Patents by Inventor Koichi Ozaki

Koichi Ozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6635818
    Abstract: There is provided a wireless-type power supply method that is applied to the case where an object to which energy is to be transmitted is relatively small, such as a micromachine, and that allows high-voltage electrical energy to be transmitted without using a wire. In this method, the optical energy from an light source is converted into high-voltage electrical energy by means of an energy transducer formed of either a piezoelectric element or a photovoltaic element on the above-described object, and the high-voltage electrical energy is supplied to an actuator, whereby the construction of the receiving side of the energy transmission is simplified.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: October 21, 2003
    Assignee: National Institute of Advanced Industrial Science and Technology
    Inventors: Masaaki Ichiki, Koichi Ozaki, Yasushi Morikawa, Makoto Tanaka
  • Publication number: 20030061883
    Abstract: The present invention provides a method and apparatus mainly for measuring mechanical properties, electrical properties and transducer properties (e.g., electromechanical coupling constant) of piezoelectrics, wherein three measurement specimens of the same material and the same dimension, each having parallel planes, and two insertion plates of the same material and the same dimension, each having known mechanical properties, are stacked alternately, a load is applied to these measurement specimens and insertion plates via the measurement specimens located on both end sides, the displacements in the direction of application of the load are measured before and after application of the load, and an elastic constant of the measurement specimen is determined based on those displacements, and the measurement of the electromechanical coupling constant is applied to the piezoelectrics by using the same apparatus under short-and-open circuit conditions.
    Type: Application
    Filed: August 29, 2002
    Publication date: April 3, 2003
    Applicant: National Inst. of Advanced Ind. Science and Tech.
    Inventors: Masaaki Ichiki, Koichi Ozaki, Tokio Kitahara, Makoto Tanaka
  • Publication number: 20020182622
    Abstract: The present invention enables typing nearly hundreds of thousands of SNP sites using remarkably a small amount of genomic DNA. That is, the method for SNP typing of the present invention comprises the steps of simultaneously amplifying a plurality of nucleotide sequences comprising at least one or more sites of single nucleotide polymorphism (SNP) using genomic DNA and a plurality of primer pairs; and typing for distinguishing nucleotides of SNP sites contained in the plurality of nucleotide sequences amplified by the above amplification step, using the amplified nucleotide sequences.
    Type: Application
    Filed: February 1, 2002
    Publication date: December 5, 2002
    Inventors: Yusuke Nakamura, Toshihiro Tanaka, Yozo Ohnishi, Koichi Ozaki, Ryo Yamada
  • Publication number: 20020027390
    Abstract: There is provided a wireless-type power supply method that is applied to the case where an object to which energy is to be transmitted is relatively small, such as a micromachine, and that allows high-voltage electrical energy to be transmitted without using a wire. In this method, the optical energy from an light source is converted into high-voltage electrical energy by means of an energy transducer formed of either a piezoelectric element or a photovoltaic element on the above-described object, and the high-voltage electrical energy is supplied to an actuator, whereby the construction of the receiving side of the energy transmission is simplified.
    Type: Application
    Filed: August 24, 2001
    Publication date: March 7, 2002
    Applicant: Nat'l Inst. of Advanced Industrial Sci. and Tech.
    Inventors: Masaaki Ichiki, Koichi Ozaki, Yasushi Morikawa, Makoto Tanaka
  • Patent number: 6353033
    Abstract: Method and apparatus for cutting high viscosity liquid material, said apparatus comprising a cylinder divided into upper and lower tanks by a partition with a central discharge opening, a moveable and elevatable liquid supply pipe with a distal end positioned opposite the discharge opening, the liquid supply pipe being mounted so that it can be raised until its distal end contacts the partition around the discharge opening, and then lowered until there is no contact, means for raising and lowering the liquid supply pipe, the upper tank having peripheral injection ports for injecting a low viscosity liquid into the upper tank, means for feeding high viscosity liquid material into the lower tank and flowing it into the upper tank, means for feeding low viscosity liquid into the liquid supply pipe and for feeding low viscosity liquid into the peripheral injection ports, the high viscosity liquid material flowing from the lower tank into the upper tank when the liquid supply pipe is lowered, the high viscosity li
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: March 5, 2002
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Koichi Ozaki, Toru Imaizumi, Koichi Ishida, Toyohiko Yamadera, Mitsuo Hamada
  • Patent number: 6224484
    Abstract: A progressive gaming system comprises a plurality of gaming machines, each of which is constructed to perform a predetermined main game in response to an operation of a player and gives a prize to the player when a winning combination is formed in the main game; and a progressive unit for counting an amount of a progressive bonus based on an amount of a bet in the main game played in each of the gaming machines and controlling a payment of the progressive bonus in association with a result of the main game. Each of the gaming machines or the progressive unit is provided with a judging device for judging whether or not the result of the main game played in each of the gaming machines meets a predetermined bonus chance condition for proceeding to a lottery game.
    Type: Grant
    Filed: May 26, 1998
    Date of Patent: May 1, 2001
    Assignee: Konami Co., Ltd.
    Inventors: Yoichi Okuda, Koichi Ozaki, Takashi Yamaguchi, Keiichi Yoshida, Junichi Sasa
  • Patent number: 6191366
    Abstract: A board for an IC card includes a main body in the shape of a plate. A recess is formed in the main body for receiving and adhering a component therein. The recess includes a bottom wall integrated as one body with the main body, and an adhesion section for adhering the component. A wall of the adhesion section is an uneven surface. Ribs may be provided which extend from an inner side of the recess to contact the component.
    Type: Grant
    Filed: September 25, 1997
    Date of Patent: February 20, 2001
    Assignees: Hitachi Maxell, Ltd., Maxell Seiki, Ltd.
    Inventors: Masayoshi Onishi, Seiji Kegai, Koichi Ozaki, Kaname Tamada, Hiroyoshi Takagi
  • Patent number: 6180236
    Abstract: Novel hollow silicone resin particles, having an average particle size of 0.1 to 100 &mgr;m are disclosed. The silicone resin particles comprise a skin formed from thermoplastic silicone resin configured in the shape of a hollow capsule. The hollow thermoplastic silicone resin particles are prepared by spraying a dispersion of water and thermoplastic silicone resin dissolved in solvent into hot gas. The hot gas evaporates the solvent and water and at the same time causes solidification of the thermoplastic silicone resin while it is in the spray state, so as to form a plurality of hollow particles therefrom.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: January 30, 2001
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Mitsuo Hamada, Koichi Ozaki, Toyohiko Yamadera
  • Patent number: 5945043
    Abstract: Novel hollow silicone resin particles, having an average particle size of 0.1 to 100 .mu.m are disclosed. The silicone resin particles comprise a skin formed from thermoplastic silicone resin configured in the shape of a hollow capsule. The hollow thermoplastic silicone resin particles are prepared by spraying a dispersion of water and thermoplastic silicone resin dissolved in solvent into hot gas. The hot gas evaporates the solvent and water and at the same time causes solidification of the thermoplastic silicone resin while it is in the spray state, so as to form a plurality of hollow particles therefrom.
    Type: Grant
    Filed: July 14, 1997
    Date of Patent: August 31, 1999
    Assignee: Dow Corning Toray Silicone Co., Ltd.
    Inventors: Mitsuo Hamada, Koichi Ozaki, Toyohiko Yamadera
  • Patent number: 5725819
    Abstract: A plate for an IC card having recesses for mounting components is formed by injection molding of plastics. First, a mold for forming recesses for mounting components is formed to have a slide core. After molten resin is filled in a cavity, the slide core is forced to penetrate into the cavity. Thus, the molten resin is removed by the slide core so as to form the recesses and walls. Because the resin has been filled beforehand, even if the wall is thin, the filling process is carried out normally, and the walls can be formed without increasing an injection pressure.
    Type: Grant
    Filed: July 21, 1995
    Date of Patent: March 10, 1998
    Assignees: Hitachi Maxell, Ltd., Maxell Seiki, Ltd.
    Inventors: Masayoshi Onishi, Seiji Kegai, Koichi Ozaki, Kaname Tamada, Hiroyoshi Takagi