Patents by Inventor Koichi Nishijima

Koichi Nishijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100229944
    Abstract: The present invention provides an encapsulating material for a solar cell, which is easy to prepare a solar cell module, and excellent in processability, insulating property, non-corrosion property, transparency, heat resistance, flexibility and the like, and a solar cell module prepared by using the same. The encapsulating material for a solar cell is one consisting of a cross-linkable resin composition (A) containing an ethylene-(meth)acrylic ester copolymer as a base polymer, an organic peroxide and a crosslinking aid wherein the decomposition temperature (temperature for a half-life period of one hour) of the organic peroxide is equal to or lower than 150° C., and total compounding amount of the organic peroxide and the crosslinking aid, is in a range of from 0.5 to 5 parts by weight per 100 parts by weight of the base polymer, and compounding ratio of the organic peroxide and the crosslinking aid (organic peroxide/crosslinking aid) is in a range of from 1/5 to 1/0.1, in weight ratio.
    Type: Application
    Filed: February 16, 2007
    Publication date: September 16, 2010
    Applicant: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Yasuhisa Hosoai, Youichi Shinya
  • Publication number: 20090120489
    Abstract: An encapsulating material for solar cell containing a laminated adhesive and heat resistant layer (A) and a buffering layer (B), wherein a difference in flexural modulus between the heat resistant layer (A) and the buffering layer (B) is at least 30 MPa or more, is provided. The adhesive and heat resistant layer (A) is preferably an olefin polymer (a) having a melting point (according to JIS K7121) of 75° C. or higher and having a storage elastic modulus at 150° C. of 103 Pa or more and the buffering layer (B) is preferably an olefin polymer (d) having a stiffness of 100 MPa or less. The encapsulating material for solar cell can provide superior transparency, flexibility, heat resistance and adhesiveness and can remarkably improve production efficiency of a solar cell module even when no organic peroxide is used. The encapsulating material can also exhibit a performance capable of corresponding to the thickness reduction of the solar cell element even when an organic peroxide is used.
    Type: Application
    Filed: March 8, 2006
    Publication date: May 14, 2009
    Applicant: Du Pont-Mitsui Polychemicals Co., Ltd.
    Inventors: Koichi Nishijima, Kenji Miharu
  • Publication number: 20090023867
    Abstract: The present invention provides a process for producing an encapsulating material for solar cell which makes high-speed crosslinking possible and causes no blister phenomenon without significant restrictions being imposed on the conditions for molding the encapsulating material. The present invention provides a process for producing the encapsulating material for solar cell including impregnating a molded form of an ethylene copolymer with an organic peroxide in a liquid state at normal temperature which shows a decomposition temperature (a temperature at which the half-life period is one hour) of not higher than 150° C. A process for producing the encapsulating material for solar cell in which dialkyl peroxide (A) and an organic peroxide (B) selected from peroxycarbonate and peroxyketal at a ratio by weight of 10/90 to 90/10 of (A) and (B) in a liquid state impregnate the molded form of the ethylene copolymer is a preferable embodiment of the present invention.
    Type: Application
    Filed: February 10, 2006
    Publication date: January 22, 2009
    Inventors: Koichi Nishijima, Manabu Kawamoto, Rie Sato, Tetsuya Nakamura
  • Publication number: 20080169023
    Abstract: An encapsulation material for a solar cell element containing an ethylene-polar monomer copolymer having polar monomer unit content of 10-40 wt % and melting point of not lower than 75° C. and HAZE of not more than 10% and meeting the condition of ?3.0X+125?T??3.0X+109, wherein T is melting (° C.) and X is polar monomer unit content (mol %). The encapsulation material for a solar cell element does not require the use of any organic peroxide, consequently bringing about an improvement in the efficiency in the production of solar cell modules. The encapsulation material can also exhibit excellent transparency, heat resistance and flexibility as will make a reduction in the thickness of solar cell elements adequately possible. A solar cell module using the encapsulation material is also provided.
    Type: Application
    Filed: March 8, 2006
    Publication date: July 17, 2008
    Applicants: Du Pont-Mitsui Polychemicals Co., Ltd., E.I.Du Pont de Nemours & Company
    Inventors: Koichi Nishijima, Bernard Rioux
  • Publication number: 20070267059
    Abstract: Encapsulating material for solar cells which facilitates fabricating solar cell modules and has excellent transparency, heat resistance, flexibility, etc., and a solar cell modules. More specifically, the present invention provides encapsulating material for solar cells comprising a non-crystalline or low-crystalline a-olefin-based copolymer or its composition (I). In a preferred embodiment, the aforementioned copolymer or its composition (I) is a resin composition (C) containing 50 to 100 parts by weight of non-crystalline ?-olefin polymer (A) meeting the following requirements: (a) the ?-olefin having 3 to 20 carbon atoms is not less than 20 mol %, (b) practically no melt peak as measured by a differential scanning calorimeter is observed, and (c) the Mw/Mn is not more than 5, and 50 to 0 parts by weight of crystalline ?-olefin polymer (B) (the total of (A) and (B) being 100 parts by weight).
    Type: Application
    Filed: December 27, 2005
    Publication date: November 22, 2007
    Applicants: DuPont-Mitsui Polychemicals Co., Ltd., Mitsui Chemicals Fabro, Inc.
    Inventors: Koichi Nishijima, Akira Yamashita