Patents by Inventor Kohei Yokoyama

Kohei Yokoyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170152594
    Abstract: In order to provide a highly reliable organic EL element, a first step in which a deposition material is heated and vaporized in a deposition chamber in which the pressure is reduced and a second step in which a layer included in an EL layer is deposited in the deposition chamber are performed while exhaustion is performed and the partial pressure of water in the deposition chamber is measured with a mass spectrometer. Alternatively, the deposition chamber in the deposition apparatus includes a deposition material chamber and is connected to an exhaust mechanism. The deposition material chamber is separated from the deposition chamber by a sluice valve, includes a deposition material holding portion including a heating mechanism, and is connected to a mass spectrometer and an exhaust mechanism.
    Type: Application
    Filed: February 9, 2017
    Publication date: June 1, 2017
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kohei Yokoyama, Hisao IKEDA, Shinichi HIRASA, Yasuhiro JINBO, Natsuko TAKASE
  • Publication number: 20170123268
    Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, a first transistor, and a second transistor. The first transistor is electrically connected to an electrode of the display element including the liquid crystal layer, and the second transistor is electrically connected to an electrode of the display element including the light-emitting layer. The electrode of the display element including the liquid crystal layer and the electrode of the display element including the light-emitting layer each include a reflective film and a conductive film. The reflective film of the display element including the liquid crystal layer has a region containing a metal contained in the reflective film of the display element including the light-emitting layer.
    Type: Application
    Filed: October 26, 2016
    Publication date: May 4, 2017
    Inventors: Toshiki SASAKI, Satoshi SEO, Nobuharu OHSAWA, Kohei YOKOYAMA, Yasuhiro JINBO
  • Publication number: 20170104049
    Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, and a pixel circuit. Electrodes of the display element including the liquid crystal layer and the display element including the light-emitting layer are electrically connected to the pixel circuit. The electrode of the display element including the liquid crystal layer includes a reflective film including an opening. The pixel circuit includes a transistor including a semiconductor film. The number of insulating films in a region overlapping with the opening is smaller than that of insulating films overlapping with the semiconductor film. In addition, the display element including the light-emitting layer includes two light-emitting elements.
    Type: Application
    Filed: October 11, 2016
    Publication date: April 13, 2017
    Inventors: Daiki NAKAMURA, Kohei YOKOYAMA, Yasuhiro JINBO, Toshiki SASAKI, Masataka NAKADA, Naoto GOTO, Takahiro IGUCHI
  • Publication number: 20170092885
    Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
    Type: Application
    Filed: August 31, 2016
    Publication date: March 30, 2017
    Inventors: Tatsuya SAKUISHI, Yutaka UCHIDA, Hiroki ADACHI, Saki EGUCHI, Junpei YANAKA, Kayo KUMAKURA, Seiji YASUMOTO, Kohei YOKOYAMA, Akihiro CHIDA
  • Patent number: 9578718
    Abstract: In order to provide a highly reliable organic EL element, a first step in which a deposition material is heated and vaporized in a deposition chamber in which the pressure is reduced and a second step in which a layer included in an EL layer is deposited in the deposition chamber are performed while exhaustion is performed and the partial pressure of water in the deposition chamber is measured with a mass spectrometer. Alternatively, the deposition chamber in the deposition apparatus includes a deposition material chamber and is connected to an exhaust mechanism. The deposition material chamber is separated from the deposition chamber by a sluice valve, includes a deposition material holding portion including a heating mechanism, and is connected to a mass spectrometer and an exhaust mechanism.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: February 21, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kohei Yokoyama, Hisao Ikeda, Shinichi Hirasa, Yasuhiro Jinbo, Natsuko Takase
  • Publication number: 20170021394
    Abstract: An object is to eliminate a harmful effect when a film is bonded by wiping an adhering sealant (30a). Characterized is a wiping device (200) including a stage (230) that supports a sheet-like member (220), a wiping means (210) that wipes an adhering object (30a) adhering on a peripheral portion of the sheet-like member (220), a wiping cloth (241) that is attachably and detachably provided for the wiping means (210), and a solvent (261) that adheres to the wiping cloth (241), in which the wiping means (210) is provided with the wiping cloth (241), makes the solvent (261) adhere to the wiping cloth (241), and wipes the adhering object (30a), or a stack manufacturing apparatus (1000) including such a wiping device (200).
    Type: Application
    Filed: April 13, 2015
    Publication date: January 26, 2017
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu OHNO, Kayo KUMAKURA, Satoru IDOJIRI, Yoshiharu HIRAKATA, Kohei YOKOYAMA
  • Patent number: 9543548
    Abstract: One surface of a first substrate provided with at least light-absorbing layers separately formed, partition layers each formed between the light-absorbing layers and having an inverse taper shape, and material layers formed on the light-absorbing layers and on the partition layers so that the material layers are separated from each other is disposed to face a deposition target surface of a second substrate; light irradiation is performed from the other surface of the first substrate, only the material layers in regions overlapped with the light-absorbing layers are heated and evaporated to the deposition target surface of the second substrate.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: January 10, 2017
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Satoshi Seo, Kohei Yokoyama
  • Publication number: 20160332826
    Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
    Type: Application
    Filed: July 26, 2016
    Publication date: November 17, 2016
    Inventors: Masakatsu OHNO, Kohei YOKOYAMA, Satoru IDOJIRI, Hisao IKEDA, Yasuhiro JINBO, Hiroki ADACHI, Yoshiharu HIRAKATA, Shingo EGUCHI
  • Patent number: 9455418
    Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: September 27, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu Ohno, Kohei Yokoyama, Satoru Idojiri, Hisao Ikeda, Yasuhiro Jinbo, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi
  • Patent number: 9444051
    Abstract: The present invention relates to a donor substrate and a method of manufacturing a light-emitting device. The donor substrate includes a reflective layer including an opening portion, a light absorption layer covering the opening portion of the reflective layer over the reflective layer, a heat insulating layer including an opening portion in a position overlapped with the opening portion of the reflective layer over the light absorption layer, and a material layer including a light-emitting material covering the opening portion of the heat insulating layer over the heat insulating layer. A target substrate and the donor substrate are disposed to face each other, and an EL layer is formed over the target substrate by performing light irradiation from a rear surface of the donor substrate.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: September 13, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Tomoya Aoyama, Yosuke Sato, Kohei Yokoyama, Rena Takahashi
  • Patent number: 9437832
    Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
    Type: Grant
    Filed: February 13, 2015
    Date of Patent: September 6, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Tatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
  • Publication number: 20160243812
    Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
    Type: Application
    Filed: May 5, 2016
    Publication date: August 25, 2016
    Inventors: Kayo KUMAKURA, Tomoya AOYAMA, Akihiro CHIDA, Kohei YOKOYAMA, Masakatsu OHNO, Satoru IDOJIRI, Hisao IKEDA, Hiroki ADACHI, Yoshiharu HIRAKATA, Shingo EGUCHI, Yasuhiro JINBO
  • Publication number: 20160163924
    Abstract: A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element including an electroluminescence (EL) layer, a housing including a light-emitting element has a terminal electrode electrically connected to the light-emitting element on a peripheral end portion. The terminal electrode provided on the housing so as to be exposed to the outside is in contact with a terminal electrode for the external power supply, so that the external power supply and the light-emitting element are electrically connected to each other and power can be supplied to the lighting device.
    Type: Application
    Filed: February 17, 2016
    Publication date: June 9, 2016
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kenichi Wakimoto, Akihiro Chida, Kohei Yokoyama
  • Patent number: 9343706
    Abstract: Provided is a device in which heat conduction from a sealant to a functional element is suppressed and whose bezel is slim. The sealing structure includes a first substrate, a second substrate whose surface over which a sealed component is provided faces the first substrate, and a frame-like sealant which seals a space between the first substrate and the second substrate with the first substrate and the second substrate. The second substrate includes a groove portion between the sealant and the sealed component. The groove portion is in a vacuum or includes a substance whose heat conductivity is lower than that of the second substrate.
    Type: Grant
    Filed: March 5, 2014
    Date of Patent: May 17, 2016
    Assignee: Semiconductor Energy Laboratory Co., LTD.
    Inventors: Minato Ito, Kohei Yokoyama, Yusuke Nishido
  • Patent number: 9333736
    Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: May 10, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kayo Kumakura, Tomoya Aoyama, Akihiro Chida, Kohei Yokoyama, Masakatsu Ohno, Satoru Idojiri, Hisao Ikeda, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo
  • Publication number: 20160120054
    Abstract: A novel, highly convenient or reliable functional panel is provided. A novel, highly convenient or reliable method for manufacturing a functional panel is provided. The functional panel includes a first base; a second base having a region overlapping with the first base; a bonding layer that bonds the first base to the second base; and an insulating layer in contact with the first base, the second base, and the bonding layer. With this structure, an opening which is formed easily in a region where the bonding layer is in contact with the first base or the second base can be filled with the insulating layer, which can prevent impurities from being diffused into the functional layer located in a region surrounded by the first base, the second base, and the bonding layer that bonds the first base to the second base.
    Type: Application
    Filed: October 26, 2015
    Publication date: April 28, 2016
    Inventors: Shunpei YAMAZAKI, Kohei YOKOYAMA, Yoshiharu HIRAKATA
  • Publication number: 20160118416
    Abstract: A display device in which a peripheral circuit portion has high operation stability is provided. The display device includes a first substrate and a second substrate. A first insulating layer is provided over a first surface of the first substrate. A second insulating layer is provided over a first surface of the second substrate. The first surface of the first substrate and the first surface of the second substrate face each other. An adhesive layer is provided between the first insulating layer and the second insulating layer. A protective film in contact with the first substrate, the first insulating layer, the adhesive layer, the second insulating layer, and the second substrate is formed in the vicinity of a peripheral portion of the first substrate and the second substrate.
    Type: Application
    Filed: October 26, 2015
    Publication date: April 28, 2016
    Inventors: Shunpei YAMAZAKI, Yoshiharu HIRAKATA, Takashi HAMADA, Kohei YOKOYAMA, Yasuhiro JINBO, Tetsuji ISHITANI, Daisuke KUBOTA
  • Patent number: 9269921
    Abstract: A lighting device including an electroluminescent (EL) material is connected to an external power supply easily and the convenience is improved. In a lighting device having a light-emitting element including an electroluminescence (EL) layer, a housing including a light-emitting element has a terminal electrode electrically connected to the light-emitting element on a peripheral end portion. The terminal electrode provided on the housing so as to be exposed to the outside is in contact with a terminal electrode for the external power supply, so that the external power supply and the light-emitting element are electrically connected to each other and power can be supplied to the lighting device.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: February 23, 2016
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kenichi Wakimoto, Akihiro Chida, Kohei Yokoyama
  • Publication number: 20150380673
    Abstract: A device in which warpage or distortion is less likely to occur even in a high-temperature or high-humidity environment is provided. A light-emitting device includes a first flexible substrate, a second flexible substrate, and an element layer. The first flexible substrate includes an organic resin. The second flexible substrate includes an organic resin. The element layer is positioned between the first flexible substrate and the second flexible substrate. The element layer includes a light-emitting element. The light-emitting element emits light to the first flexible substrate side. The first flexible substrate has higher average transmittance of light having a wavelength of greater than or equal to 400 nm and less than or equal to 800 nm than the second flexible substrate.
    Type: Application
    Filed: June 23, 2015
    Publication date: December 31, 2015
    Inventors: Minato ITO, Kohei YOKOYAMA
  • Patent number: 9209355
    Abstract: Occurrence of a crosstalk phenomenon in a light-emitting device is inhibited. The light-emitting device includes an insulating layer; a first lower electrode over the insulating layer; a second lower electrode over the insulating layer; a structure over the insulating layer and between the first lower electrode and the second lower electrode; a first partition wall between the first lower electrode and the structure, over the insulating layer; a second partition wall between the second lower electrode and the structure, over the insulating layer; a first light-emitting unit over the first lower electrode, the first partition wall, the structure, the second partition wall, and the second lower electrode; an intermediate layer over the first light-emitting unit; a second light-emitting unit over the intermediate layer; and an upper electrode over the second light-emitting unit.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: December 8, 2015
    Assignees: Semiconductor Energy Laboratory Co., Ltd., Sharp Kabushiki Kaisha
    Inventors: Naoyuki Senda, Yoshitaka Dozen, Kohei Yokoyama, Manabu Niboshi, Yuto Tsukamoto, Satoshi Inoue, Shinichi Kawato, Katsuhiro Kikuchi