Patents by Inventor Koichi Nishijima

Koichi Nishijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898065
    Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: February 13, 2024
    Assignee: DOW-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Hiroaki Machiya, Hisao Gonohe, Yoshitaka Hironaka
  • Publication number: 20220089847
    Abstract: The present invention provides a resin composition which includes: carbon nanotubes (A); and a resin (B) which is at least one selected from the group consisting of: an ionomer of an ethylene-unsaturated carboxylic acid copolymer (B1); and an ethylene-unsaturated carboxylic acid copolymer (B2).
    Type: Application
    Filed: January 20, 2020
    Publication date: March 24, 2022
    Inventors: Koichi NISHIJIMA, Hisao GONOHE, Masataka AOYAMA
  • Publication number: 20210403770
    Abstract: A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane. A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.
    Type: Application
    Filed: November 19, 2019
    Publication date: December 30, 2021
    Inventors: Koichi NISHIJIMA, Hiroaki MACHIYA, Hisao GONOHE, Yoshitaka HIRONAKA
  • Publication number: 20210024732
    Abstract: A composition for a skin pack is provided, which includes: an ionomer (A) of an ethylene/unsaturated carboxylic acid copolymer having a melt flow rate (JIS K 7210-1999, 190° C. 2160 g load) of 6 g/10 min or more; and a polyolefin (B) having a melt flow rate (JIS K 7210-1999, 190° C., 2160 g load) of 6 g/10 min or less, in which a content of the polyolefin (B) is from 20% by mass to 50% by mass with respect to 100% by mass of resin components in the composition for a skin pack.
    Type: Application
    Filed: March 19, 2019
    Publication date: January 28, 2021
    Inventors: Koichi NISHIJIMA, Yoshitaka HIRONAKA, Hiroaki MACHIYA, Hisao GONOHE
  • Publication number: 20150333206
    Abstract: A multilayer sheet including an (A) layer containing an ethylene type zinc ionomer as a main component and a silane coupling agent, and a (B) layer containing a polyethylene-based copolymer with a melting point of 90° C. or higher as a main component and a silane coupling agent having a content ratio with respect to the resin material that is lower than a content ratio of the silane coupling agent with respect to resin material in the (A) layer, wherein the total thickness of the (A) layer and the (B) layer is from 0.1 to 2 mm. Such multilayer sheet may be superior in adhesive strength, durability and heat resistance, and obtained at a suppressed cost.
    Type: Application
    Filed: July 1, 2015
    Publication date: November 19, 2015
    Inventor: Koichi Nishijima
  • Patent number: 8791208
    Abstract: Provided is a sheet for a solar cell encapsulant containing (A) an ethylene-based polymer having a melting point of 90° C. or higher and containing an ethylene-derived constituent unit as a main component; (B) an ethylene-vinyl acetate copolymer having a vinyl acetate-derived constituent unit at a content ratio of from 19% to 40% by mass; and (C) a silane coupling agent having an amino group. The sheet for solar cell encapsulant has the excellent transparency and flexibility possessed by an ethylene-vinyl acetate copolymer. Furthermore, a crosslinking treatment is substantially unnecessary, and adhesiveness and adhesion stability that are appropriate for practical use are obtained.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: July 29, 2014
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Yasuki Shibata, Koji Kawano
  • Patent number: 8569437
    Abstract: A solar cell encapsulated with an encapsulating material which is a non-crystalline or low-crystalline ?-olefin-based copolymer or its composition (I). The composition (C) can contain 50 to 100 parts by weight of non-crystalline ?-olefin polymer (A) which meets the following requirements: (a) the ?-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline ?-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight). The non-crystalline or low-crystalline ?-olefin copolymer may also have a crystallinity of not higher than 40% as measured by use of X rays.
    Type: Grant
    Filed: January 2, 2013
    Date of Patent: October 29, 2013
    Assignees: Du Pont-Mitsui Polychemicals, Co., Ltd., Mitsui Chemicals Tohcello, Inc.
    Inventors: Koichi Nishijima, Akira Yamashita
  • Patent number: 8513357
    Abstract: An ethylene copolymer composition which includes a zinc ionomer containing, as a main component, a copolymer having a constituent unit derived from ethylene and a constituent unit derived from (meth)acrylic acid, and a dialkoxysilane having an amino group, is provided. This makes it possible to increase the stability during sheet production. It is preferable that the content ratio of the dialkoxysilane is 15 parts by mass or less based on 100 parts by mass of the zinc ionomer.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: August 20, 2013
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventor: Koichi Nishijima
  • Patent number: 8426544
    Abstract: A solar cell encapsulated with an encapsulating material which is a non-crystalline or low-crystalline ?-olefin-based copolymer or its composition (I). The composition (C) can contain 50 to 100 parts by weight of non-crystalline ?-olefin polymer (A) which meets the following requirements: (a) the ?-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline ?-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight). The non-crystalline or low-crystalline ?-olefin copolymer may also have a crystallinity of not higher than 40% as measured by use of X rays.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: April 23, 2013
    Assignees: Du-Pont Mitsui Polychemicals, Co., Ltd., Mitsui Chemicals Tohcello, Inc.
    Inventors: Koichi Nishijima, Akira Yamashita
  • Publication number: 20130056049
    Abstract: The present invention provides a multilayer material which has a layer (A) that contains a silane coupling agent and an ethylene type zinc ionomer, and a layer (B) that contains at least one of an ethylene type magnesium ionomer or an ethylene type sodium ionomer. The multilayer material is suitable for use as an encapsulant for a solar cell or an interlayer for safety (laminated) glass. It is preferable that the multilayer material contains at least two of the layer (A) and at least one of the layer (B) and has a multilayered structure in which the layer (B) is interposed between the two of the layer (A).
    Type: Application
    Filed: May 12, 2011
    Publication date: March 7, 2013
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Kazuyuki Nakata, Koichi Nishijima, Yasuki Shibata, Yoshitaka Hironaka
  • Patent number: 8350147
    Abstract: The present invention provides a process for producing an encapsulating material for solar cell which makes high-speed crosslinking possible and causes no blister phenomenon without significant restrictions being imposed on the conditions for molding the encapsulating material. The present invention provides a process for producing the encapsulating material for solar cell including impregnating a molded form of an ethylene copolymer with an organic peroxide in a liquid state at normal temperature which shows a decomposition temperature (a temperature at which the half-life period is one hour) of not higher than 150° C. A process for producing the encapsulating material for solar cell in which dialkyl peroxide (A) and an organic peroxide (B) selected from peroxycarbonate and peroxyketal at a ratio by weight of 10/90 to 90/10 of (A) and (B) in a liquid state impregnate the molded form of the ethylene copolymer is a preferable embodiment of the present invention.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: January 8, 2013
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Manabu Kawamoto, Rie Sato, Tetsuya Nakamura
  • Publication number: 20120199193
    Abstract: Provided is an amorphous silicon solar cell module including a solar cell encapsulant containing a metal deactivator and silane-modified polyethylene, and a metal material adjacent to the solar cell encapsulant and having at least one selected from copper, a lead-free solder alloy and a silver film.
    Type: Application
    Filed: November 10, 2010
    Publication date: August 9, 2012
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Norihiko Sato
  • Publication number: 20110319566
    Abstract: Provided is a sheet for a solar cell encapsulant containing (A) an ethylene-based polymer having a melting point of 90° C. or higher and containing an ethylene-derived constituent unit as a main component; (B) an ethylene-vinyl acetate copolymer having a vinyl acetate-derived constituent unit at a content ratio of from 19% to 40% by mass; and (C) a silane coupling agent having an amino group. The sheet for solar cell encapsulant has the excellent transparency and flexibility possessed by an ethylene-vinyl acetate copolymer. Furthermore, a crosslinking treatment is substantially unnecessary, and adhesiveness and adhesion stability that are appropriate for practical use are obtained.
    Type: Application
    Filed: February 15, 2010
    Publication date: December 29, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Yasuki Shibata, Koji Kawano
  • Publication number: 20110272026
    Abstract: A multilayer sheet including an (A) layer containing an ethylene type zinc ionomer as a main component and a silane coupling agent, and a (B) layer containing a polyethylene-based copolymer with a melting point of 90° C. or higher as a main component and a silane coupling agent having a content ratio with respect to the resin material that is lower than a content ratio of the silane coupling agent with respect to resin material in the (A) layer, wherein the total thickness of the (A) layer and the (B) layer is from 0.1 to 2 mm. Such multilayer sheet may be superior in adhesive strength, durability and heat resistance, and obtained at a suppressed cost.
    Type: Application
    Filed: October 29, 2009
    Publication date: November 10, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventor: Koichi Nishijima
  • Patent number: 8053086
    Abstract: An encapsulating material for solar cell containing a laminated adhesive and heat resistant layer (A) and a buffering layer (B), wherein a difference in flexural modulus between the heat resistant layer (A) and the buffering layer (B) is at least 30 MPa or more, is provided. The adhesive and heat resistant layer (A) is preferably an olefin polymer (a) having a melting point (according to JIS K7121) of 75° C. or higher and having a storage elastic modulus at 150° C. of 103 Pa or more and the buffering layer (B) is preferably an olefin polymer (d) having a stiffness of 100 MPa or less. The encapsulating material for solar cell can provide superior transparency, flexibility, heat resistance and adhesiveness and can remarkably improve production efficiency of a solar cell module even when no organic peroxide is used. The encapsulating material can also exhibit a performance capable of corresponding to the thickness reduction of the solar cell element even when an organic peroxide is used.
    Type: Grant
    Filed: March 8, 2006
    Date of Patent: November 8, 2011
    Assignee: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Kenji Miharu
  • Publication number: 20110108094
    Abstract: Provided is a laminated sheet for solar cell having a back sheet base material including a fluoro-resin or a polyester resin, and a sealing material layer which includes an ethylene copolymer composition containing a copolymer of an ethylene and a polar monomer which has a polar group selected from a group consist of a carboxylic acid group and a group derived from a carboxylate and a dialkoxysilane having an amino group is laminated on a surface of the back sheet base material where a chemical treatment or a physical treatment for improving adhesiveness has been applied, by a melt extrusion lamination method. Thereby, a laminated sheet having excellent productivity and excellent interlayer adhesion strength between the back sheet and the sealing material is obtained.
    Type: Application
    Filed: June 26, 2009
    Publication date: May 12, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventors: Koichi Nishijima, Yasuki Shibata, Masanobu Sato
  • Publication number: 20110105681
    Abstract: An ethylene copolymer composition which includes a zinc ionomer containing, as a main component, a copolymer having a constituent unit derived from ethylene and a constituent unit derived from (meth)acrylic acid, and a dialkoxysilane having an amino group, is provided. This makes it possible to increase the stability during sheet production. It is preferable that the content ratio of the dialkoxysilane is 15 parts by mass or less based on 100 parts by mass of the zinc ionomer.
    Type: Application
    Filed: June 16, 2009
    Publication date: May 5, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventor: Koichi Nishijima
  • Publication number: 20110061735
    Abstract: The present invention provides a crosslinkable ethylene copolymer composition which is superior in transparency, heat resistance, adhesive property, flexibility, moldability, durability, and the like, as well as in insulating property, and which shows less decrease in adhesive property with time and can maintain the adhesive property for a long period, and a crosslinkable sheet composed of said composition, and an encapsulating sheet for solar cell and a solar cell module. More in detail, the present invention relates to a crosslinkable ethylene copolymer composition comprising a dialkoxysilane having a double bond in a ratio of 3 parts by weight or less to 100 parts by weight of ethylene copolymer, and a crosslinked sheet of said composition, and further to an encapsulating sheet for solar cell composed of said composition and a solar cell module using the sheet.
    Type: Application
    Filed: May 12, 2008
    Publication date: March 17, 2011
    Applicant: DU PONT-MITSUI POLYCHEMICALS CO., LTD.
    Inventor: Koichi Nishijima
  • Publication number: 20100313956
    Abstract: A solar cell encapsulated with an encapsulating material which is a non-crystalline or low-crystalline ?-olefin-based copolymer or its composition (I). The composition (C) can contain 50 to 100 parts by weight of non-crystalline ?-olefin polymer (A) which meets the following requirements: (a) the ?-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline ?-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight). The non-crystalline or low-crystalline ?-olefin copolymer may also have a crystallinity of not higher than 40% as measured by use of X rays.
    Type: Application
    Filed: August 23, 2010
    Publication date: December 16, 2010
    Applicants: Du Pont-Mitsui Polychemicals Co., Ltd., Mitsui Chemicals Fabro, Inc.
    Inventors: Koichi NISHIJIMA, Akira Yamashita
  • Publication number: 20100229944
    Abstract: The present invention provides an encapsulating material for a solar cell, which is easy to prepare a solar cell module, and excellent in processability, insulating property, non-corrosion property, transparency, heat resistance, flexibility and the like, and a solar cell module prepared by using the same. The encapsulating material for a solar cell is one consisting of a cross-linkable resin composition (A) containing an ethylene-(meth)acrylic ester copolymer as a base polymer, an organic peroxide and a crosslinking aid wherein the decomposition temperature (temperature for a half-life period of one hour) of the organic peroxide is equal to or lower than 150° C., and total compounding amount of the organic peroxide and the crosslinking aid, is in a range of from 0.5 to 5 parts by weight per 100 parts by weight of the base polymer, and compounding ratio of the organic peroxide and the crosslinking aid (organic peroxide/crosslinking aid) is in a range of from 1/5 to 1/0.1, in weight ratio.
    Type: Application
    Filed: February 16, 2007
    Publication date: September 16, 2010
    Applicant: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Yasuhisa Hosoai, Youichi Shinya