Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.

Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.

Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.

Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 ?m or more and 100 ?m or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.

Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiO2 particles containing SiO2 as a main component. An average particle diameter of the SiO2 particles is less than 20.0 ?m, and a mass fraction of the SiO2 particles in a total mass of the metal body and the SiO2 particles is 1.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.

Abstract: The present invention provides: a method having a high effect on the efficiently controlling diseases in small grain cereals, in particular, powdery mildew, leaf rust, leaf blotch, and eyespot disease; a method for suppressing lodging damage in small grain cereals; and seed of small grain cereals. A method for controlling diseases in small grain cereals, a method for suppressing lodging damage in small grain cereals, and seed of small grain cereals, in which seed of small grain cereals is treated with one or more types selected from a dichloroisothiazole compound or a salt thereof, are provided.

Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.

Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.

Abstract: Provided herein is a non plant-pathogenic strain that can stably exhibit a bacterial plant disease control effect at the actual site of crop production, and that can be safely used as a biopesticide against plant. A bacterial plant disease control agent using such a strain is also provided, among others. In the present invention, viable bacteria of a strain belonging to genus Mitsuaria, which was not known to have a control effect against bacterial plant disease, or a culture containing the viable bacteria of such a strain are used as an active component, and the invention provides bacterial plant disease control agents such as a vegetable wilt disease control agent, and a canker control agent.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, an insulating unit, a void, a gate insulating film and a gate electrode. The second semiconductor region provides on a part of the first semiconductor region. The third semiconductor region provides on one other part of the first semiconductor region. The insulating unit provides on a part of the second semiconductor region. The void provides at a lower part of the insulating unit. The gate insulating film provides on a part of the first semiconductor region between the second semiconductor region and the third semiconductor region. The gate electrode provides on the gate insulating film. A position in a first direction of at least a part of the void is between the insulating unit and the third semiconductor region.

Abstract: Provided is a pyribencarb aqueous suspension agrochemical composition which contains an adjuvant for reinforcing the efficacy of pyribencarb, and which is capable of preventing a pharmaceutical preparation from becoming highly viscous or solidified and capable of providing a sufficient controlling effect with a small amount of pyribencarb. The aqueous suspension agrochemical composition includes: pyribencarb which is an agrochemically active component; an adjuvant for pyribencarb, which is one or more compounds selected from polyoxyalkylene siloxanes, polyoxyethylene/polyoxypropylene block copolymers, and polyoxyalkylene alkyl ethers; a nonionic-anionic surfactant which is a polyoxyalkylene aryl ether sulfuric acid salt and/or a polyoxyalkylene aryl ether phosphoric acid salt; and water.

Abstract: There are provided a lens member, a method of manufacturing the lens member, a communication module, a lens array, and a light-source module, the lens member including a ready-made glass lens added with a mounting portion having a reference face as a plane for reference when the glass lens is mounted on a substrate. A lens member includes a glass ball lens to which sphericity processing has been previously performed, and a resin mounting portion disposed on the glass ball lens. The mounting portion is molded by flowing the resin in a flowable state into a die including the glass ball lens disposed therein. The mounting portion includes a reference face that abuts on a mounting face in a case where the glass ball lens is surface-mounted, provided thereto.

Abstract: Provided is a pyribencarb aqueous suspension agrochemical composition which contains an adjuvant for reinforcing the efficacy of pyribencarb, and which is capable of preventing a pharmaceutical preparation from becoming highly viscous or solidified and capable of providing a sufficient controlling effect with a small amount of pyribencarb. The aqueous suspension agrochemical composition includes: pyribencarb which is an agrochemically active component; an adjuvant for pyribencarb, which is one or more compounds selected from polyoxyalkylene siloxanes, polyoxyethylene/polyoxypropylene block copolymers, and polyoxyalkylene alkyl ethers; a nonionic-anionic surfactant which is a polyoxyalkylene aryl ether sulfuric acid salt and/or a polyoxyalkylene aryl ether phosphoric acid salt; and water.

Abstract: There are provided a lens member, a method of manufacturing the lens member, a communication module, a lens array, and a light-source module, the lens member including a ready-made glass lens added with a mounting portion having a reference face as a plane for reference when the glass lens is mounted on a substrate. A lens member includes a glass ball lens to which sphericity processing has been previously performed, and a resin mounting portion disposed on the glass ball lens. The mounting portion is molded by flowing the resin in a flowable state into a die including the glass ball lens disposed therein. The mounting portion includes a reference face that abuts on a mounting face in a case where the glass ball lens is surface-mounted, provided thereto.

Abstract: There are provided a lens member, a method of manufacturing the lens member, a communication module, a lens array, and a light-source module, the lens member including a ready-made glass lens added with a mounting portion having a reference face as a plane for reference when the glass lens is mounted on a substrate. A lens member includes a glass ball lens to which sphericity processing has been previously performed, and a resin mounting portion 13 disposed on the glass ball lens. The mounting portion is molded by flowing the resin in a flowable state into a die including the glass ball lens disposed therein. The mounting portion includes a reference face that abuts on a mounting face in a case where the glass ball lens is surface-mounted, provided thereto.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor device includes a first semiconductor region, a second semiconductor region, a third semiconductor region, an insulating unit, a void, a gate insulating film and a gate electrode. The second semiconductor region provides on a part of the first semiconductor region. The third semiconductor region provides on one other part of the first semiconductor region. The insulating unit provides on a part of the second semiconductor region. The void provides at a lower part of the insulating unit. The gate insulating film provides on a part of the first semiconductor region between the second semiconductor region and the third semiconductor region. The gate electrode provides on the gate insulating film. A position in a first direction of at least a part of the void is between the insulating unit and the third semiconductor region.