Patents by Inventor Koichi Fukaya
Koichi Fukaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7988537Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.Type: GrantFiled: March 5, 2008Date of Patent: August 2, 2011Assignee: Ebara CorporationInventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Patent number: 7867063Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.Type: GrantFiled: May 15, 2009Date of Patent: January 11, 2011Assignee: Ebara CorporationInventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Patent number: 7854646Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).Type: GrantFiled: January 15, 2010Date of Patent: December 21, 2010Assignee: Ebara CorporationInventors: Tetsuji Togawa, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
-
Publication number: 20100154837Abstract: A liquid-scattering prevention cup, provided in a substrate processing apparatus, is capable of attaching a hydrophilic member, such as a PVA sponge, to an inner surface of a liquid-scattering prevention cup body easily and efficiently. The liquid-scattering prevention cup includes a liquid-scattering prevention cup body, and a liquid-scattering prevention sheet having a surface hydrophilic material layer, attached to an entire area or a predetermined area of the inner surface of the liquid-scattering prevention cup body. The liquid-scattering prevention sheet has been attached to the liquid-scattering prevention cup body by an attachment such that the hydrophilic material layer is exposed.Type: ApplicationFiled: December 18, 2009Publication date: June 24, 2010Inventors: Takahiro Ogawa, Naoki Matsuda, Koichi Fukaya, Hiroyuki Kaneko
-
Publication number: 20100112901Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).Type: ApplicationFiled: January 15, 2010Publication date: May 6, 2010Inventors: Tetsuji TOGAWA, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
-
Patent number: 7670206Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).Type: GrantFiled: June 17, 2004Date of Patent: March 2, 2010Assignee: Ebara CorporationInventors: Tetsuji Togawa, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
-
Patent number: 7638030Abstract: An electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member including an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member includes an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.Type: GrantFiled: September 25, 2003Date of Patent: December 29, 2009Assignee: Ebara CorporationInventors: Osamu Nabeya, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Takeshi Iizumi, Nobuyuki Takada, Koichi Fukaya, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita
-
Patent number: 7635292Abstract: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.Type: GrantFiled: December 6, 2005Date of Patent: December 22, 2009Assignee: Ebara CorporationInventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Publication number: 20090233532Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.Type: ApplicationFiled: May 15, 2009Publication date: September 17, 2009Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Publication number: 20080166957Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.Type: ApplicationFiled: March 5, 2008Publication date: July 10, 2008Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Publication number: 20080139087Abstract: The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).Type: ApplicationFiled: June 17, 2004Publication date: June 12, 2008Applicant: EBARA CORPORATIONInventors: Tetsuji Togawa, Koichi Fukaya, Mitsuo Tada, Taro Takahashi, Yasunari Suto
-
Patent number: 7357699Abstract: A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.Type: GrantFiled: February 4, 2004Date of Patent: April 15, 2008Assignee: Ebara CorporationInventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Publication number: 20070293129Abstract: A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.Type: ApplicationFiled: December 6, 2005Publication date: December 20, 2007Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Patent number: 7108592Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.Type: GrantFiled: June 24, 2004Date of Patent: September 19, 2006Assignee: Ebara CorporationInventors: Koichi Fukaya, Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima
-
Publication number: 20060199479Abstract: The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.Type: ApplicationFiled: February 4, 2004Publication date: September 7, 2006Inventors: Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima, Koichi Fukaya
-
Publication number: 20050028931Abstract: The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.Type: ApplicationFiled: June 24, 2004Publication date: February 10, 2005Inventors: Koichi Fukaya, Tetsuji Togawa, Hiroshi Yoshida, Osamu Nabeya, Makoto Fukushima
-
Publication number: 20040129569Abstract: The present invention provides an electrolytic processing apparatus which, while eliminating a CMP processing entirely or reducing a load on a CMP processing to the least possible extent, can process and flatten a conductive material formed in the surface of a substrate, or can remove (clean) extraneous matter adhering to the surface of a workpiece such as a substrate. The present invention includes an electrode section including a plurality of electrode members disposed in parallel, each electrode member comprising an electrode and an ion exchanger covering the surface of the electrode, a holder for holding a workpiece, which is capable of bringing the workpiece close to or into contact with the ion exchanger of the electrode member, and a power source to be connected to the electrode of each electrode member of the electrode section. The ion exchanger of the electrode member comprises an ion exchanger having an excellent surface smoothness and an ion exchanger having a large ion exchange capacity.Type: ApplicationFiled: September 25, 2003Publication date: July 8, 2004Inventors: Osamu Nabeya, Masayuki Kumekawa, Hozumi Yasuda, Itsuki Kobata, Takeshi Ilzumi, Nobuyuki Takada, Koichi Fukaya, Mitsuhiko Shirakashi, Takayuki Saito, Yasushi Toma, Tsukuru Suzuki, Kaoru Yamada, Yuji Makita
-
Patent number: 4364169Abstract: An iron core for a rotary electric machine suitable for use as stator iron cores of AC generators for vehicles, for example, winding an iron core blank of strip form and joining convolutions of the spirally wound iron core blank together by electric resistance winding. The spirally wound iron core blank has a plurality of circumferentially spaced apart projections on one surface and a plurality of circumferentially spaced apart recesses on the other surface in positions corresponding to the projections on the one surface. The projections and recesses coincide in position when the iron core blank is spirally wound and convolutions thereof are superposed one above another. The provision of the projections and recesses enables winding of the iron core blank into a spiral form and welding of the convolutions of the spirally wound iron core blank to be effected economically and with increased accuracy.Type: GrantFiled: April 2, 1981Date of Patent: December 21, 1982Assignee: Nippondenso Co., Ltd.Inventors: Kenzi Kawano, Koichi Fukaya, Keizou Jyoko