu Hirakata, Kohei Yokoyama
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Patent number: 10304919Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.Type: GrantFiled: April 30, 2018Date of Patent: May 28, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Yasuhiro Jinbo, Kohei Yokoyama, Yuki Tamatsukuri, Naoto Goto, Masami Jintyou, Masayoshi Dobashi, Masataka Nakada, Akihiro Chida, Naoyuki Senda
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Patent number: 10155368Abstract: A method and an apparatus for manufacturing an object which involve a separation technique are provided. A first substrate provided with an object is attached to a second substrate and is then suction-fixed by using a suction chuck (also referred to as a suction stage or a vacuum chuck) including portions with different suction capabilities or by using its functional equivalent, and the second substrate is separated from the first substrate. Accordingly, the object is separated from the first substrate and transferred to the second substrate. An apparatus for achieving this is also provided. A substrate fixture surface of the suction chuck or its functional equivalent includes a plurality of portions provided with suction micro-holes and a portion provided with no holes. Owing to the plurality of portions provided with suction micro-holes, a plurality of objects can be transferred from the first substrate to the second substrate.Type: GrantFiled: May 6, 2014Date of Patent: December 18, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Yoshiharu Hirakata, Akihiro Chida, Kohei Yokoyama
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Patent number: 10147780Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, and a pixel circuit. Electrodes of the display element including the liquid crystal layer and the display element including the light-emitting layer are electrically connected to the pixel circuit. The electrode of the display element including the liquid crystal layer includes a reflective film including an opening. The pixel circuit includes a transistor including a semiconductor film. The number of insulating films in a region overlapping with the opening is smaller than that of insulating films overlapping with the semiconductor film. In addition, the display element including the light-emitting layer includes two light-emitting elements.Type: GrantFiled: October 11, 2016Date of Patent: December 4, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Daiki Nakamura, Kohei Yokoyama, Yasuhiro Jinbo, Toshiki Sasaki, Masataka Nakada, Naoto Goto, Takahiro Iguchi
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Patent number: 10141526Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: GrantFiled: August 31, 2016Date of Patent: November 27, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Patent number: 10141525Abstract: A device in which warpage or distortion is less likely to occur even in a high-temperature or high-humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, and an element layer. The first flexible substrate includes an organic resin. The second flexible substrate includes an organic resin. The element layer is positioned between the first flexible substrate and the second flexible substrate. The element layer includes a light-emitting element. The light-emitting element emits light to the first flexible substrate side. The first flexible substrate has higher average transmittance of light having a wavelength of greater than or equal to 400 nm and less than or equal to 800 nm than the second flexible substrate.Type: GrantFiled: June 23, 2015Date of Patent: November 27, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Minato Ito, Kohei Yokoyama
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Patent number: 10141544Abstract: A highly reliable display device or electronic device is provided. The display device includes a first electrode, a second electrode, a light-emitting layer between the first electrode and the second electrode, and a protective film over the second electrode. The protective film includes a first insulating film and a second insulating film over the first insulating film. The first insulating film includes one or more of aluminum oxide, hafnium oxide, and zirconium oxide, and the second insulating film includes one or more of aluminum oxide, hafnium oxide, and zirconium oxide. A composition of the first insulating film is different from a composition of the second insulating film. A water vapor transmission rate of the protective film is lower than 1×10?2 g/(m2·day).Type: GrantFiled: August 7, 2017Date of Patent: November 27, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Kazuki Tsuda, Kohei Yokoyama, Yasuhiro Jinbo
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Patent number: 10101628Abstract: Power consumption of a display device is reduced. The display quality of the display device is improved. A high-quality image is displayed regardless of a usage environment. A light-weight and non-breakable display device is provided. In the display device, a first display panel and a second display panel are bonded to each other with an adhesive layer. The first display panel includes first pixels that include reflective liquid crystal elements. The second display panel includes second pixels that include light-emitting elements. The first display panel includes a first resin layer positioned closest to the adhesive layer. The second display panel includes a second resin layer positioned closest to the adhesive layer. The thickness of each of the first resin layer and the second resin layer is 0.1 ?m or more and 3 ?m or less.Type: GrantFiled: April 5, 2017Date of Patent: October 16, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Daisuke Kubota, Kei Takahashi, Yuji Iwaki, Hisao Ikeda, Kohei Yokoyama
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Patent number: 10079353Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.Type: GrantFiled: November 13, 2017Date of Patent: September 18, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Patent number: 10065808Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.Type: GrantFiled: July 26, 2016Date of Patent: September 4, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Masakatsu Ohno, Kohei Yokoyama, Satoru Idojiri, Hisao Ikeda, Yasuhiro Jinbo, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi