Abstract: In one example, an electronic device comprises a substrate structure, comprising a base comprising a top side and a bottom side, a first lead, and a flag comprising a top side, a bottom side, and a flag lead. The electronic device also comprises an electronic component comprising a top side and a bottom side, a first electrode at the bottom side of the electronic component, and second electrode at the top side of the electronic component, an encapsulant contacting a lateral side of the electronic component and a lateral side of the base, and a first interconnect in the encapsulant, coupled between the first electrode and the first lead. The second electrode is coupled with the flag lead via the base. Other examples and related methods are also disclosed herein.

Abstract: There is provided a cyclic peptide having an amino acid sequence represented Formula (1). In the formula, Xa and Xb, and Xc and Xd each independently represent amino acid residues crosslinked through a thioether bond; X1 to X5 each independently represent an amino acid residue; R represents an arginine residue; G represents a glycine residue; D represents an aspartic acid residue; and m1 to m5 each independently represent an integer of 0 or more. However, the total number of amino acid residues represented by Xa, Xb, Xc, and Xd and represented by X1, X3, and X4 is 7 to 16.

Abstract: There is provided a cyclic peptide containing a cyclic segment containing an RGD sequence and having 8 to 14 amino acid residues. A thioether bond is formed between an amino acid residue Xa located on a most N-terminal side of the cyclic segment and an amino acid residue Xb located on a most C-terminal side of the cyclic segment. However, in a case where one of the amino acid residue Xa and the amino acid residue Xb is a cysteine residue, an ? carbon of the other amino acid residue of the amino acid residue Xa and the amino acid residue Xb is separated from a sulfur atom of the cysteine residue by five or more atoms.

Abstract: A cyclic peptide is represented by Formula (I), RN—Xg—[Xi—Xa—Xm—X1—X2—X3—Xn—Xb—Xj]k—Xh—RC??(I) in Formula (I), RN represents an N-terminal group; RC represents a C-terminal group; X1 represents an L-leucine residue, an L-isoleucine residue, an L-methionine residue, an L-lysine residue, or an L-arginine residue; X2 represents an L-valine residue or an L-isoleucine residue; X3 represents an L-tryptophan residue or an L-phenylalanine residue; one of Xa and Xb represents an amino acid residue derived from an amino acid having an azide group on a side chain and the other represents an amino acid residue derived from an amino acid having an alkynyl group on a side chain, and Xg, Xh, Xi, Xj, Xm, and Xn each represent g consecutive X's, h consecutive X's, i consecutive X's, j consecutive X's, m consecutive X's, and n consecutive X's; X represents an amino acid residue.

Abstract: Provided is a method for producing a short-chain peptide-immobilized carrier that maintains a secondary structure of a short-chain peptide, the method including a step of preparing an alcohol solution containing an alcohol solvent, and a short-chain peptide having a plurality of immobilizing functional groups, the short-chain peptide having a secondary structure induced in the alcohol solvent; and a step of bringing a carrier coupled with a spacer having a reactive group that reacts with the immobilizing functional group, into contact with the alcohol solution, and thereby immobilizing the short-chain peptide to the spacer.

Abstract: Provided is a cyclic peptide, which is represented by Formula (I) or Formula (I?) and has excellent antibody binding properties and improved chemical resistance, an affinity chromatography support, a labeled antibody, an antibody drug conjugate, and a pharmaceutical preparation. RN-Xg-[Xi-Xa-Xm-X1-X2-X3-Xn-Xb-Xj]k-Xh-RC??(I) In Formula (I), Xa and Xb each independently represent an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and are bonded to each other through a disulfide bond, or, one of Xa and Xb represents an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and the other represents an amino acid residue derived from an amino acid having a haloacetyl group on a side chain, and Xa and Xb are bonded to each other through a thioether bond.

Abstract: Provided is a cyclic peptide, which is represented by Formula (I) or Formula (I?) and has excellent antibody binding properties and improved chemical resistance, an affinity chromatography support, a labeled antibody, an antibody drug conjugate, and a pharmaceutical preparation. RN-Xg-[Xi-Xa-Xm-X1-X2-X3-Xn-Xb-Xj]k-Xh-RC??(I) In Formula (I), Xa and Xb each independently represent an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and are bonded to each other through a disulfide bond, or, one of Xa and Xb represents an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and the other represents an amino acid residue derived from an amino acid having a haloacetyl group on a side chain, and Xa and Xb are bonded to each other through a thioether bond.

Abstract: Provided are an antibody-binding polypeptide as set forth in any one of SEQ ID NOS: 1 to 18 and an adsorption material of an antibody or antibody derivative in which the antibody-binding polypeptide is immobilized on a water-insoluble carrier. These antibody-binding polypeptide and adsorption material have excellent antibody binding properties and selectivity, and also excellent alkali resistance and temporal stability.

Abstract: A cyclic peptide is represented by Formula (I), RN—Xg—[Xi—Xa—Xm—X1—X2—X3—Xn—Xb—Xj]k—Xh—RC??(I) in Formula (I), RN represents an N-terminal group; RC represents a C-terminal group; X1 represents an L-leucine residue, an L-isoleucine residue, an L-methionine residue, an L-lysine residue, or an L-arginine residue; X2 represents an L-valine residue or an L-isoleucine residue; X3 represents an L-tryptophan residue or an L-phenylalanine residue; one of Xa and Xb represents an amino acid residue derived from an amino acid having an azide group on a side chain and the other represents an amino acid residue derived from an amino acid having an alkynyl group on a side chain, and Xg, Xh, Xi, Xj, Xm, and Xn each represent g consecutive X's, h consecutive X's, i consecutive X's, j consecutive X's, m consecutive X's, and n consecutive X's; X represents an amino acid residue.

Abstract: According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of pillar portions, and an interconnection portion. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode layers stacked separately from each other. The plurality of pillar portions are provided in the stacked body. The plurality of pillar portions extend in a stacking direction of the stacked body. The interconnection portion is provided in the stacked body. The interconnection portion extends in a first direction. The neighboring pillar portions are not arranged along the first direction.

Abstract: Provided is a cyclic peptide, which is represented by Formula (I) or Formula (I?) and has excellent antibody binding properties and improved chemical resistance, an affinity chromatography support, a labeled antibody, an antibody drug conjugate, and a pharmaceutical preparation. RN-Xg-[Xi-Xa-Xm-X2-X3-Xn-Xb-Xj]k-Xh-RC??(I) In Formula (I), Xa and Xb each independently represent an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and are bonded to each other through a disulfide bond, or, one of Xa and Xb represents an amino acid residue derived from an amino acid, other than L-cysteine and D-cysteine, having a thiol group on a side chain and the other represents an amino acid residue derived from an amino acid having a haloacetyl group on a side chain, and Xa and Xb are bonded to each other through a thioether bond.

Abstract: According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of pillar portions, and an interconnection portion. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode layers stacked separately from each other. The plurality of pillar portions are provided in the stacked body. The plurality of pillar portions extend in a stacking direction of the stacked body. The interconnection portion is provided in the stacked body. The interconnection portion extends in a first direction. The neighboring pillar portions are not arranged along the first direction.

Abstract: Provided is a method for producing a short-chain peptide-immobilized carrier that maintains a secondary structure of a short-chain peptide, the method including a step of preparing an alcohol solution containing an alcohol solvent, and a short-chain peptide having a plurality of immobilizing functional groups, the short-chain peptide having a secondary structure induced in the alcohol solvent; and a step of bringing a carrier coupled with a spacer having a reactive group that reacts with the immobilizing functional group, into contact with the alcohol solution, and thereby immobilizing the short-chain peptide to the spacer.

Abstract: According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of pillar portions, and an interconnection portion. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode layers stacked separately from each other. The plurality of pillar portions are provided in the stacked body. The plurality of pillar portions extend in a stacking direction of the stacked body. The interconnection portion is provided in the stacked body. The interconnection portion extends in a first direction. The neighboring pillar portions are not arranged along the first direction.

Abstract: Provided are an antibody-binding polypeptide as set forth in any one of SEQ ID NOS: 1 to 18 and an adsorption material of an antibody or antibody derivative in which the antibody-binding polypeptide is immobilized on a water-insoluble carrier. These antibody-binding polypeptide and adsorption material have excellent antibody binding properties and selectivity, and also excellent alkali resistance and temporal stability.

Abstract: According to one embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of pillar portions, and an interconnection portion. The stacked body is provided on the substrate. The stacked body includes a plurality of electrode layers stacked separately from each other. The plurality of pillar portions are provided in the stacked body. The plurality of pillar portions extend in a stacking direction of the stacked body. The interconnection portion is provided in the stacked body. The interconnection portion extends in a first direction. The neighboring pillar portions are not arranged along the first direction.

Abstract: An antibody-fragment-immobilizing substrate includes a substrate and at least one set of antibody fragments, wherein the antibody fragments of each set includes at least two types of separate antibody fragments that are capable of recognizing one type of antigen and that are independently immobilized on the substrate in a positional relationship that allows each of the antibody fragments in one set to bind to the same antigen.

Abstract: The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween.

Abstract: The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween.

Abstract: A carrier comprises a base plate, a polymeric film, which has been bound on a surface of the base plate, and a ligand, which has been bound with the polymeric film. The ligand has been bound with the polymeric film at a density falling within the range of 1.0×1016 pieces/mm3 to 3.3×1018 pieces/mm3. The carrier is produced with a process, comprising the steps of: causing the polymeric film to bind on the base plate, and causing the ligand to bind with the polymeric film, the step of causing the ligand to bind with the polymeric film being performed in an organic solvent.