Abstract: A light emitting diode comprising a light emitting diode element 20 mounted on a glass epoxy substrate 12, this light emitting diode element 20 being protected at its surface side by a resin seal member 33, in which: a light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element 20; and a fluorescent material containing layer 21 composed of a fluorescent material containing layer 21 composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element 20, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

Abstract: An LED is mounted on a substrate, and a protector made of a transparent material is provided for sealing the LED. A color correcting filter is formed on the protector. The color correcting filter has an effect of changing chromaticity of emitted light of the LED to desired chromaticity of illuminating light to be discharged from the LED device.

Abstract: An LED is mounted on a substrate, and a protector made of a transparent material is provided for sealing the LED. A color correcting filter is formed on the protector. The color correcting filter has an effect of changing chromaticity of emitted light of the LED to desired chromaticity of illuminating light to be discharged from the LED device.

Abstract: A white LED (20) for emitting illumination light entirely to exterior, comprising a first LED element (4) and a second LED element (5) which have mutually different emission wavelengths, and a sealing member (10) including a fluorescent material (8) which is excited to emit yellow light (sy) and for sealing at least the first LED element, the first LED element (4) being a long wave length-blue LED element for emitting blue light (sb 1) of a long wave length in which a peak wave length is in the range of 470 nm to 490 nm, the second LED element being a red LED element for emitting red light (sr).

Abstract: An LED is mounted on a circuit substrate, the LED is encapsulated by a transparent resin layer. A reflection layer is provided on the resin layer for reflecting and transmitting lights emitted from the LED.

Abstract: An elastic connector integrated with an electrode on at least either a chip-type LED or a circuit board facing each other is sandwiched and compressed by the chip-type LED and the circuit board so as to provide an electric connection. The thus obtained integrated connector is thin and cost-effective while able to provide a secure conductivity between the electrode of the printed circuit board and the chip-type LED in a simple connection method, and a LED including the integrated connector also is provided.

Abstract: A light emitting element is disclosed. When the light emitting diode is used as a backlight source for a liquid crystal display, the distance from the light emitting element 25 to the light receiving surface of the light guide plate 11 is reduced to increase the light spreading angle &thgr;2 of the light introduced from the light emitting element 25 into the light guide plate 11 and also increase the amount of light entering the light guide plate 11, thus enhancing the level of brightness of the liquid crystal display. The light emitting diode comprises: a mother board 8 having an opening 9; a pair of electrodes 23, 24 arranged on one surface of the mother board 8; a light guide plate 11 arranged on the other surface of the mother board 8; a light emitting element 25 arranged in the opening 9 of the mother board 8 and mounted to one of the pair of electrodes 23, 24; and a positioning means 30 mounted on the one electrode to position the light emitting element 25 close to the light guide plate 11.

Abstract: A light emitting diode comprising a light emitting diode element 20 mounted on a glass epoxy substrate 12, this light emitting diode element 20 being protected at its surface side by a resin seal member 33, in which: a light emitting diode element for blue luminescence, formed of gallium nitride type compound semiconductor is used as the above-mentioned light emitting diode element 20; and a fluorescent material containing layer 21 composed of a fluorescent material containing layer 21 composed of a fluorescent material dispersed into an adhesive is arranged on the back side of this light emitting diode element. On the back side of the light emitting diode element 20, blue luminescence is converted in wavelength to produce white luminescence of high intensity.

Abstract: A photo-sensor has a light-sensitive element mounted on a substrate, the light-sensitive element is encapsulated by an encapsulation resin. A filter layer is mounted on the encapsulation resin. The filter layer has a filtering effect corresponding to spectral responsivity of the light-sensitive element.

Abstract: A light emitting element has a base made of heat conductive material, a wire plate made of an insulation material and secured to an upper surface of the base. Conductive patterns are secured to the wire plate, and a light emitting chip is secured to the base at an exposed mounting area. The light emitting chip is electrically connected to the conductive patterns.

Abstract: A light emitting diode is disclosed which is small and inexpensive and can emit a variety of intermediate colors of light with a single light emitting element chip and whose current consumption is small. This invention provides a light emitting diode which comprises: a substrate; electrodes formed on the substrate; a light emitting element chip connected to the electrodes and mounted on an upper surface of the substrate; a resin material sealing an upper surface side of the light emitting element chip; and fluorescent particles and coloring particles scatteringly distributed in the resin material. The coloring particles absorb a part of wavelengths of light from the light emitting element chip and a part of wavelengths of light that have been changed by the fluorescent particles.

Abstract: A light emitting diode according to the present invention comprises an element substrate, a light emitting element mounted on said element substrate, a sealing body which emits light from the light emitting element and which seals said light emitting element, and a light shielding means to form light emitting parts for directing light from the sealing body in two dimensional directions which are formed from a combination of either two axes of three dimensional axes X, Y and Z. The light shielding means causes one portion of the light emitting parts to light emit and the other of the light emitting parts to light shield.

Abstract: A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the individual transparent layer. The groove is filled with a reflector material to form a reflector layer. The reflector layer and the substrate are cut so as to form a reflector film on the outside wall of the individual transparent layer, thereby forming a plurality of LED devices.

Abstract: A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the individual transparent layer. The groove is filled with a reflector material to form a reflector layer. The reflector layer and the substrate are cut so as to form a reflector film on the outside wall of the individual transparent layer, thereby forming a plurality of LED devices.

Abstract: An elastic connector integrated with an electrode on at least either a chip-type LED or a circuit board facing each other is sandwiched and compressed by the chip-type LED and the circuit board so as to provide an electric connection. The thus obtained integrated connector is thin and cost-effective while able to provide a secure conductivity between the electrode of the printed circuit board and the chip-type LED in a simple connection method, and a LED including the integrated connector also is provided.

Abstract: An LED is mounted on a substrate, and a protector made of a transparent material is provided for sealing the LED. A color correcting filter is formed on the protector. The color correcting filter has an effect of changing chromaticity of emitted light of the LED to desired chromaticity of illuminating light to be discharged from the LED device.

Abstract: A light emitting element is disclosed. When the light emitting diode is used as a backlight source for a liquid crystal display, the distance from the light emitting element 25 to the light receiving surface of the light guide plate 11 is reduced to increase the light spreading angle &thgr;2 of the light introduced from the light emitting element 25 into the light guide plate 11 and also increase the amount of light entering the light guide plate 11, thus enhancing the level of brightness of the liquid crystal display. The light emitting diode comprises: a mother board 8 having an opening 9; a pair of electrodes 23, 24 arranged on one surface of the mother board 8; a light guide plate 11 arranged on the other surface of the mother board 8; a light emitting element 25 arranged in the opening 9 of the mother board 8 and mounted to one of the pair of electrodes 23, 24; and a positioning means 30 mounted on the one electrode to position the light emitting element 25close to the light guide plate 11.

Abstract: A plurality of LEDs are mounted on a substrate aggregation, a transparent layer is formed on the substrate aggregation. The transparent layer between adjacent divisions is removed to form an individual transparent layer and to form a groove around the individual transparent layer. The groove is filled with a reflector material to form a reflector layer. The reflector layer and the substrate are cut so as to form a reflector film on the outside wall of the individual transparent layer, thereby forming a plurality of LED devices.