Abstract: There are provided a resin composition for a solder resist, a solder resist film, and a circuit board that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for a solder resist according to an embodiment of the present invention contains a thermosetting resin, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contained in the resin composition for a solder resist in an amount of 1% by weight to 50% by weight.

Abstract: There is provided hollow resin particles used in a resin composition for semiconductor members, which can be used in a resin composition for semiconductor members to provide a semiconductor member capable of exerting excellent low dielectric properties. The hollow resin particles used in a resin composition for semiconductor members according to an embodiment of the present invention are hollow resin particles having a hole part inside the particle, wherein a decreasing rate of a relative dielectric constant Dk1 of a film (F1) formulated with 80 parts by weight of polyimide and 20 parts by weight of the hollow resin particles to a relative dielectric constant Dk0 of a film (F0) formed with only the polyimide is 3% or more.

Abstract: There are provided a laminate and the like and a circuit board including the same that exhibit an excellent low dielectric property by a non-conventional new approach. The laminate according to an embodiment of the present invention is a laminate used for a core layer of a circuit board, in which the laminate does not include a buildup layer, the laminate is obtained by laminating a plurality of prepregs including a fiber base material layer and a resin layer (A) so that the prepregs are in direct contact with each other, the resin layer (A) contains an inorganic filler and hollow resin particles, and the hollow resin particles are contained in the resin layer (A) in an amount of 1% by weight to 50% by weight with respect to the total amount of the resin layer (A).

Abstract: There are provided a resin composition for semiconductor sealing, an underfill, a mold resin, and a semiconductor package that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for semiconductor sealing according to an embodiment of the present invention is a resin composition for semiconductor sealing containing a thermosetting resin, a curing agent, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contained in the resin composition for semiconductor sealing in an amount of 1% by weight to 50% by weight.

Abstract: A hydrogel has water, a polyvinylsulfonic acid-based polymer, and a polymer matrix containing the water and the polyvinylsulfonic acid-based polymer, in which the polymer matrix contains a copolymer of a monofunctional monomer having one ethylenically unsaturated group and a polyfunctional monomer having 2 to 6 ethylenically unsaturated groups, the copolymer has a hydrophilic group binding to its main chain, the polymer matrix is contained in an amount of 2 to 80 parts by mass in 100 parts by mass of the hydrogel, a polymer derived from the polyfunctional monomer is contained in a proportion of 0.1 to 5 parts by mass in 100 parts by mass of the copolymer, the polyvinylsulfonic acid-based polymer is contained in an amount of 0.1 to 150 parts by mass in 100 parts by mass of the polymer matrix, and the polyvinylsulfonic acid-based polymer has a weight average molecular weight of 200,000 to 3,000,000.

Abstract: A switching element that has reduced switching voltage and leakage current and that demonstrates high reliability and low power consumption is achieved as a result of comprising: a first insulation layer in which first wiring mainly consisting of copper is embedded in a first wiring groove that opens upward; a second insulation layer which is formed on an upper surface of the first insulation layer and the first wiring and has an opening that reaches the first insulation layer and the first wiring; a first electrode which is the portion of the first wiring that is exposed from the opening; an oxygen supply layer which is formed on an upper surface of the second insulation layer, generates oxygen plasma during etching to form the opening in the second insulation layer, and remains at least in the vicinity of the opening of the upper surface of the second insulation layer; an ion conducting layer which is formed on the upper surface of the first insulation layer and the first electrode that are exposed from the

Abstract: The present invention relates to a hydrogel and use thereof. More specifically, the present invention relates to a hydrogel comprising water and a polymer matrix, wherein the polymer matrix comprises a copolymer of a monofunctional monomer having a hydrophilic group and one ethylenic unsaturated group, and a polyfunctional monomer having no ester bond, and having an amide group and 3 to 6 ethylenic unsaturated groups, 40 to 95 parts by mass of the water, and 5 to 60 parts by mass of the polymer matrix are contained in 100 parts by mass of the hydrogel, and the hydrogel shows a swelling degree of 650% or less, when the hydrogel is immersed in a 4M aqueous KOH solution under a temperature of 25° C. for 14 days, and use thereof.

Abstract: A hydrogel has water, a polyvinylsulfonic acid-based polymer, and a polymer matrix containing the water and the polyvinylsulfonic acid-based polymer, in which the polymer matrix contains a copolymer of a monofunctional monomer having one ethylenically unsaturated group and a polyfunctional monomer having 2 to 6 ethylenically unsaturated groups, the copolymer has a hydrophilic group binding to its main chain, the polymer matrix is contained in an amount of 2 to 80 parts by mass in 100 parts by mass of the hydrogel, a polymer derived from the polyfunctional monomer is contained in a proportion of 0.1 to 5 parts by mass in 100 parts by mass of the copolymer, the polyvinylsulfonic acid-based polymer is contained in an amount of 0.1 to 150 parts by mass in 100 parts by mass of the polymer matrix, and the polyvinylsulfonic acid-based polymer has a weight average molecular weight of 200,000 to 3,000,000.

Abstract: In switching elements each using a two-terminal-type variable resistance element, improper writing or any improper operation is often caused and the reliability of the switching elements cannot be improved easily. A switching element according to the present invention is equipped with a first variable resistance element equipped with a first input/output terminal and a first connection terminal, a second variable resistance element equipped with a second input/output terminal and a second connection terminal, and a rectifying element equipped with a control terminal and a third connection terminal, wherein the first connection terminal, the second connection terminal and the third connection terminal are connected to one another.

Abstract: In order to improve the number rewrites by improving the dielectric breakdown resistance of an ion conducting layer in a variable resistance element, this variable resistance element is provided with: a first electrode that contains at least copper; a second electrode that contains at least Ru, nitrogen and a first metal; and an ion conducting layer that is positioned between the first electrode and the second electrode.

Abstract: An expandable panel reinforcing material, including an expandable composition layer including at least a plastic component of a crosslinked polymer matrix having curability, a curing agent of the plastic component, a curing accelerator of the plastic component, a crosslinked polymer matrix, a filler, and a thermally decomposable blowing agent having a decomposition temperature of T° C., and a sheet-like fiber layer that is laminated on the expandable composition layer, in which the expandable composition layer exhibits a storage elastic modulus (G?) of 1×101 to 1×104 Pa when the storage elastic modulus (G?) is measured with a dynamic viscoelasticity measuring apparatus [provided that a measuring temperature is (T?10)° C.].

Abstract: A tacky gel sheet having adhesive uses, comprising an organogel having tackiness before curing and having adhesiveness after curing to an adherend, in which the organogel (i) comprises a polymer matrix including a (meth)acrylate-based resin, a plasticizing component having curability, and a curing agent having reactivity with the plasticizing component, and (ii) (1) has a viscoelastic property expressed by a storage modulus of 1.0×103 to 5.0×104 Pa and a loss factor of 0.01 to 2 (at a frequency of 0.01 Hz and at 23° C.), and a storage modulus of 1.0×104 to 1.0×107 Pa and a loss factor of 0.01 to 2 (at a frequency of 100 Hz and at 23° C.) and (2) has a tacking force of 0.01 to 0.15 N/mm2 (at 23° C.) before curing, a tensile shear adhesion strength of 3 N/mm2 or more (at 23° C.) and a tensile adhesion strength of 1 N/mm2 or more (at 23° C.) after curing.

Abstract: A metal panel reinforcing material comprising a resin composition, including a plastic component that has at least curability and is for a crosslinked polymer matrix, a curing agent for the plastic component, a curing accelerator for the plastic component, and a crosslinked polymer matrix, and a sheet-like fiber substrate, in which when the metal panel reinforcing material is stuck to a metal panel having a thickness of 0.8 mm and heated to be integrated into a reinforced metal panel, the metal panel reinforcing material exhibits the following properties to said metal panel: in three-point bending measured at a span of 100 mm, (i) a strength improvement rate of strength at 1 mm displacement is 120% or more, (ii) a maximum strength improvement rate is 200% or more, and (iii) a strain energy up to a maximum point is 0.5 N·m or more.

Abstract: A hydrogel comprising water, a gel strength improving agent, and a polymer matrix containing the water and the gel strength improving agent, in which the polymer matrix includes a copolymer of a monofunctional monomer having one ethylenically unsaturated group and a polyfunctional monomer having 2 to 6 ethylenically unsaturated groups, the copolymer has a hydrophilic group binding to its main chain, and the hydrogel has a breaking strength of 5 kPa or more and a breaking elongation of 200% or more in a tensile test.

Abstract: In order to improve the number rewrites by improving the dielectric breakdown resistance of an ion conducting layer in a variable resistance element, this variable resistance element is provided with: a first electrode that contains at least copper; a second electrode that contains at least Ru, nitrogen and a first metal; and an ion conducting layer that is positioned between the first electrode and the second electrode.

Abstract: A process for producing resin particles includes a step in which a polymerizable mixture including a polymerizable monomer including at least one of a styrene-based monomer and a (meth)acrylic-based monomer, and a polymerization initiator is absorbed into seed particles in an aqueous medium, without using a dispersant, in the presence of an anionic surfactant not having a polyoxyethylene chain but having an alkyl group; and a step in which the polymerizable monomer is polymerized in an aqueous medium, without using a dispersant, in the presence of an anionic surfactant having a polyoxyethylene chain to thereby obtain resin particles. The resin particles include a resin derived from a polymerizable monomer including at least one of a styrene-based monomer and a (meth)acrylic-based monomer. The proportion by number of particles having a particle diameter in the range of from 80 to 120% of the volume-average particle diameter is 85% or more.

Abstract: Disclosed are porous resin particles which contain a polymer of a monomer mixture containing, as monomers, at least a monofunctional (meth)acrylic acid ester and a crosslinking monomer. The monofunctional (meth)acrylic acid ester accounts for 1 wt % to 50 wt % of the monomer mixture, and the crosslinking monomer accounts for 50 wt % to 99 wt % of the monomer mixture. The porous resin particles have a specific surface area of 190 m2/g to 300 m2/g and a bulk specific gravity of 0.25 g/mL to 0.45 g/mL.

Abstract: Provided is a nonvolatile switching element which has high retention ability even if programmed at a low current, while being suppressed in dielectric breakdown of a variable resistance layer during a reset operation. This switching element is provided with: a first electrode; a second electrode; and a variable resistance layer that is arranged between the first electrode and the second electrode and has ion conductivity. The first electrode contains a metal which generates metal ions that can be conducted in the variable resistance layer. The second electrode is provided with: a first electrode layer that is formed in contact with the variable resistance layer; and a second electrode layer that is formed in contact with the first electrode layer. The first electrode layer is formed of a ruthenium alloy that contains ruthenium and a first metal having a larger standard Gibbs energy of formation of oxide than ruthenium in the negative direction.

Abstract: The present invention addresses the problem of inhibiting the evolution of a poisoning gas to eliminate wiring-pattern resolution failures and thereby forming a desired wiring layer structure to provide functional elements having an improved property yield. This method for forming multi-layered copper interconnect on a semiconductor substrate comprises: forming a multilayer resist structure to form a given resist pattern on a substrate including an interlayer dielectric film that has via holes which have been formed in part thereof and filled with an SOC layer, the multilayer resist structure comprising an SOC layer, an SOG layer, an SiO2 layer, and a chemical amplification type resist superposed in this order from the substrate side; conducting etching using the resist pattern as a mask to form a pattern for a wiring layer and via plugs; and forming the wiring layer and the via plugs in the pattern.

Abstract: A resistance changing element according to the present invention comprises a first electrode (101) and a second electrode (103); and an ion conducting layer (102) that is formed between the first electrode (101) and the second electrode (103) and that contains at least oxygen and carbon.