Abstract: According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (212). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has ejection holes in a region which is to face the intermediate region (30i), from which a fluid is ejected in the separation step.

Abstract: According to a flexible OLED device production method of the present disclosure, a multilayer stack (100) is provided which includes a glass base (10), a functional layer region (20) including a TFT layer (20A) and an OLED layer (20B), and a synthetic resin film (30) provided between the glass base (10) and the functional layer region (20) and bound to the glass base (10). In a dry gas atmosphere whose dew point is not more than ?50° C., the multilayer stack (100) is separated into a first portion (110) and a second portion (120), and a surface (30s) of the synthetic resin film (30) is exposed to the dry gas atmosphere, the first portion (110) including the functional layer region (20) and the synthetic resin film (30), the second portion (120) including the glass base (10). The first portion (110) is transported from the dry gas atmosphere to a reduced-pressure atmosphere R, and a protection layer (60) is formed on the surface (30s) of the synthetic resin film (30) in the reduced-pressure atmosphere R.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (212). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has ejection holes in a region which is to face the intermediate region (30i), from which a fluid is ejected in the separation step.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: A flexible emitting light device production apparatus of the present disclosure includes: a stage (520) for supporting a flexible emitting light supporting substrate (10), the flexible display supporting substrate including a glass base (11) and a synthetic resin film (12) provided on the glass base; a polisher head (535) configured to approach a selected region of a surface (12s) of the synthetic resin film (12) and polish the region so that a polish recess (12c) is formed in the surface (12s); and a repair head (536) for supplying a liquid material (20a) to the polish recess (12c) formed in the surface (12s) of the synthetic resin film (12) and heating the liquid material (20a), thereby forming a sintered layer (20) from the liquid material (20a).

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the flexible substrate region (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (210). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (210). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and a flexible substrate region (30d) of a plastic film (30) of a multilayer stack (100) are divided, the interface between the plastic film (30) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into the first portion (110) and the second portion (120) while the multilayer stack (100) is kept in contact with the stage (212). The first portion (110) includes the intermediate region (30i) and a light-emitting device (1000) which are adhered to the stage (212). The light-emitting device (1000) includes a functional layer region (20) and the flexible substrate region (30d). The second portion (120) includes the glass base (10). The intermediate region (30i) adhered to the stage (212) is removed from the stage while the light-emitting device (1000) is kept adhered to the stage.

Abstract: According to a flexible light-emitting device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with lift-off light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of light-emitting devices (1000) which are in contact with the stage (212). The light-emitting devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: A flexible display supporting substrate of the present disclosure includes: a glass base (11); a plastic film (12) which has a surface (12s), the surface having a polish recess (12c), the plastic film being supported by the glass base (11); and an oxide layer (20) overlying a part of the surface (12s) of the plastic film (12) and covering at least part of the polish recess (12c).

Abstract: According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (212). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i).

Abstract: A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

Abstract: A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.

Abstract: A method for manufacturing flexible electronic devices is provided to enable to manufacture the flexible electronic devices without increasing a number of steps, enables to reuse a glass substrate, and reduces the possibility that the flexible electronic devices are damaged or corners of them are not bent even if the detached flexible electronic devices are brought into contact with each other.

Abstract: A method for producing a device support base in an embodiment according to the present disclosure includes step A of providing a support base having a first surface and a second surface parallel to the first surface; step B of forming a laser beam in a first direction parallel to the first surface of the support base; and step C of translating or rotating the laser beam in a second direction parallel to the first surface of the support base and crossing the first direction to remove at least a part of protruding portions or contamination elements on the first surface of the support base.

Abstract: After an intermediate region and a flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and a glass base is irradiated with laser light. The multilayer stack is separated into the first portion and the second portion while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and the intermediate region. The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources and temporally and spatially modulating a power of the plurality of laser light sources according to a shape of the flexible substrate region of the synthetic resin film.

Abstract: A flexible display supporting substrate (10) of the present disclosure includes: a glass base (11); a plastic film (12) which has a surface (12s), the plastic film being supported by the glass base (11); and a sintered layer (20) covering the surface (12s) of the plastic film (12).

Abstract: According to a flexible OLED device production method of the present disclosure, after an intermediate region (30i) and flexible substrate regions (30d) of a plastic film (30) of a multilayer stack (100) are divided from one another, the interface between the flexible substrate regions (30d) and a glass base (10) is irradiated with laser light. The multilayer stack (100) is separated into a first portion (110) and a second portion (120) while the multilayer stack (100) is in contact with a stage (212). The first portion (110) includes a plurality of OLED devices (1000) which are in contact with the stage (212). The OLED devices (1000) include a plurality of functional layer regions (20) and the flexible substrate regions (30d). The second portion (120) includes the glass base (10) and the intermediate region (30i). The stage (212) has ejection holes in a region which is to face the intermediate region (30i), from which a fluid is ejected in the separation step.

Abstract: In a flexible OLED device production method, after an intermediate region and flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and glass base is irradiated with laser light. The multilayer stack is separated into first and second portions while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and intermediate region. The laser light is formed from a plurality of arranged laser light sources and irradiation intensity for at least part of the interface between the intermediate region and the glass base is lower than the irradiation intensity for the interface between the flexible substrate region and the glass base.

Abstract: A method for releasing a resin film from the supporting substrate is provided. The method includes applying and hardening a liquid resin on the supporting substrate to form the resin film; forming an electronic element on the resin film; preparing for separating the supporting substrate into a first part and a second part; generating a partial release between the resin film and the first part, by relatively moving the first part and an end edge of the second part adjacent to the first part; and applying a blowing force with a gas or a liquid in a widthwise direction of the resin film in a parallel direction to the supporting substrate at an end part of an adhered face between the resin film exposed by the partial release and the first part.