Patents by Inventor Koichiro Kawasaki
Koichiro Kawasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10601399Abstract: In an elastic wave filter apparatus, IDT electrodes and first and second electrode lands are provided on a first main surface of a piezoelectric substrate. The piezoelectric substrate, a supporting layer, and a covering member define a hollow portion. A signal terminal, a ground terminal, and a heat diffusion layer are provided on a second main surface of the piezoelectric substrate. The first and second electrode lands are electrically connected by first and second connection electrodes to the signal terminal and the ground terminal, respectively. The heat diffusion layer is provided at a position where the heat diffusion layer overlaps at least a portion of the IDT electrodes across the piezoelectric substrate.Type: GrantFiled: September 22, 2017Date of Patent: March 24, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koichiro Kawasaki, Taku Kikuchi
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Publication number: 20200067481Abstract: An electronic device includes a support layer is provided on a piezoelectric substrate and surrounds a functional element. A cover layer is located above the support layer, and faces the piezoelectric substrate. A protective layer seals the support layer and the cover layer. The support layer is provided on at least the outer periphery of the piezoelectric substrate, and defines a hollow portion within the outer periphery of the piezoelectric substrate. The protective layer includes a first portion above the hollow portion, a second portion above the support layer, and a curved surface that is convex in an opposite direction from the piezoelectric substrate.Type: ApplicationFiled: October 31, 2019Publication date: February 27, 2020Inventor: Koichiro KAWASAKI
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Publication number: 20200052676Abstract: An electronic component includes a piezoelectric substrate, a first functional element, a first wiring, insulating films, a first conductive film, and a first external connection terminal. The first functional element is disposed on the piezoelectric substrate. The first wiring is disposed on the piezoelectric substrate, and is electrically connected to the first functional element. The insulating films are disposed on the piezoelectric substrate, and define a first hollow portion in which the first functional element is included. The first conductive film is disposed on the insulating films, and has a portion that passes through the insulating films and is electrically connected to the first wiring. The first external connection terminal is provided on the first conductive film, and is disposed at a position overlapping at least a portion of the first functional element in a plan view as viewed in the thickness direction of the piezoelectric substrate.Type: ApplicationFiled: October 18, 2019Publication date: February 13, 2020Inventor: Koichiro KAWASAKI
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Publication number: 20200014369Abstract: A filter device includes a piezoelectric substrate, first and second functional elements provided on a surface of the piezoelectric substrate, a first conductive layer provided on the surface of the piezoelectric substrate, the first conductive layer connecting the first and second functional elements to each other, an insulating layer provided at least on the first conductive layer, a cover that faces the surface of the piezoelectric substrate, a support layer located between the surface of the piezoelectric substrate and the cover, the support layer defining hollow portions, in which the first and second functional elements are provided, between the piezoelectric substrate and the cover, and a first conductor that connects the insulating layer to the cover.Type: ApplicationFiled: September 18, 2019Publication date: January 9, 2020Inventor: Koichiro KAWASAKI
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Publication number: 20190356298Abstract: A surface acoustic wave device includes a piezoelectric substrate and functional elements on a first surface of the piezoelectric substrate. At least a portion of the functional elements includes an interdigital transducer (IDT) electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. A portion of a wiring pattern connecting a first functional element and a second functional element is on a second surface different from the first surface of the piezoelectric substrate.Type: ApplicationFiled: August 2, 2019Publication date: November 21, 2019Inventor: Koichiro KAWASAKI
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Publication number: 20190356299Abstract: A surface acoustic wave device includes a piezoelectric substrate, functional elements on the piezoelectric substrate, a cover portion that opposes the piezoelectric substrate with a support layer interposed therebetween, and an input/output terminal on the cover portion. At least a portion of the functional elements includes an interdigital transducer electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. The functional elements include a filter that passes a signal in a predetermined frequency band, and a cancel circuit which is connected in parallel to the filter and attenuates a signal outside the predetermined frequency band in signals output from the output terminal. A portion of a wiring pattern connecting a first functional element and a second functional element included in the plurality of functional elements is provided on the cover portion.Type: ApplicationFiled: August 2, 2019Publication date: November 21, 2019Inventor: Koichiro KAWASAKI
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Patent number: 10404226Abstract: A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.Type: GrantFiled: July 19, 2017Date of Patent: September 3, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Kitahara, Hiroaki Nakayama, Tsunekazu Saimei, Hiroki Noto, Koichiro Kawasaki
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Patent number: 10264677Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.Type: GrantFiled: June 1, 2017Date of Patent: April 16, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Koichiro Kawasaki, Taku Kikuchi, Takashi Kitahara, Hiroki Noto
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Patent number: 10243535Abstract: An electronic component includes first and second element substrates, first and second functional element portions, and a support layer that defines a first hollow space over a first functional electrode with the first and second element substrates. A second functional electrode is located on a first main surface of the second element substrate. The electronic component further includes a first conductive layer that is provided on a second main surface of the second element substrate and that is connected to ground potential. The first conductive layer opposes the first functional electrode in the first hollow space. The first conductive layer is overlapped with at least a portion of the first and second functional electrodes in a plan view.Type: GrantFiled: November 10, 2016Date of Patent: March 26, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Koichiro Kawasaki
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Patent number: 10177740Abstract: A ladder filter includes a piezoelectric substrate, an insulating film on the piezoelectric substrate, first and second electrodes provided on the piezoelectric substrate and including a pair of busbars and plurality of electrode fingers, a first line electrode at least a portion of which is defined by the busbar at one side of the first electrode, a second line electrode at least a portion of which is defined by the busbar at one side of the second electrode, and a third line electrode laminated on the second line electrode. The first line electrode and the second line electrode are electrically connected to different electric potentials. The first line electrode is separated from the second line electrode by a predetermined distance. At least a portion of the third line electrode is overlapped with at least a portion of the first line electrode with the insulating film interposed therebetween in a laminating direction.Type: GrantFiled: March 24, 2017Date of Patent: January 8, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Akira Michigami, Koichiro Kawasaki, Takuma Kuzushita
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Publication number: 20190007019Abstract: An elastic wave device includes an impedance matching element, a switch that switches a connection state between a first switch terminal connected to the impedance matching element and second switch terminals, multiplexers connected to the second switch terminals, a substrate, and at least one inductor on the substrate and has an inductance smaller than an inductance of the impedance matching element. At least one of the second switch terminals and at least one of the multiplexers are connected with the first inductor interposed therebetween.Type: ApplicationFiled: September 7, 2018Publication date: January 3, 2019Inventor: Koichiro KAWASAKI
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Publication number: 20180367122Abstract: In a filter device, a transversal elastic wave filter, which defines a delay element, is connected in parallel with a band pass filter. The transversal elastic wave filter has the same amplitude characteristic as and the opposite phase to the band pass filter at a desired frequency inside an attenuation range of the band pass filter. When a wavelength determined by an electrode finger period of IDTs and is denoted by ?, the distance between the first IDT and the second IDT of the elastic wave filter is about 12? or less.Type: ApplicationFiled: July 31, 2018Publication date: December 20, 2018Inventor: Koichiro KAWASAKI
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Patent number: 10128816Abstract: In a high frequency module, in addition to a main transmission path in which a high-frequency signal propagates in first filter elements, a sub transmission path is defined by inductive coupling or capacitive coupling between a first inductor and a matching element or by inductive coupling between the first inductor and a second inductor. The sub transmission path has different amplitude characteristics and phase characteristics from those of the main transmission path depending on a degree of the inductive coupling or capacitive coupling, and transmission characteristics as a high-frequency module are adjustable by adjusting the amplitude characteristics and the phase characteristics of the sub transmission path.Type: GrantFiled: July 8, 2016Date of Patent: November 13, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Morio Takeuchi, Koichiro Kawasaki, Yohei Konaka
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Patent number: 10063213Abstract: In a filter device, a transversal elastic wave filter, which defines a delay element, is connected in parallel with a band pass filter. The transversal elastic wave filter has the same amplitude characteristic as and the opposite phase to the band pass filter at a desired frequency inside an attenuation range of the band pass filter. When a wavelength determined by an electrode finger period of IDTs and is denoted by ?, the distance between the first IDT and the second IDT of the elastic wave filter is about 12? or less.Type: GrantFiled: March 8, 2017Date of Patent: August 28, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Koichiro Kawasaki
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Publication number: 20180013404Abstract: In an elastic wave filter apparatus, IDT electrodes and first and second electrode lands are provided on a first main surface of a piezoelectric substrate. The piezoelectric substrate, a supporting layer, and a covering member define a hollow portion. A signal terminal, a ground terminal, and a heat diffusion layer are provided on a second main surface of the piezoelectric substrate. The first and second electrode lands are electrically connected by first and second connection electrodes to the signal terminal and the ground terminal, respectively. The heat diffusion layer is provided at a position where the heat diffusion layer overlaps at least a portion of the IDT electrodes across the piezoelectric substrate.Type: ApplicationFiled: September 22, 2017Publication date: January 11, 2018Inventors: Koichiro KAWASAKI, Taku KIKUCHI
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Publication number: 20170317002Abstract: A power amplifier module includes a substrate, a power amplifier having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces a principal surface of the substrate, a surface acoustic wave duplexer having a first surface on which an electrode is defined and a second surface opposite the first surface, the first surface faces the principal surface of the substrate, a heat dissipation unit defined on another principal surface of the substrate, a heat dissipation path that connects a connecting portion between the power amplifier and the principal surface to the heat dissipation unit, an insulating resin that covers the power amplifier and the surface acoustic wave duplexer, a conductive shield that covers the insulating resin, and a first conductive unit defined on the second surface of the surface acoustic wave duplexer and electrically connected to the conductive shield.Type: ApplicationFiled: July 19, 2017Publication date: November 2, 2017Inventors: Takashi Kitahara, Hiroaki Nakayama, Tsunekazu Saimei, Hiroki Noto, Koichiro Kawasaki
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Publication number: 20170309679Abstract: A circuit module includes a mounting substrate including a conductor wiring, an elastic wave element provided in or on a main surface of the mounting substrate, an electric element provided in or on the main surface, the electric element being different from the elastic wave element, and an insulating resin portion provided in or on the main surface to cover the elastic wave element and the electric element. The elastic wave element and the electric element are connected to each other by the conductor wiring. A height of the elastic wave element is about 0.28 mm or less, which is less than that of the electric element. The thickness of the resin portion in a region in which the resin portion covers the elastic wave element is greater than the thickness of the resin portion in a region in which the resin portion covers the electric element.Type: ApplicationFiled: April 20, 2017Publication date: October 26, 2017Inventor: Koichiro KAWASAKI
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Publication number: 20170273183Abstract: An electronic component includes an electronic component element including first and second main surfaces, a heat-dissipation accelerating member on the first main surface, a sealing resin layer sealing the electronic component element, and a shielding member provided on the sealing resin layer and electrically connected to the heat-dissipation accelerating member. The heat-dissipation accelerating member includes fourth and fifth main surfaces. The electronic component includes a connecting member disposed on the fifth main surface of the heat-dissipation accelerating member and electrically connecting at least one portion of the heat-dissipation accelerating member and the shielding member. The connecting member has a higher thermal conductivity than the sealing resin layer. The contact area between the heat-dissipation accelerating member and the connecting member is smaller than the area of the fifth main surface.Type: ApplicationFiled: June 1, 2017Publication date: September 21, 2017Inventors: Koichiro KAWASAKI, Taku KIKUCHI, Takashi KITAHARA, Hiroki NOTO
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Publication number: 20170194938Abstract: A ladder filter includes a piezoelectric substrate, an insulating film on the piezoelectric substrate, first and second electrodes provided on the piezoelectric substrate and including a pair of busbars and plurality of electrode fingers, a first line electrode at least a portion of which is defined by the busbar at one side of the first electrode, a second line electrode at least a portion of which is defined by the busbar at one side of the second electrode, and a third line electrode laminated on the second line electrode. The first line electrode and the second line electrode are electrically connected to different electric potentials. The first line electrode is separated from the second line electrode by a predetermined distance. At least a portion of the third line electrode is overlapped with at least a portion of the first line electrode with the insulating film interposed therebetween in a laminating direction.Type: ApplicationFiled: March 24, 2017Publication date: July 6, 2017Inventors: Akira MICHIGAMI, Koichiro KAWASAKI, Takuma KUZUSHITA
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Publication number: 20170179920Abstract: An electronic component includes first and second element substrates, first and second functional element portions, and a support layer that defines a first hollow space over a first functional electrode with the first and second element substrates. A second functional electrode is located on a first main surface of the second element substrate. The electronic component further includes a first conductive layer that is provided on a second main surface of the second element substrate and that is connected to ground potential. The first conductive layer opposes the first functional electrode in the first hollow space. The first conductive layer is overlapped with at least a portion of the first and second functional electrodes in a plan view.Type: ApplicationFiled: November 10, 2016Publication date: June 22, 2017Inventor: Koichiro KAWASAKI